Publications

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A design concept, device layout, and monolithic microfabrication processing sequence have been developed for a dual-metal layer atom chip for next-generation positional control of ultracold ensembles of trapped atoms. Atom chips are intriguing systems for precision metrology and quantum information that use ultracold atoms on microfabricated chips. Using magnetic fields generated by current carrying wires, atoms are confined via the Zeeman effect and controllably positioned near optical resonators. Current state-of-the-art atom chips are single-layer or hybrid-integrated multilayer devices with limited flexibility and repeatability. An attractive feature of multi-level metallization is the ability to construct more complicated conductor patterns and thereby realize the complex magnetic potentials necessary for the more precise spatial and temporal control of atoms that is required. Here, we have designed a true, monolithically integrated, planarized, multi-metal-layer atom chip for demonstrating crossed-wire conductor patterns that trap and controllably transport atoms across the chip surface to targets of interest.

An AlN MEMS resonator technology has been developed, enabling massively parallel filter arrays on a single chip. Low-loss filter banks covering the 10 MHz--10-GHz frequency range have been demonstrated, as has monolithic integration with inductors and CMOS circuitry. The high level of integration enables miniature multi-bandm spectrally aware, and cognitive radios.

Widely applied to RF filtering, AlN microresonators offer the ability to perform additional functions such as impedance matching and single-ended-to- differential conversion. This paper reports microresonators capable of transforming the characteristic impedance from input to output over a wide range while performing low loss filtering. Microresonant transformer theory of operation and equivalent circuit models are presented and compared with measured 2 and 3-Port devices. Impedance transformation ratios as large as 18:1 are realized with insertion losses less than 5.8 dB, limited by parasitic shunt capacitance. These impedance transformers occupy less than 0.052 mm2, orders of magnitude smaller than competing technologies in the VHF and UHF frequency bands. ©2009 IEEE.

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Radio frequency microelectromechanical systems (RF MEMS) are an enabling technology for next-generation communications and radar systems in both military and commercial sectors. RF MEMS-based reconfigurable circuits outperform solid-state circuits in terms of insertion loss, linearity, and static power consumption and are advantageous in applications where high signal power and nanosecond switching speeds are not required. We have demonstrated a number of RF MEMS switches on high-resistivity silicon (high-R Si) that were fabricated by leveraging the volume manufacturing processes available in the Microelectronics Development Laboratory (MDL), a Class-1, radiation-hardened CMOS manufacturing facility. We describe novel tungsten and aluminum-based processes, and present results of switches developed in each of these processes. Series and shunt ohmic switches and shunt capacitive switches were successfully demonstrated. The implications of fabricating on high-R Si and suggested future directions for developing low-loss RF MEMS-based circuits are also discussed.