Publications

Abstract not provided.

Encapsulation is a common process used in manufacturing most non-nuclear components including: firing sets, neutron generators, trajectory sensing signal generators (TSSGs), arming, fusing and firing devices (AF and Fs), radars, programmers, connectors, and batteries. Encapsulation is used to contain high voltage, to mitigate stress and vibration and to protect against moisture. The purpose of the ASCI Encapsulation project is to develop a simulation capability that will allow us to aid in the encapsulation design process, especially for neutron generators. The introduction of an encapsulant poses many problems because of the need to balance ease of processing and properties necessary to achieve the design benefits such as tailored encapsulant properties, optimized cure schedule and reduced failure rates. Encapsulants can fail through fracture or delamination as a result of cure shrinkage, thermally induced residual stresses, voids or incomplete component embedding and particle gradients. Manufacturing design requirements include (1) maintaining uniform composition of particles in order to maintain the desired thermal coefficient of expansion (CTE) and density, (2) mitigating void formation during mold fill, (3) mitigating cure and thermally induced stresses during cure and cool down, and (4) eliminating delamination and fracture due to cure shrinkage/thermal strains. The first two require modeling of the fluid phase, and it is proposed to use the finite element code GOMA to accomplish this. The latter two require modeling of the solid state; however, ideally the effects of particle distribution would be included in the calculations, and thus initial conditions would be set from GOMA predictions. These models, once they are verified and validated, will be transitioned into the SIERRA framework and the ARIA code. This will facilitate exchange of data with the solid mechanics calculations in SIERRA/ADAGIO.

Polymer stresses around sharp corners and in constrained geometries of encapsulated components can generate cracks leading to system failures. Often, analysts use maximum stresses as a qualitative indicator for evaluating the strength of encapsulated component designs. Although this approach has been useful for making relative comparisons screening prospective design changes, it has not been tied quantitatively to failure. Accurate failure models are needed for analyses to predict whether encapsulated components meet life cycle requirements. With Sandia's recently developed nonlinear viscoelastic polymer models, it has been possible to examine more accurately the local stress-strain distributions in zones of likely failure initiation looking for physically based failure mechanisms and continuum metrics that correlate with the cohesive failure event. This study has identified significant differences between rubbery and glassy failure mechanisms that suggest reasonable alternatives for cohesive failure criteria and metrics. Rubbery failure seems best characterized by the mechanisms of finite extensibility and appears to correlate with maximum strain predictions. Glassy failure, however, seems driven by cavitation and correlates with the maximum hydrostatic tension. Using these metrics, two three-point bending geometries were tested and analyzed under variable loading rates, different temperatures and comparable mesh resolution (i.e., accuracy) to make quantitative failure predictions. The resulting predictions and observations agreed well suggesting the need for additional research. In a separate, additional study, the asymptotically singular stress state found at the tip of a rigid, square inclusion embedded within a thin, linear elastic disk was determined for uniform cooling. The singular stress field is characterized by a single stress intensity factor K{sub a} and the applicable K{sub a} calibration relationship has been determined for both fully bonded and unbended inclusions. A lack of interfacial bonding has a profound effect on inclusion-tip stress fields. A large radial compressive stress is generated in front of the inclusion-tip when the inclusion is well bonded, whereas a large tensile hoop stress is generated when the inclusion is unbended, and frictionless sliding is allowed. Consequently, an epoxy disk containing an unbended inclusion appears more likely to crack when cooled than a disk containing a fully bonded inclusion. A limited number of tests have been carried out to determine if encapsulant cracking can be induced by cooling a specimen fabricated by molding a square, steel insert within a thin, epoxy disk. Test results are in qualitative agreement with analysis. Cracks developed only in disks with mold-released inserts, and the tendency for cracking increased with inclusion size.

The effects of chemical aging on the behavior of carbon black filled rubber were investigated by two types of tests, aging under no strain and aging under a constant strain. A slight modification of the damage-based theory of Segalman, used previously on unaged samples, was found to be consistent with the experimental data.

Abstract not provided.