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Polymethylsilsesquioxanes through base-catalyzed redistribution of oligomethylhydridosiloxanes

American Chemical Society, Polymer Preprints, Division of Polymer Chemistry

Rahimian, Kamyar R.; Assink, Roger A.; Loy, Douglas A.

Oligomethylhydridosiloxane and tis copolymer with dimethylsiloxane undergo redistribution chemistry with catalytic tetrabutylammonium hydroxide (TBAH) to produce methylsilane and polymethylsilsesquioxanes. The rate and extent of redistribution reaction can be controlled by the amount of TBAH added, as well as use of solvent. The extent reaction can be followed by both infrared radiation (IR) and solid state NMR spectroscopy, following the disappearance of the SiH in the starting oligosiloxane.

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Sol-gel chemistry by ring-opening polymerization

Rahimian, Kamyar R.; Loy, Douglas A.; Loy, Douglas A.

Sol-gel processing of materials is plagued by shrinkage during polymerization of the alkoxide monomers and processing (aging and drying) of the resulting gels. The authors have developed a new class of hybrid organic-inorganic materials based on the solventless ring-opening polymerization (ROP) of monomers bearing the 2,2,5,5-tetramethyl-2,5-disilaoxacyclopentyl group, which permits them to drastically reduce shrinkage in sol-gel processed materials. Because the monomers are polymerized through a chain growth mechanism catalyzed by base rather than the step growth mechanism normally used in sol-gel systems, hydrolysis and condensation products are entirely eliminated. Furthermore, since water is not required for hydrolysis, an alcohol solvent is not necessary. Monomers with two disilaoxacyclopentyl groups, separated by a rigid phenylene group or a more flexible alkylene group, were prepared through disilylation of the corresponding diacetylenes, followed by ring closure and hydrogenation. Anionic polymerization of these materials, either neat or with 2,2,5,5-tetramethyl-2,5-disila-1-oxacyclopentane as a copolymer, affords thermally stable transparent gels with no visible shrinkage. These materials provide an easy route to the introduction of sol-gel type materials in encapsulation of microelectronics, which they have successfully demonstrated.

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Results 26–28 of 28
Results 26–28 of 28