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High efficiency DOEs at large diffraction angles for quantum information and computing architectures

Proceedings of SPIE - The International Society for Optical Engineering

Cruz-Cabrera, A.A.; Kemme, S.A.; Wendt, J.R.; Kielpinski, D.; Streed, E.W.; Carter, T.R.; Samora, S.

We developed techniques to design higher efficiency diffractive optical elements (DOEs) with large numerical apertures (NA) for quantum computing and quantum information processing. Large NA optics encompass large solid angles and thus have high collection efficiencies. Qubits in ion trap architectures are commonly addressed and read by lasers1. Large-scale ion-trap quantum computing2 will therefore require highly parallel optical interconnects. Qubit readout in these systems requires detecting fluorescence from the nearly isotropic radiation pattern of single ions, so efficient readout requires optical interconnects with high numerical aperture. Diffractive optical element fabrication is relatively mature and utilizes lithography to produce arrays compatible with large-scale ion-trap quantum computer architectures. The primary challenge of DOEs is the loss associated with diffraction efficiency. This is due to requirements for large deflection angles, which leads to extremely small feature sizes in the outer zone of the DOE. If the period of the diffractive is between λ (the free space wavelength) and 10λ, the element functions in the vector regime. DOEs in this regime, particularly between 1.5λ and 4λ, have significant coupling to unwanted diffractive orders, reducing the performance of the lens. Furthermore, the optimal depth of the zones with periods in the vector regime differs from the overall depth of the DOE. We will present results indicating the unique behaviors around the 1.5λ and 4λ periods and methods to improve the DOE performance.

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Defect-related internal dissipation in mechanical resonators and the study of coupled mechanical systems

Sullivan, John P.; Czaplewski, David A.; Friedmann, Thomas A.; Modine, N.A.; Wendt, J.R.

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VCSEL polarization control for chip-scale atomic clocks

Keeler, Gordon A.; Geib, K.M.; Serkland, Darwin K.; Peake, Gregory M.; Wendt, J.R.

Sandia National Laboratories and Mytek, LLC have collaborated to develop a monolithically-integrated vertical-cavity surface-emitting laser (VCSEL) assembly with controllable polarization states suitable for use in chip-scale atomic clocks. During the course of this work, a robust technique to provide polarization control was modeled and demonstrated. The technique uses deeply-etched surface gratings oriented at several different rotational angles to provide VCSEL polarization stability. A rigorous coupled-wave analysis (RCWA) model was used to optimize the design for high polarization selectivity and fabrication tolerance. The new approach to VCSEL polarization control may be useful in a number of defense and commercial applications, including chip-scale atomic clocks and other low-power atomic sensors.

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Control of VCSEL polarization using deeply etched surface gratings

Conference on Lasers and Electro-Optics and 2006 Quantum Electronics and Laser Science Conference, CLEO/QELS 2006

Keeler, Gordon A.; Geib, K.M.; Serkland, Darwin K.; Peake, Gregory M.; Wendt, J.R.

We demonstrate a robust approach to VCSEL polarization control using deeply-etched surface gratings oriented at several different rotational angles. A RCWA model is used to optimize the design for high polarization selectivity and fabrication tolerance. © 2006 Optical Society of America.

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Micropolarizing device for long wavelength infrared polarization imaging

Kemme, S.A.; Boye, Robert B.; Wendt, J.R.; Vawter, Gregory A.; Cruz-Cabrera, A.A.

