Microphotonic Thermal Detectors and Imagers
Abstract not provided.
Publications
SOI-Enabled MEMS Processes Lead to Novel Mechanical Optical and Atomic Physics Devices Presentation
Abstract not provided.
SOI-Enabled MEMS Processes Lead to Novel Mechanical Optical and Atomic Physics Devices
Abstract not provided.
Fabrication techniques for creating a thermally isolated TM-FPA (thermal microphotonic focal plane array)
Proceedings of SPIE - The International Society for Optical Engineering
A novel fabrication strategy has produced optical microring-resonator-based thermal detectors. The detectors are based on the thermo-optic effect and are thermally isolated from a silicon wafer substrate so as to maximize the temperature excursion for a given amount of incident radiation and minimize the impact of thermal phonon noise. The combination of high-Q, thermal isolation, and lack of Johnson noise offers thermal microphotonic detectors the potential to achieve significantly greater room temperature sensitivity than standard bolometric techniques. Several batch fabrication strategies were investigated for producing thermal microphotonic detectors using waveguide materials such as LPCVD Silicon Nitride (Si3N4) on Oxide and Silicon on Insulator (SOI). Fabrication challenges and loss reduction strategies will be presented along with some initial infrared detection results.
Thermal Microphotonic Detection and Imaging
Abstract not provided.
Thermal-Microphotonic Detection and Imaging
Abstract not provided.
Thermal Microphotonic Focal Plane Array (TM-FPA) for uncooled high sensitivity thermal imaging
Abstract not provided.
Optics and Optoelectronics for QIP
Abstract not provided.
Optical MEMS for QIP applications
Abstract not provided.
A physically based model for dielectric charging in an integrated optical MEMS wavelength selective switch
IEEE/LEOS Optical MEMS 2005: International Conference on Optical MEMS and Their Applications
A physical parameter based model for dielectric charge accumulation is proposed and used to predict the displacement versus applied voltage and pull-in response of an electrostatic MEMS wavelength selective integrated optical switch. ©2005 IEEE.
MEMS integrated with optics and nanostructures for sensor applications
Abstract not provided.
On the use of titanium nitride as structural material for Nano-Electro-Mechanical Systems (NEMS)
The introduction of new multifunctional materials provides the potential for expanding the realm of microsystems device design and applications. Titanium nitride is identified as an attractive candidate material for use in NEMS applications given its favorable electrical, mechanical and chemical properties thereby enabling its use in high frequency applications and in harsh environments. We demonstrate TiN NEMS structures and low temperature residual stress control of the TiN comprising those structures. Potential applications of TiN as a NEMS structural material are discussed, with particular emphasis on active nanophotonic devices.
Results 101–112 of 112