Scanning Capacitance Microscopy Imaging and Registration of 2-D Donor Devices Fabricated via Scanning Tunneling Microscopy
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Applied Physics Letters
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Proposed for publication in the Journal of Physics : Condensed Matter.
Using low-energy electron microscopy, we measure the diffusion of Pd into bulk Cu at the Cu(100) surface. Interdiffusion is tracked by measuring the dissolution of the Cu(100)-c(2 x 2)-Pd surface alloy during annealing (T > 240 C). The activation barrier for Pd diffusion from the surface alloy into the bulk is determined to be (1.8 {+-} 0.6) eV. During annealing, we observe the growth of a new layer of Cu near step edges. Under this new Cu layer, dilute Pd remaining near the surface develops a layered structure similar to the Cu{sub 3}Pd L 1{sub 2} bulk alloy phase.
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PHYSICAL REVIEW LETTERS
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