The goal of this project is to fabricate a four-state pixelated subwavelength optical device that enables mid-wave infrared (MWIR) or long-wave infrared (LWIR) snapshot polarimetric imaging. The polarization information can help to classify imaged materials and identify objects of interest for numerous remote sensing and military applications. While traditional, sequential polarimetric imaging produces scenes with polarization information through a series of assembled images, snapshot polarimetric imaging collects the spatial distribution of all four Stokes parameters simultaneously. In this way any noise due to scene movement from one frame to the next is eliminated. We fabricated several arrays of subwavelength components for MWIR polarization imaging applications. Each pixel unit of the array consists of four elements. These elements are micropolarizers with three or four different polarizing axis orientations. The fourth element sometimes has a micro birefringent waveplate on the top of one of the micropolarizers. The linear micropolarizers were fabricated by patterning nano-scale metallic grids on a transparent substrate. A large area birefringent waveplate was fabricated by deeply etching a subwavelength structure into a dielectric substrate. The principle of making linear micropolarizers for long wavelengths is based upon strong anisotropic absorption of light in the nano-metallic grid structures. The nano-metallic grid structures are patterned with different orientations; therefore, the micropolarizers have different polarization axes. The birefringent waveplate is a deeply etched dielectric one-dimensional subwavelength grating; therefore two orthogonally polarized waves have different phase delays. Finally, in this project, we investigated the near field and diffractive effects of the subwavelength element apertures upon detection. The fabricated pixelated polarizers had a measured extinction ratios larger than 100:1 for pixel sizes in the order of 15 {micro}m by 15 {micro}m that exceed by 7 times previously reported devices. The fabricated birefringent diffractive waveplates had a total variation of phase delay rms of 9.41 degrees with an average delay of 80.6 degrees across the MWIR spectral region. We found that diffraction effects change the requirement for separation between focal plane arrays (FPA) micropolarizer arrays and birefringent waveplates arrays, originally in the order of hundreds of microns (which are the typical substrate thickness) to a few microns or less. This new requirement leads us to propose new approaches to fabricate these devices.

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Edge termination effects on finite aperture polarizers for polarimetric imaging applications at mid wave IR

Proceedings of SPIE - The International Society for Optical Engineering

Cruz-Cabrera, A.A.; Kemme, S.A.; Wendt, J.R.; Boye, Robert B.; Carter, T.R.; Samora, S.

Polarimetric imaging applications at the 2 to 5 μm or Mid-Wave Infrared (MWIR) range use large pixel-count focal plane arrays (FPA) with small pixel size. This project is centered in designing, fabricating and testing micropolarizers that work in that wavelength regime and intended for that type of FPAs. The micro-polarizers will be used in conjunction with a FPA in snapshot mode and will be in the near field of the imaging device. The pixel pitches for some commercial FPAs are small enough that the finite apertures of the polarizing devices may significantly affect their performance given that their aperture size varies between 3 and 5 waves. We are interested in understanding the effect on extinction ratio due to variations in the edge terminations of a polarizer with a small aperture. Edge terminations are the spaces between the first or last wire with the perimeter of the aperture of the polarizer. While this parameter has negligible effects on a larger polarizer, it will be significant for apertures that are about 3 to 5 waves. We will present data that indicates significant variation in performance due to edge terminations.

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Pixilated wideband achromatic waveplates fabricated for the mid IR using subwavelength features

Proceedings of SPIE - The International Society for Optical Engineering

Boye, Robert B.; Kemme, S.A.; Wendt, J.R.; Cruz-Cabrera, A.A.; Vawter, Gregory A.; Alford, C.R.; Carter, T.R.; Samora, S.

Subwavelength diffractive features etched into a substrate lead to form birefringence that can be utilized to produce polarization sensitive elements such as waveplates. Using etched features allows for the development of pixilated devices to be used in conjunction with focal plane arrays in polarimetric imaging systems. Typically, the main drawback from using diffractive devices is their high sensitivity to wavelength. Taking advantage of the dispersion of the form birefringence, diffractive waveplates with good achromatic characteristics can be designed. We will report on diffractive waveplates designed for minimal phase retardation error across the 2-5 micron spectral regime. The required fabrication processes of the sub-wavelength feature sizes will be discussed as well as the achromatic performance and transmission efficiency of final devices. Previous work in this area has produced good results over a subset of this wavelength band, but designing for this extended band is particularly challenging. In addition, the effect of the finite size of the apertures of the pixilated devices is of particular interest since they are designed to be used in conjunction with a detector array. The influence of small aperture sizes will also be investigated.

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Fabrication issues for a chirped, subwavelength form-birefringent polarization splitter

Proceedings of SPIE - The International Society for Optical Engineering

Kemme, S.A.; Wendt, J.R.; Vawter, Gregory A.; Cruz-Cabrera, A.A.; Peters, D.W.; Boye, Robert B.; Alford, C.R.; Carter, T.R.; Samora, S.

