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A reliability and availability sensitivity study of a large photovoltaic system

Collins, Elmer W.; Mundt, Michael J.; Stein, Joshua S.; Sorensen, Neil R.; Granata, Jennifer E.; Quintana, Michael A.

A reliability and availability model has been developed for a portion of the 4.6 megawatt (MWdc) photovoltaic system operated by Tucson Electric Power (TEP) at Springerville, Arizona using a commercially available software tool, GoldSim{trademark}. This reliability model has been populated with life distributions and repair distributions derived from data accumulated during five years of operation of this system. This reliability and availability model was incorporated into another model that simulated daily and seasonal solar irradiance and photovoltaic module performance. The resulting combined model allows prediction of kilowatt hour (kWh) energy output of the system based on availability of components of the system, solar irradiance, and module and inverter performance. This model was then used to study the sensitivity of energy output as a function of photovoltaic (PV) module degradation at different rates and the effect of location (solar irradiance). Plots of cumulative energy output versus time for a 30 year period are provided for each of these cases.

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TYPE Conference YEAR 2010
OSTI

Fatigue behavior of thin Cu foils and Cu/Kapton flexible circuits

Materials Science and Technology Conference and Exhibition, MS and T'08

Beck, David F.; Susan, D.F.; Sorensen, Neil R.; Thayer, Gayle E.

A series of thin electrodeposited Cu foils and Cu foil/Kapton flex circuits were tested in bending fatigue according to ASTM E796 and IPC-TM-650. The fatigue behavior was analyzed in terms of strain vs. number of cycles to failure, using a Coffin-Manson approach. The effects of Cu foil thickness and Cu trace width are discussed. The Cu foils performed as expected and the Cu foil/Kapton® (E.I. du Pont de Nemours and Company, Wilmington, DE) composites showed significant improvement in fatigue lifetime due to the composite strengthening effect of the Kapton layers. However, the flex circuits showed more scatter in fatigue life based on electrical continuity. The effect of the Kapton layers manifests itself by significantly more widespread microcracking in the Cu traces and the extent of microcracking depended on the strain level. *Sandia is a multiprogram laboratory operated by Sandia Corporation, a Lockheed Martin Company, for the United States Department of Energy's National Nuclear Security Administration under contract DE-AC04-94AL85000. © 2008 MS&T'08 ®.

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TYPE Conference YEAR 2008
ScopusOSTI

Modeling pore corrosion in normally open gold- plated copper connectors

Moffat, Harry K.; Sun, Amy C.; Enos, David E.; Serna, Lysle M.; Sorensen, Neil R.; Battaile, Corbett C.

The goal of this study is to model the electrical response of gold plated copper electrical contacts exposed to a mixed flowing gas stream consisting of air containing 10 ppb H{sub 2}S at 30 C and a relative humidity of 70%. This environment accelerates the attack normally observed in a light industrial environment (essentially a simplified version of the Battelle Class 2 environment). Corrosion rates were quantified by measuring the corrosion site density, size distribution, and the macroscopic electrical resistance of the aged surface as a function of exposure time. A pore corrosion numerical model was used to predict both the growth of copper sulfide corrosion product which blooms through defects in the gold layer and the resulting electrical contact resistance of the aged surface. Assumptions about the distribution of defects in the noble metal plating and the mechanism for how corrosion blooms affect electrical contact resistance were needed to complete the numerical model. Comparisons are made to the experimentally observed number density of corrosion sites, the size distribution of corrosion product blooms, and the cumulative probability distribution of the electrical contact resistance. Experimentally, the bloom site density increases as a function of time, whereas the bloom size distribution remains relatively independent of time. These two effects are included in the numerical model by adding a corrosion initiation probability proportional to the surface area along with a probability for bloom-growth extinction proportional to the corrosion product bloom volume. The cumulative probability distribution of electrical resistance becomes skewed as exposure time increases. While the electrical contact resistance increases as a function of time for a fraction of the bloom population, the median value remains relatively unchanged. In order to model this behavior, the resistance calculated for large blooms has been weighted more heavily.

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TYPE SAND Report YEAR 2008
OSTIDOI

Failure analysis for the dual input quad NAND gate CD4011 under dormant storage conditions

Sorensen, Neil R.

Several groups of plastic molded CD4011s were electrically tested as part of an Army dormant storage program. These parts had been in storage in missile containers for 4.5 years, and were electrically tested annually. Eight of the parts (out of 1200) failed the electrical tests and were subsequently analyzed to determine the cause of the failures. The root cause was found to be corrosion of the unpassivated Al bondpads. No significant attack of the passivated Al traces was found. Seven of the eight failures occurred in parts stored on a pre-position ship (the Jeb Stuart), suggesting a link between the external environment and observed corrosion.

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TYPE SAND Report YEAR 2007
OSTIDOI

An investigation of corrosion in semiconductor bridge explosive devices

Sorensen, Neil R.; Klassen, Sandra E.

In the course of a failure investigation, corrosion of the lands was occasionally found in developmental lots of semiconductor bridge (SCB) detonators and igniters. Evidence was found in both detonators and igniters of the gold layer being deposited on top of a corroded aluminum layer, but inspection of additional dies from the same wafer did not reveal any more corroded parts. In some detonators, evidence was found that corrosion of the aluminum layer also happened after the gold was deposited. Moisture and chloride must both be present for aluminum to corrode. A likely source for chloride is the adhesive used to bond the die to the header. Inspection of other SCB devices, both recently manufactured and manufactured about ten years ago, found no evidence for corrosion even in devices that contained SCBs with aluminum lands and no gold. Several manufacturing defects were noted such as stains, gouges in the gold layer due to tooling, and porosity of the gold layer. Results of atmospheric corrosion experiments confirmed that devices with a porous gold layer over the aluminum layer are susceptible to extensive corrosion when both moisture and chlorine are present. The extent of corrosion depends on the level of chlorine contamination, and corrosion did not occur when only moisture was present. Elimination of the gold plating on the lands eliminated corrosion of the lands in these experiments. Some questions remain unanswered, but enough information was gathered to recommend changes to materials and procedures. A second lot of detonators was successfully built using aluminum SCBs, limiting the use of Ablebond{trademark} adhesive, increasing the rigor in controlling exposure to moisture, and adding inspection steps.

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TYPE SAND Report YEAR 2007
OSTIDOI
Results 26–50 of 63
Results 26–50 of 63