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Fully integrated switchable filter banks

IEEE MTT-S International Microwave Symposium Digest

Crespin, Emily R.; Olsson, Roy H.; Wojciechowski, Kenneth W.; Branch, Darren W.; Clews, Peggy J.; Hurley, Richard B.; Gutierrez, J.

Fully integrated switchable filter have been successfully demonstrated using a ra CMOS SOI process in conjunction with an a (AlN) microresonator process. Single pole-mul were developed in the CMOS SOI process th multi-project wafer runs while the filters were aluminum nitride based microresonators. Each concurrent design cycles and was demonstrated to integration. After design improvements to bo full monolithic integration was implem microresonator filters with the CMOS switc compatibility of the two technologies. A four ch switchable bank of 7MHz bandwidth filters demonstrated exhibiting approximately 8 dB of 60dB of stop band rejection. © 2012 IEEE.

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TYPE Conference YEAR 2012
ScopusOSTI

Chip scale mechanical spectrum analyzers based on high quality factor overmoded bulk acouslic wave resonators

Olsson, Roy H.

The goal of this project was to develop high frequency quality factor (fQ) product acoustic resonators matched to a standard RF impedance of 50 {Omega} using overmoded bulk acoustic wave (BAW) resonators. These resonators are intended to serve as filters in a chip scale mechanical RF spectrum analyzer. Under this program different BAW resonator designs and materials were studied theoretically and experimentally. The effort resulted in a 3 GHz, 50 {Omega}, sapphire overmoded BAW with a fQ product of 8 x 10{sup 13}, among the highest values ever reported for an acoustic resonator.

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TYPE Presentation YEAR 2012
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Phonon manipulation with phononic crystals

Olsson, Roy H.; Kim, Bongsang K.; Reinke, Charles M.

In this work, we demonstrated engineered modification of propagation of thermal phonons, i.e. at THz frequencies, using phononic crystals. This work combined theoretical work at Sandia National Laboratories, the University of New Mexico, the University of Colorado Boulder, and Carnegie Mellon University; the MESA fabrication facilities at Sandia; and the microfabrication facilities at UNM to produce world-leading control of phonon propagation in silicon at frequencies up to 3 THz. These efforts culminated in a dramatic reduction in the thermal conductivity of silicon using phononic crystals by a factor of almost 30 as compared with the bulk value, and about 6 as compared with an unpatterned slab of the same thickness. This work represents a revolutionary advance in the engineering of thermoelectric materials for optimal, high-ZT performance. We have demonstrated the significant reduction of the thermal conductivity of silicon using phononic crystal structuring using MEMS-compatible fabrication techniques and in a planar platform that is amenable to integration with typical microelectronic systems. The measured reduction in thermal conductivity as compared to bulk silicon was about a factor of 20 in the cross-plane direction [26], and a factor of 6 in the in-plane direction. Since the electrical conductivity was only reduced by a corresponding factor of about 3 due to the removal of conductive material (i.e., porosity), and the Seebeck coefficient should remain constant as an intrinsic material property, this corresponds to an effective enhancement in ZT by a factor of 2. Given the number of papers in literature devoted to only a small, incremental change in ZT, the ability to boost the ZT of a material by a factor of 2 simply by reducing thermal conductivity is groundbreaking. The results in this work were obtained using silicon, a material that has benefitted from enormous interest in the microelectronics industry and that has a fairly large thermoelectric power factor. In addition, the techniques and scientific understanding developed in the research can be applied to a wide range of materials, with the caveat that the thermal conductivity of such a material be dominated by phonon, rather than electron, transport. In particular, this includes several thermoelectric materials with attractive properties at elevated temperatures (i.e., greater than room temperature), such as silicon germanium and silicon carbide. It is reasonable that phononic crystal patterning could be used for high-temperature thermoelectric devices using such materials, with applications in energy scavenging via waste-heat recovery and thermoelectric cooling for high-performance microelectronic circuits. The only part of the ZT picture missing in this work was the experimental measurement of the Seebeck coefficient of our phononic crystal devices. While a first-order approximation indicates that the Seebeck coefficient should not change significantly from that of bulk silicon, we were not able to actually verify this assumption within the timeframe of the project. Additionally, with regards to future high-temperature applications of this technology, we plan to measure the thermal conductivity reduction factor of our phononic crystals as elevated temperatures to confirm that it does not diminish, given that the nominal thermal conductivity of most semiconductors, including silicon, decreases with temperature above room temperature. We hope to have the opportunity to address these concerns and further advance the state-of-the-art of thermoelectric materials in future projects.

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TYPE SAND Report YEAR 2012
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Thermal conductivity manipulation in lithographically patterned single crystal silicon phononic crystal structures

IEEE International Ultrasonics Symposium, IUS

Kim, Bongsang; Nguyen, Janet; Reinke, Charles M.; Shaner, Eric A.; Harris, Charles T.; El-Kady, I.; Olsson, Roy H.

The thermal conductivity of single crystal silicon was engineered using lithographically formed phononic crystals. Specifically, sub-micron periodic through-holes were patterned in 500nm-thick silicon membranes to construct phononic crystals, and through phonon scattering enhancement, heat transfer was significantly reduced. The thermal conductivity of silicon phononic crystals was measured as low as 32.6W/mK, which is a ∼75% reduction compared to bulk silicon thermal conductivity [1]. This corresponds to a 37% reduction even after taking into account the contributions of the thin-film and volume reduction effects, while the electrical conductivity was reduced only by as much as the volume reduction effect. The demonstrated method uses conventional lithography-based technologies that are directly applicable to diverse micro/nano-scale devices, leading toward huge performance improvements where heat management is important. © 2011 IEEE.

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TYPE Conference YEAR 2011
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Results 26–50 of 119
Results 26–50 of 119