Publications

Goods, Steven H.; Marquis, Emmanuelle M.; Kelly, James J.; Michael, Joseph R.

Abstract not provided.

Dibble, Dean C.; Kelly, James J.

The performance characteristics and material properties such as stress, microstructure, and composition of nickel coatings and electroformed components can be controlled over a wide range by the addition of small amounts of surface-active compounds to the electroplating bath. Saccharin is one compound that is widely utilized for its ability to reduce tensile stress and refine grain size in electrodeposited nickel. While the effects of saccharin on nickel electrodeposition have been studied by many authors in the past, there is still uncertainty over saccharin's mechanisms of incorporation, stress reduction, and grain refinement. In-situ scanning probe microscopy (SPM) is a tool that can be used to directly image the nucleation and growth of thin nickel films at nanometer length scales to help elucidate saccharin's role in the development and evolution of grain structure. In this study, in-situ atomic force microscopy (AFM) and scanning tunneling microscopy (STM) techniques are used to investigate the effects of saccharin on the morphological evolution of thin nickel films. By observing mono-atomic height nickel island growth with and without saccharin present we conclude that saccharin has little effect on the nickel surface mobility during deposition at low overpotentials where the growth occurs in a layer-by-layer mode. Saccharin was imaged on Au(l11) terraces as condensed patches without resolved packing structure. AFM measurements of the roughness evolution of nickel films up to 1200 nm thick on polycrystalline gold indicate that saccharin initially increases the roughness and surface skewness of the deposit that at greater thickness becomes smoother than films deposited without saccharin. Faceting of the deposit morphology decreases as saccharin concentration increases even for the thinnest films that have 3-D growth.

Proposed for publication in Materials Science and Engineering A.

Marquis, Emmanuelle M.; Talin, A.A.; Goods, Steven H.; Kelly, James J.

Abstract not provided.

Proposed for publication in Philosophical Magazine A.

Lucadamo, Gene A.; Medlin, Douglas L.; Yang, Nancy Y.; Kelly, James J.; Talin, A.A.

Twinning is ubiquitous in electroplated metals. Here, we identify and discuss unique aspects of twinning found in electrodeposited Ni-Mn alloys. Previous reports concluded that the twin boundaries effectively refine the grain size, which enhances mechanical strength. Quantitative measurements from transmission electron microscopy (TEM) images show that the relative boundary length in the as-plated microstructure primarily comprises twin interfaces. Detailed TEM characterization reveals a range of length scales associated with twinning beginning with colonies ({approx}1000 nm) down to the width of individual twins, which is typically <50 nm. We also consider the connection between the crystallographic texture of the electrodeposit and the orientation of the twin planes with respect to the plating direction. The Ni-Mn alloy deposits in this work possess a 110-fiber texture. While twinning can occur on {l_brace}111{r_brace} planes either perpendicular or oblique to the plating direction in {l_brace}110{r_brace}-oriented grains, plan-view TEM images show that twins form primarily on those planes parallel to the plating direction. Therefore, grains enclosed by twins and multiply twinned particles are produced. Another important consequence of a high twin density is the formation of large numbers of twin-related junctions. We measure an area density of twin junctions that is comparable to the density of dislocations in a heavily cold-worked metal.