Publications

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A mesoscale dimensional artifact based on silicon bulk micromachining fabrication has been developed with the intention of evaluating the artifact both on a high precision Coordinate Measuring Machine (CMM), and on a video-probe based measuring system. A high accuracy touch-probe based CMM can achieve accuracies that are as good as the 2-D repeatability of video-probe systems. While video-probe based systems are commonly used to inspect mesoscale mechanical components, a video-probe system's certified accuracy is generally much worse than its repeatability. By using a hybrid artifact where the same features can be extracted by both a touch-probe and a video-probe, the accuracy of video-probe systems can be improved. In order to use the micromachined device as a calibration artifact, it is important to understand the uncertainty present in the touch-probe measurements. An uncertainty analysis is presented to show the potential accuracy of the measurement of these artifacts on a high precision CMM.

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We are developing calibration artifacts for mesoscale metrology (especially vision probing) by using silicon bulk micromachining. We evaluate these artifacts on both high accuracy coordinate measuring machines (CMMs) and on typical production vision-based measurement systems. This will improve the accuracy of vision-based measurement equipment used in production. Successful realization of these mesoscale artifacts will enhance both production metrology capabilities and reduce manufacturing costs. Copyright © 2006 by ASME.

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