Epoxy underfills can be implemented in electronic packaging to enhance solder joint reliability of surface mounted components. However, it is important for an engineer to have a failure criterion that can be used for failure predictions and redesign of electronic assemblies. For this study, data from epoxy bond failure in mock electronic part assemblies were correlated to finite element analyses to predict adhesive failure initiation. Experiments were performed to determine failure loads for various loading locations and nonlinear viscoelastic analyses were performed for the same loading locations to determine a maximum principal strain failure parameter. Predictions showed that a maximum principal strain failure parameter defined from one test could be used as an indicator of adhesive failure of an epoxy bond undergoing other modes of loading. Failure initiation predictions matched experimental data using a maximum principal strain failure parameter for an epoxy bond undergoing mixed modes of loading for both unfilled and alumina oxide filled 828DEA epoxy. Such experimental setup is deemed appropriate for future epoxy testing.
In components with two materials, such as glass-to-metal (GtM) seals, residual stress can reduce long-term reliability. Therefore, it is important to be able to accurately measure residual stress within these components. The residual stress can be from a large strain due to the mismatch of thermo-physical response of the two materials or a small strain due to stress and/or structural relaxation. Both modeling and experimental measurements were conducted on multiple GtM seals constructed with CGI 930 glass with purposely added alumina particles. The alumina particles have an established Cr fluorescence pattern and the shift in position of these peaks can accurately measure the strain of the alumina crystals. Photoluminescence spectroscopy (PLS) technique was utilized due to its non-destructive nature and high spatial resolution. PLS scans of these components were analyzed and compared to the models developed previously.
Thermal mechanical stresses of glass-ceramic to stainless steel (GCtSS) seals are analyzed using finite element modeling over a temperature cycle from a set temperature (Tset) 500°C to −55°C, and then back to 600°C. Two glass-ceramics having an identical coefficient of thermal expansion (CTE) at ~16 ppm/°C but very different linearity of thermal strains, designated as near-linear NL16 and step-like SL16, were formed from the same parent glass using different crystallization processes. Stress modeling reveals much higher plastic strain in the stainless steel using SL16 glass-ceramic when the GCtSS seal cools from Tset. Upon heating tensile stresses start to develop at the GC-SS interface before the temperature reaches Tset. On the other hand, the much lower plastic deformation in stainless steel accumulated during cooling using NL16 glass-ceramic allows for radially compressive stress at the GC-SS interface to remain present when the seal is heated back to Tset. The qualitative stress comparison suggests that with a better match of thermal strain rate to that of stainless steel, the NL16 glass-ceramic not only improves the hermeticity of the GCtSS seals, but would also improve the reliability of the seals exposed to high-temperature and/or high-pressure abnormal environments.