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Ku-band six-bit RF MEMS time delay network

2008 IEEE CSIC Symposium: GaAs ICs Celebrate 30 Years in Monterey, Technical Digest 2008

Nordquist, Christopher N.; Dyck, Christopher D.; Kraus, Garth K.; Sullivan, Charles T.; Austin IV, Franklin; Finnegan, Patrick S.; Ballance, Mark H.

A six-bit time delay circuit operating from DC to 18 GHz is reported. Capacitively loaded transmission lines are used to reduce the physical length of the delay elements and shrink the die size. Additionally, selection of the reference line lengths to avoid resonances allows the replacement of series-shunt switching elements with only series elements. With through-wafer transitions and a packaging seal ring, the 7 mm x 10 mm circuit demonstrates <2.8 dB of loss and 60 ps of delay with good delay flatness and accuracy through 18 GHz. © 2008 IEEE.

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TYPE Conference YEAR 2008
ScopusOSTI

Nanomechanical switch for integration with CMOS logic

Proposed for publication in the Journal of Microelectronics and Micromechanics.

Czaplewski, David A.; Patrizi, G.A.; Kraus, Garth K.; Wendt, J.R.; Nordquist, Christopher N.; Wolfley, Steven L.; De Boer, Maarten P.

We designed, fabricated and measured the performance of nanoelectromechanical (NEMS) switches. Initial data are reported with one of the switch designs having a measured switching time of 400 ns and an operating voltage of 5 V. The switches operated laterally with unmeasurable leakage current in the 'off' state. Surface micromachining techniques were used to fabricate the switches. All processing was CMOS compatible. A single metal layer, defined by a single mask step, was used as the mechanical switch layer. The details of the modeling, fabrication and testing of the NEMS switches are reported.

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TYPE Journal Article YEAR 2008
OSTI

SOI-Enabled MEMS Processes Lead to Novel Mechanical Optical and Atomic Physics Devices Presentation

Herrera, Gilbert V.; McCormick, Frederick B.; Nielson, Gregory N.; Nordquist, Christopher N.; Okandan, Murat O.; Olsson, Roy H.; Ortiz, Keith O.; Platzbecker, Mark R.; Resnick, Paul J.; Shul, Randy J.; Bauer, Todd B.; Sullivan, Charles T.; Watts, Michael W.; Blain, Matthew G.; Dodd, Paul E.; Dondero, Richard D.; Garcia, Ernest J.; Galambos, Paul; Hetherington, Dale L.; Hudgens, James J.

Abstract not provided.

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TYPE Conference YEAR 2008
OSTI

SOI-Enabled MEMS Processes Lead to Novel Mechanical Optical and Atomic Physics Devices

Herrera, Gilbert V.; McCormick, Frederick B.; Nielson, Gregory N.; Nordquist, Christopher N.; Okandan, Murat O.; Olsson, Roy H.; Ortiz, Keith O.; Platzbecker, Mark R.; Resnick, Paul J.; Shul, Randy J.; Bauer, Todd B.; Sullivan, Charles T.; Watts, Michael W.; Blain, Matthew G.; Dodd, Paul E.; Dondero, Richard D.; Garcia, Ernest J.; Galambos, Paul; Hetherington, Dale L.; Hudgens, James J.

Abstract not provided.

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TYPE Conference YEAR 2008
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Macro-meso-microsystems integration in LTCC : LDRD report

Rohde, Steven B.; Okandan, Murat O.; Pfeifer, Kent B.; De Smet, Dennis J.; Patel, Kamlesh P.; Ho, Clifford K.; Nordquist, Christopher N.; Walker, Charles A.; Rohrer, Brandon R.; Buerger, Stephen B.; Wroblewski, Brian W.

Low Temperature Cofired Ceramic (LTCC) has proven to be an enabling medium for microsystem technologies, because of its desirable electrical, physical, and chemical properties coupled with its capability for rapid prototyping and scalable manufacturing of components. LTCC is viewed as an extension of hybrid microcircuits, and in that function it enables development, testing, and deployment of silicon microsystems. However, its versatility has allowed it to succeed as a microsystem medium in its own right, with applications in non-microelectronic meso-scale devices and in a range of sensor devices. Applications include silicon microfluidic ''chip-and-wire'' systems and fluid grid array (FGA)/microfluidic multichip modules using embedded channels in LTCC, and cofired electro-mechanical systems with moving parts. Both the microfluidic and mechanical system applications are enabled by sacrificial volume materials (SVM), which serve to create and maintain cavities and separation gaps during the lamination and cofiring process. SVMs consisting of thermally fugitive or partially inert materials are easily incorporated. Recognizing the premium on devices that are cofired rather than assembled, we report on functional-as-released and functional-as-fired moving parts. Additional applications for cofired transparent windows, some as small as an optical fiber, are also described. The applications described help pave the way for widespread application of LTCC to biomedical, control, analysis, characterization, and radio frequency (RF) functions for macro-meso-microsystems.

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TYPE SAND Report YEAR 2007
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Investigating the impact of carbon contamination on RF MEMS reliability

IEEE Antennas and Propagation Society, AP-S International Symposium (Digest)

Carton, Andrew J.; Christodoulou, C.G.; Dyck, Christopher D.; Nordquist, Christopher N.

Radio Frequency Microelectromechanical Systems (RF MEMS) are advantageous for reconfigurable antennas providing the potential for steering, frequency agility, and tunable directivity. Until RF MEMS switches can consistently reach cycles into the billions (if not trillions), limited reliability outweighs the promised benefits, preventing the deployment of RF MEMS into systems. Understanding failure mechanisms is essential to improving reliability. This paper describes preliminary reliability results and tests conducted in a vacuum chamber to investigate and understand the impact of contamination related failure mechanisms. © 2006 IEEE.

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TYPE Conference YEAR 2006
ScopusOSTI
Results 101–125 of 136
Results 101–125 of 136