Publications

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For enhanced or Engineered Geothermal Systems (EGS) geothermal brine is pumped to the surface via the production wells, the heat extracted to turn a turbine to generate electricity, and the spent brine re-injected via injection wells back underground. If designed properly, the subsurface rock formations will lead this water back to the extraction well as heated brine. Proper monitoring of these geothermal reservoirs is essential for developing and maintaining the necessary level of productivity of the field. Chemical tracers are commonly used to characterize the fracture network and determine the connectivity between the injection and production wells. Currently, most tracer experiments involve injecting the tracer at the injection well, manually collecting liquid samples at the wellhead of the production well, and sending the samples off for laboratory analysis. While this method provides accurate tracer concentration data at very low levels of detection, it does not provide information regarding the location of the fractures which were conducting the tracer between wellbores. Sandia is developing a high-temperature electrochemical sensor capable of measuring tracer concentrations and pH downhole on a wireline tool. The goal of this effort is to collect real-time pH and ionic tracer concentration data at temperatures up to 225 °C and pressures up to 3000 psi. In this paper, a prototype electrochemical sensor and the initial data obtained will be presented detailing the measurement of iodide tracer concentrations at high temperature and pressure in a newly developed laboratory scale autoclave. © 2014 SPIE.

Chemical tracers are commonly used to characterize the fracture network and determine the connectivity between the injection and production wells. Currently, most tracer experiments involve injecting the tracer at the injection well, manually collecting liquid samples at the wellhead of the production well, and sending the samples off for laboratory analysis. While this method provides accurate tracer concentration data at very low levels of detection, it does not provide information regarding the depth of the fractures which were conducting the tracer between wellbores. Sandia is developing a high-temperature electrochemical sensor capable of measuring ionic tracer concentration and pH downhole on a wireline tool. The goal of this effort is to collect real-time pH and ionic tracer concentration data at temperatures up to 225 °C and pressures up to 3000 psi. In this paper, a prototype electrochemical sensor and the initial data obtained will be presented detailing the measurement of iodide tracer concentrations at high temperature and pressure in a newly developed laboratory scale autoclave. Efforts to expand this tool to measure lithium, cesium, and fluoride ion tracers will be discussed as well.

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Tin (Sn) whiskers are conductive Sn filaments that grow from Sn-plated surfaces, such as surface finishes on electronic packages. The phenomenon of Sn whiskering has become a concern in recent years due to requirements for lead (Pb)-free soldering and surface finishes in commercial electronics. Pure Sn finishes are more prone to whisker growth than their Sn-Pb counterparts and high profile failures due to whisker formation (causing short circuits) in space applications have been documented. At Sandia, Sn whiskers are of interest due to increased use of Pb-free commercial off-the-shelf (COTS) parts and possible future requirements for Pb-free solders and surface finishes in high-reliability microelectronics. Lead-free solders and surface finishes are currently being used or considered for several Sandia applications. Despite the long history of Sn whisker research and the recently renewed interest in this topic, a comprehensive understanding of whisker growth remains elusive. This report describes recent research on characterization of Sn whiskers with the aim of understanding the underlying whisker growth mechanism(s). The report is divided into four sections and an Appendix. In Section 1, the Sn plating process is summarized. Specifically, the Sn plating parameters that were successful in producing samples with whiskers will be reviewed. In Section 2, the scanning electron microscopy (SEM) of Sn whiskers and time-lapse SEM studies of whisker growth will be discussed. This discussion includes the characterization of straight as well as kinked whiskers. In Section 3, a detailed discussion is given of SEM/EBSD (electron backscatter diffraction) techniques developed to determine the crystallography of Sn whiskers. In Section 4, these SEM/EBSD methods are employed to determine the crystallography of Sn whiskers, with a statistically significant number of whiskers analyzed. This is the largest study of Sn whisker crystallography ever reported. This section includes a review of previous literature on Sn whisker crystallography. The overall texture of the Sn films was also analyzed by EBSD. Finally, a short Appendix is included at the end of this report, in which the X-Ray diffraction (XRD) results are discussed and compared to the EBSD analyses of the overall textures of the Sn films. Sections 2, 3, and 4 have been or will be submitted as stand-alone papers in peer-reviewed technical journals. A bibliography of recent Sandia Sn whisker publications and presentations is included at the end of the report.

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