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Slow detrapping transients due to gate and drain bias stress in high breakdown voltage AlGaN/GaN HEMTs

IEEE Transactions on Electron Devices

Dasgupta, Sandeepan; Sun, Min; Armstrong, Andrew A.; Kaplar, Robert K.; Marinella, Matthew J.; Stanley, James B.; Atcitty, Stanley A.; Palacios, Tomas

Charge trapping and slow (from 10 s to > 1000 s) detrapping in AlGaN/GaN high electron mobility transistors (HEMTs) designed for high breakdown voltages (> 1500 V) is studied through a combination of electrical, thermal, and optical methods to identify the impact of Al molefraction and passivation on trapping. Trapping due to 5-10 V drain bias stress in the on-state (V gs = 0) is found to have significantly slower recovery, compared with trapping in the off-state (V gs < V th, V ds = 0). Two different trapping components, i.e., TG1 (E a = 0.6 eV) and TG2 (with negligible temperature dependence), in AlGaN dominate under gate bias stress in the off-state. Al 0.15 Ga 0.85N shows much more vulnerability to trapping under gate stress in the absence of passivation than does AlGaN with a higher Al mole fraction. Under large drain bias, trapping is dominated by a much deeper trap TD. Detrapping under monochromatic light shows TD to have E a ≈ 1.65 eV. Carbon doping in the buffer is shown to introduce threshold voltage shifts, unlike any of the other traps. © 2012 IEEE.

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PV inverter performance and reliability: What is the role of the bus capacitor?

IEEE Journal of Photovoltaics

Kaplar, Robert K.; Marinella, Matthew J.; Granata, Jennifer E.

In order to elucidate how the degradation of individual components affects the state of the photovoltaic inverter as a whole, we have carried out SPICE simulations to investigate the voltage and current ripple on the DC bus. The bus capacitor is generally considered to be among the least reliable components of the system, so we have simulated how the degradation of bus capacitors affects the AC ripple at the terminals of the PV module. Degradation-induced ripple leads to an increased degradation rate in a positive feedback cycle. Additionally, laboratory experiments are being carried out to ascertain the reliability of metallized thin film capacitors. By understanding the degradation mechanisms and their effects on the inverter as a system, steps can be made to more effectively replace marginal components with more reliable ones, increasing the lifetime and efficiency of the inverter and decreasing its cost per watt towards the US Department of Energy goals.

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Sub-bandgap light-induced carrier generation at room temperature in silicon carbide MOS capacitors

Materials Science Forum

DasGupta, Sandeepan D.; Armstrong, Andrew A.; Kaplar, Robert K.; Marinella, Matthew J.; Brock, Reinhard; Smith, Mark A.; Atcitty, Stanley A.

Carrier generation characteristics in n-type substrate SiC MOS capacitors induced by sub-bandgap energy light are reported. The generation rate is high enough to create an inversion layer in ∼20 minutes with monochromatic light (front side illumination) of energy 2.1 eV (intensity ∼5×10 16 cm-2s-1) in 4H-SiC for electric fields smaller than 1 MV/cm. Generation and recovery results strongly indicate involvement of a metastable defect whose efficiency as a generation center increases under hole-rich and decreases under electron-rich conditions. The generation dependence on bias history and light energy shows the defect to have properties consistent with the metastable silicon vacancy / carbon vacancy-antisite complex (VSi/Vc-CSi). © (2012) Trans Tech Publications.

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Gap analysis towards a design qualification standard development for grid-connected photovoltaic inverters

Conference Record of the IEEE Photovoltaic Specialists Conference

Venkataramanan, Sai B.; Ayyanar, Raja; Maracas, George; Tamizhmani, Govindasamy; Marinella, Matthew J.; Granata, Jennifer E.

A dedicated design qualification standard for PV inverters does not exist. Development of a well-accepted design qualification standard, specifically for PV inverters will significantly improve the reliability and performance of inverters. The existing standards for PV inverters such as ANSI/UL 1741 and IEC 62109-1 primarily focus on safety of PV inverters. The IEC 62093 discusses inverter qualification but it includes all the BOS components. There are other general standards for distributed generators including the IEEE 1547 series of standards which cover major concerns like utility integration but they are not dedicated to PV inverters and are not written from a design qualification point of view. In this paper some of the potential requirements for a design qualification standard for PV inverters are addressed. The missing links in existing PV inverter related standards are identified and with the IEC 62093 as a guideline, the possible inclusions in the framework for a dedicated design qualification standard of PV inverter are discussed. Some of the key missing links are related to electric stress tests. Hence, a method to adapt the existing surge withstand test standards for use in design qualification standard of PV inverter is presented. © 2011 IEEE.

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Sub-bandgap light-induced carrier generation at room temperature in 4H-SiC metal oxide semiconductor capacitors

Applied Physics Letters

Dasgupta, Sandeepan; Armstrong, Andrew A.; Kaplar, Robert K.; Marinella, Matthew J.; Brock, Reinhard; Smith, Mark A.; Atcitty, Stanley A.

Carrier generation characteristics in n-type substrate silicon carbide (SiC) metal oxide semiconductor capacitors induced by sub-bandgap energy light are reported. The generation rate is high enough to create an inversion layer in approximately 20 min with monochromatic front side illumination of energy 2.1 eV in 4H-SiC for electric fields less than 1 MV/cm. Generation and recovery results strongly indicate involvement of a metastable defect whose efficiency as a generation center increases under hole-rich and decreases under electron-rich conditions. The generation dependence on bias history and light energy shows the defect to have properties consistent with the metastable silicon vacancy/carbon vacancy-antisite complex (VSi/Vc-C Si). © 2011 American Institute of Physics.

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Stress testing on silicon carbide electronic devices for prognostics and health management

Marinella, Matthew J.; Smith, Mark A.; Atcitty, Stanley A.

Power conversion systems for energy storage and other distributed energy resource applications are among the drivers of the important role that power electronics plays in providing reliable electricity. Wide band gap semiconductors such as silicon carbide (SiC) and gallium nitride (GaN) will help increase the performance and efficiency of power electronic equipment while condition monitoring (CM) and prognostics and health management (PHM) will increase the operational availability of the equipment and thereby make it more cost effective. Voltage and/or temperature stress testing were performed on a number of SiC devices in order to accelerate failure modes and to identify measureable shifts in electrical characteristics which may provide early indication of those failures. Those shifts can be interpreted and modeled to provide prognostic signatures for use in CM and/or PHM. Such experiments will also lead to a deeper understanding of basic device physics and the degradation mechanisms behind failure.

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Power electronics reliability

Smith, Mark A.; Kaplar, Robert K.; Marinella, Matthew J.; Stanley, James B.

The project's goals are: (1) use experiments and modeling to investigate and characterize stress-related failure modes of post-silicon power electronic (PE) devices such as silicon carbide (SiC) and gallium nitride (GaN) switches; and (2) seek opportunities for condition monitoring (CM) and prognostics and health management (PHM) to further enhance the reliability of power electronics devices and equipment. CM - detect anomalies and diagnose problems that require maintenance. PHM - track damage growth, predict time to failure, and manage subsequent maintenance and operations in such a way to optimize overall system utility against cost. The benefits of CM/PHM are: (1) operate power conversion systems in ways that will preclude predicted failures; (2) reduce unscheduled downtime and thereby reduce costs; and (3) pioneering reliability in SiC and GaN.

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Results 301–342 of 342
Results 301–342 of 342