We report here on an effort to design and fabricate a polarization splitter that utilizes form-birefringence to disperse an input beam as a function of polarization content as well as wavelength spectrum. Our approach is unique in the polarization beam splitting geometry and the potential for tailoring the polarized beams' phase fronts to correct aberrations or add focusing power. A first cut design could be realized with a chirped duty cycle grating at a single etch depth. However, this approach presents a considerable fabrication obstacle since etch depths are a strong function of feature size, or grating period. We fabricated a period of 1.0 micron form-birefringent component, with a nominal depth of 1.7 microns, in GaAs using a CAIBE system with a 2-inch ion beam source diameter. The gas flows, ion energy, and sample temperature were all optimized to yield the desired etch profile.

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Diffractive Optics in the Infrared (DiOptIR) LDRD 67109 final report

Kemme, S.A.; Peters, D.W.; Shields, Eric A.; Wendt, J.R.; Vawter, Gregory A.

This diffractive optical element (DOE) LDRD is divided into two tasks. In Task 1, we develop two new DOE technologies: (1) a broad wavelength band effective anti-reflection (AR) structure and (2) a design tool to encode dispersion and polarization information into a unique diffraction pattern. In Task 2, we model, design, and fabricate a subwavelength polarization splitter. The first technology is an anti-reflective (AR) layer that may be etched into the DOE surface. For many wavelengths of interest, transmissive silicon DOEs are ideal. However, a significant portion of light (30% from each surface) is lost due to Fresnel reflection. To address this issue, we investigate a subwavelength, surface relief structure that acts as an effective AR coating. The second DOE component technology in Task 1 is a design tool to determine the optimal DOE surface relief structure that can encode the light's degree of dispersion and polarization into a unique spatial pattern. Many signals of interest have unique spatial, temporal, spectral, and polarization signatures. The ability to disperse the signal into a unique diffraction pattern would result in improved signal detection sensitivity with a simultaneous reduction in false alarm. Task 2 of this LDRD project is to investigate the modeling, design, and fabrication of subwavelength birefringent devices for polarimetric spectral sensing and imaging applications. Polarimetric spectral sensing measures the spectrum of the light and polarization state of light at each wavelength simultaneously. The capability to obtain both polarization and spectral information can help develop target/object signature and identify the target/object for several applications in NP&MC and national security.

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Mechanical dissipation at elevated temperatures in tetrahedral amorphous carbon

Proposed for publication in Diamond and Related Materials

Sullivan, John P.; Friedmann, Thomas A.; Wendt, J.R.

We have measured the temperature dependence of mechanical dissipation in tetrahedral amorphous carbon flexural and torsional resonators over the temperature range from 300 to 1023 K. The mechanical dissipation was found to be controlled by defects within the material, and the magnitude and temperature dependence of the dissipation were found to depend on whether flexural or torsional vibrational modes were excited. The defects that were active under flexural stresses have a relatively flat concentration from 0.4 to 0.7 eV with an ever increasing defect concentration up to 1.9 eV. Under shear stresses (torsion), the defect activation energies increase immediately beginning at 0.4 eV, with increasing defect concentration at higher energies.

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Final LDRD report : design and fabrication of advanced device structures for ultra high efficiency solid state lighting

Fischer, Arthur J.; Crawford, Mary H.; Koleske, Daniel K.; Allerman, A.A.; Bogart, Katherine B.; Wendt, J.R.; Shul, Randy J.

