Publications

Lavin, Judith M.; Evans, Lindsey E.; Keicher, David M.; Reinholtz, William; Mani, Seethambal S.

Abstract not provided.

Lavin, Judith M.; Keicher, David M.; Mani, Seethambal S.

Abstract not provided.

Sugar, Joshua D.; Beghini, Lauren L.; Stender, Michael S.; Veilleux, Michael V.; Keicher, David M.; Dagel, Daryl D.; Maguire, Michael C.; San Marchi, Christopher W.

Abstract not provided.

Kustas, Andrew K.; Keicher, David M.; Brumbach, Michael T.; Nation, Brendan L.; Argibay, Nicolas A.

Abstract not provided.

Cook, Adam W.; DiAntonio, Christopher D.; Boyle, Timothy J.; Bell, Nelson S.; Keicher, David M.; Reinholtz, William D.; Chavez, Tom C.

Abstract not provided.

IEEE Transactions on Dielectrics and Electrical Insulation

Appelhans, Leah A.; Keicher, David M.; Lavin, Judith M.

The permittivity, dielectric loss, and DC dielectric breakdown strength of additively manufactured, solvent-cast, and commercial polyimide films are reported As expected, commercial films performed better than both AM and solvent-cast lab-made films. Solvent-cast films generally performed better than AM films, although performance depended on the optimization of the material for the specific deposition technique. The most significant degradation of performance in all the lab-made films was in the dispersion of both the x/Df measurements and the dielectric breakdown strength (Weibull β). Commercial films had a breakdown strength of 4891 kV/cm and β = 13.0 whereas the highest performing lab-made films had a breakdown strength of 4072 kV/cm and β = 3.8. Furthermore, this increase in dispersion in all the lab-made samples is attributed to higher variability in the preparation, a higher defect level related to fabrication in the lab environment and, for some AM samples, to morphology/topology features resulting from the deposition technique.

Appelhans, Leah A.; Keicher, David M.; Lavin, Judith M.

Abstract not provided.

Bell, Nelson S.; Sarobol, Pylin S.; Cook, Adam W.; Boyle, Timothy J.; Clem, Paul G.; Keicher, David M.; Hirschfeld, Deidre H.; Hall, Aaron C.

Abstract not provided.

Lavin, Judith M.; Keicher, David M.; Whetten, Shaun R.; Moore, Penny B.; Mani, Seethambal S.; Appelhans, Leah A.

Abstract not provided.

Whetten, Shaun R.; Keicher, David M.; Lavin, Judith M.; Beller, Zachary J.; Mani, Seethambal S.; Moore, Penny B.; Cook, Adam W.; Acree, Nathan A.; Young, Nathan P.; Russell, Michael J.

Abstract not provided.

Annual Review of Materials Research

Sarobol, Pylin S.; Cook, Adam W.; Clem, Paul G.; Keicher, David M.; Hirschfeld, Deidre H.; Hall, Aaron C.; Bell, Nelson S.

There is a rising interest in developing functional electronics using additively manufactured components. Considerations in materials selection and pathways to forming hybrid circuits and devices must demonstrate useful electronic function; must enable integration; and must complement the complex shape, low cost, high volume, and high functionality of structural but generally electronically passive additively manufactured components. This article reviews several emerging technologies being used in industry and research/development to provide integration advantages of fabricating multilayer hybrid circuits or devices. First, we review a maskless, noncontact, direct write (DW) technology that excels in the deposition of metallic colloid inks for electrical interconnects. Second, we review a complementary technology, aerosol deposition (AD), which excels in the deposition of metallic and ceramic powder as consolidated, thick conformal coatings and is additionally patternable through masking. Finally, we show examples of hybrid circuits/devices integrated beyond 2-D planes, using combinations of DW or AD processes and conventional, established processes.

Sugar, Joshua D.; Brown, Arthur B.; Beghini, Lauren L.; Dagel, Daryl D.; Keicher, David M.; Subia, Samuel R.; Reynolds, Thomas B.; Allen, Kyle M.; Balch, Dorian K.; San Marchi, Christopher W.

Abstract not provided.

Fasano, Michaela R.; Mani, Seethambal S.; Keicher, David M.

Abstract not provided.

Carlson, Matthew D.; Keicher, David M.

Abstract not provided.

Whetten, Shaun R.; Fisano, Michaela F.; Beller, Zach B.; Cook, Adam W.; Keicher, David M.; Mani, Seethambal S.

Abstract not provided.

Keicher, David M.; Mani, Seethambal S.; Lavin, Judith M.; Jensen, Sara E.; Okoro, Jazmine L.; Sanchez, Carlos A.; Cook, Adam W.

Abstract not provided.

Keicher, David M.; Mani, Seethambal S.; Lavin, Judith M.; Okoro, Jazmine L.; Jensen, Sara E.; Sanchez, Carlos A.; Cook, Adam W.

Abstract not provided.

Allen, Kyle M.; Sugar, Joshua D.; Keicher, David M.; Spahn, Olga B.; Dagel, Daryl D.; Beghini, Lauren L.; Subia, Samuel R.; Brown, Arthur B.; Balch, Dorian K.; Markel, Benjamin M.; San Marchi, Christopher W.

Abstract not provided.

Okoro, Jazmine L.; Lavin, Judith M.; Cook, Adam W.; Keicher, David M.; Leger, Jon-Claude L.

Abstract not provided.

Lavin, Judith M.; Cook, Adam W.; Keicher, David M.; Sanchez, Carlos A.; Jensen, Sara E.; Okoro, Jazmine L.; Leger, Jon-Claude L.; Mani, Seethambal S.

Abstract not provided.

Sugar, Joshua D.; Keicher, David M.; Spahn, Olga B.; Subia, Samuel R.; Brown, Arthur B.; San Marchi, Christopher W.

Abstract not provided.

Keicher, David M.; Cook, Adam W.

The work performed in this project has demonstrated the feasibility to use hydrodynamic focusing of two fluid steams to create a novel micro printing technology for electronics and other high performance applications. Initial efforts focused solely on selective evaporation of the sheath fluid from print stream provided insight in developing a unique print head geometry allowing excess sheath fluid to be separated from the print flow stream for recycling/reuse. Fluid flow models suggest that more than 81 percent of the sheath fluid can be removed without affecting the print stream. Further development and optimization is required to demonstrate this capability in operation. Print results using two-fluid hydrodynamic focusing yielded a 30 micrometers wide by 0.5 micrometers tall line that suggests that the cross-section of the printed feature from the print head was approximately 2 micrometers in diameter. Printing results also demonstrated that complete removal of the sheath fluid is not necessary for all material systems. The two-fluid printing technology could enable printing of insulated conductors and clad optical interconnects. Further development of this concept should be pursued.