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Photoelectronic characterization of heterointerfaces

Brumbach, Michael T.

In many devices such as solar cells, light emitting diodes, transistors, etc., the performance relies on the electronic structure at interfaces between materials within the device. The objective of this work was to perform robust characterization of hybrid (organic/inorganic) interfaces by tailoring the interfacial region for photoelectron spectroscopy. Self-assembled monolayers (SAM) were utilized to induce dipoles of various magnitudes at the interface. Additionally, SAMs of molecules with varying dipolar characteristics were mixed into spatially organized structures to systematically vary the apparent work function. Polymer thin films were characterized by depositing films of varying thicknesses on numerous substrates with and without interfacial modifications. Hard X-ray photoelectron spectroscopy (HAXPES) was performed to evaluate a buried interface between indium tin oxide (ITO), treated under various conditions, and poly(3-hexylthiophene) (P3HT). Conducting polymer films were found to be sufficiently conducting such that no significant charge redistribution in the polymer films was observed. Consequently, a further departure from uniform substrates was taken whereby electrically disconnected regions of the substrate presented ideally insulating interfacial contacts. In order to accomplish this novel strategy, interdigitated electrodes were used as the substrate. Conducting fingers of one half of the electrodes were electrically grounded while the other set of electrodes were electronically floating. This allowed for the evaluation of substrate charging on photoelectron spectra (SCOPES) in the presence of overlying semiconducting thin films. Such an experiment has never before been reported. This concept was developed out of the previous experiments on interfacial modification and thin film depositions and presents new opportunities for understanding chemical and electronic changes in a multitude of materials and interfaces.

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TYPE SAND Report YEAR 2012
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Evaluation of the residue from microset on various metal surfaces

Brumbach, Michael T.

Fast-curing impression materials are sometimes used to cast negative-mold replications of physical defects on material surfaces. The negative-mold impressions can then be used for further measurements to record the nature of the defect. These impression materials have been designed to cure quickly, and with very low adhesion, so that they can be easily removed from the surface leaving little residual contamination. Unfortunately, some contaminant is retained by the substrate material. This investigation seeks to identify the composition and quantity of the remaining material upon removal of Microset Synthetic Rubber Replicating Compound from several material surfaces. Coe-Flex was used as a relative comparison to Microset. On fifteen different substrate materials the Microset leaves no visible trace of contaminant, however, X-ray photoelectron spectroscopy shows evidence of a thin silicone-based contaminant film of approximately 2 nm thickness.

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TYPE SAND Report YEAR 2011
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Results 126–150 of 163
Results 126–150 of 163