The goal of this one year LDRD was to improve the overall efficiency of InGaN LEDs by improving the extraction of light from the semiconductor chip. InGaN LEDs are currently the most promising technology for producing high efficiency blue and green semiconductor light emitters. Improving the efficiency of InGaN LEDs will enable a more rapid adoption of semiconductor based lighting. In this LDRD, we proposed to develop photonic structures to improve light extraction from nitride-based light emitting diodes (LEDs). While many advanced device geometries were considered for this work, we focused on the use of a photonic crystal for improved light extraction. Although resonant cavity LEDs and other advanced structures certainly have the potential to improve light extraction, the photonic crystal approach showed the most promise in the early stages of this short program. The photonic crystal (PX)-LED developed here incorporates a two dimensional photonic crystal, or photonic lattice, into a nitride-based LED. The dimensions of the photonic crystal are selected such that there are very few or no optical modes in the plane of the LED ('lateral' modes). This will reduce or eliminate any radiation in the lateral direction so that the majority of the LED radiation will be in vertical modes that escape the semiconductor, which will improve the light-extraction efficiency. PX-LEDs were fabricated using a range of hole diameters and lattice constants and compared to control LEDs without a photonic crystal. The far field patterns from the PX-LEDs were dramatically modified by the presence of the photonic crystal. An increase in LED brightness of 1.75X was observed for light measured into a 40 degree emission cone with a total increase in power of 1.5X for an unencapsulated LED.

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III-Nitride LEDs with photonic crystal structures

Wendt, J.R.

Electrical operation of III-Nitride light emitting diodes (LEDs) with photonic crystal structures is demonstrated. Employing photonic crystal structures in III-Nitride LEDs is a method to increase light extraction efficiency and directionality. The photonic crystal is a triangular lattice formed by dry etching into the III-Nitride LED. A range of lattice constants is considered (a {approx} 270-340nm). The III-Nitride LED layers include a tunnel junction providing good lateral current spreading without a semi-absorbing metal current spreader as is typically done in conventional III-Nitride LEDs. These photonic crystal III-Nitride LED structures are unique because they allow for carrier recombination and light generation proximal to the photonic crystal (light extraction area) yet displaced from the absorbing metal contact. The photonic crystal Bragg scatters what would have otherwise been guided modes out of the LED, increasing the extraction efficiency. The far-field light radiation patterns are heavily modified compared to the typical III-Nitride LED's Lambertian output. The photonic crystal affects the light propagation out of the LED surface, and the radiation pattern changes with lattice size. LEDs with photonic crystals are compared to similar III-Nitride LEDs without the photonic crystal in terms of extraction, directionality, and emission spectra.

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Nano-electromechanical oscillators (NEMOs) for RF technologies

Friedmann, Thomas A.; Boyce, Brad B.; Czaplewski, David A.; Dyck, Christopher D.; Webster, James R.; Carton, Andrew J.; Carr, Dustin W.; Keeler, Bianca E.; Wendt, J.R.; Tallant, David T.

Nano-electromechanical oscillators (NEMOs), capacitively-coupled radio frequency (RF) MEMS switches incorporating dissipative dielectrics, new processing technologies for tetrahedral amorphous carbon (ta-C) films, and scientific understanding of dissipation mechanisms in small mechanical structures were developed in this project. NEMOs are defined as mechanical oscillators with critical dimensions of 50 nm or less and resonance frequencies approaching 1 GHz. Target applications for these devices include simple, inexpensive clocks in electrical circuits, passive RF electrical filters, or platforms for sensor arrays. Ta-C NEMO arrays were used to demonstrate a novel optomechanical structure that shows remarkable sensitivity to small displacements (better than 160 fm/Hz {sup 1/2}) and suitability as an extremely sensitive accelerometer. The RF MEMS capacitively-coupled switches used ta-C as a dissipative dielectric. The devices showed a unipolar switching response to a unipolar stimulus, indicating the absence of significant dielectric charging, which has historically been the major reliability issue with these switches. This technology is promising for the development of reliable, low-power RF switches. An excimer laser annealing process was developed that permits full in-plane stress relaxation in ta-C films in air under ambient conditions, permitting the application of stress-reduced ta-C films in areas where low thermal budget is required, e.g. MEMS integration with pre-existing CMOS electronics. Studies of mechanical dissipation in micro- and nano-scale ta-C mechanical oscillators at room temperature revealed that mechanical losses are limited by dissipation associated with mechanical relaxation in a broad spectrum of defects with activation energies for mechanical relaxation ranging from 0.35 eV to over 0.55 eV. This work has established a foundation for the creation of devices based on nanomechanical structures, and outstanding critical research areas that need to be addressed for the successful application of these technologies have been identified.

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Results 226–250 of 271
Results 226–250 of 271