Nanodevices and Microsystems

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New 2.5D neuromorphic discovery platform will enable AI-enhanced co-design 
News Article, June 7, 2023 • AI-enhanced co-design will be enabled through Sandia’s 2.5D neuromorphic discovery platform. Novel material and device concepts previously took years for iteration. Discoveries in this LDRD project will now allow them to be iterated on in weeks thanks to a new easy fabrication substrate platform for novel devices. The team designed...
A segmented graphic design showing six elements of Sandia’s 2.5D neuromorphic discovery platform.

New technology for heterogeneously integrated devices allows for underfilling of complex geometries using driven fluids 
News Article, June 7, 2023 • Underfilling is a widely used manufacturing process that helps stabilize and reinforce solder joints in electronic parts. However, heterogeneously integrated (HI) devices are challenging to underfill using standard capillary flow methods, due to large areas with narrow gaps—trenches that act as strong flow barriers, and high bump density that cause...