Enhanced Lithography Using an Electrochemical Technique to Monitor the Endpoint
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Journal of Materials Research
Recent studies have shown the potential for nanocrystalline metals to possess excellent fatigue resistance compared to their coarse-grained counterparts. Although the mechanical properties of nanocrystalline metals are believed to be particularly susceptible to material defects, a systematic study of the effects of geometric discontinuities on their fatigue performance has not yet been performed. In the present work, nanocrystalline Ni-40 wt%Fe containing both intrinsic and extrinsic defects were tested in tension-tension fatigue. The defects were found to dramatically reduce the fatigue resistance, which was attributed to the relatively high notch sensitivity in the nanocrystalline material. Microstructural analysis within the crack-initiation zones underneath the defects revealed cyclically-induced abnormal grain growth (AGG) as a predominant deformation and crack initiation mechanism during high-cycle fatigue. The onset of AGG and the ensuing fracture is likely accelerated by the stress concentrations, resulting in the reduced fatigue resistance compared to the relatively defect-free counterparts.
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Magnetostrictive CoFe films were investigated for use as magnetoelastic tags or sensors. The ability to electrodeposit these films enables batch fabrication processes to pattern a variety of geometries while controlling the film stoichiometry and crystallography. In current research looking at CoFe, improved magnetostriction was achieved using a co-sputtering, annealing, and quenching method1. Other current research has reported electrodeposited CoFe films using a sulfate based chemistry resulting in film compositions that are Fe rich in the range of Co0.3-0.4Fe0.7-0.6 and have problems of codeposition of undesirables that can have a negative impact on magnetic properties. The research presented here focused on maximizing magnetostriction at the optimal stoichiometry range of Co0.7-0.75Fe0.3-0.25, targeting the (fcc+bcc)/bcc phase boundary, and using a novel chemistry and plating parameters to deposit films without being limited to “line of sight” deposition.
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