Publications

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Current technology cuts solar Si wafers by a wire saw process, resulting in 50% 'kerf' loss when machining silicon from a boule or brick into a wafer. We want to develop a kerf-free laser wafering technology that promises to eliminate such wasteful wire saw processes and achieve up to a ten-fold decrease in the g/W{sub p} (grams/peak watt) polysilicon usage from the starting polysilicon material. Compared to today's technology, this will also reduce costs ({approx}20%), embodied energy, and green-house gas GHG emissions ({approx}50%). We will use short pulse laser illumination sharply focused by a solid immersion lens to produce subsurface damage in silicon such that wafers can be mechanically cleaved from a boule or brick. For this concept to succeed, we will need to develop optics, lasers, cleaving, and high throughput processing technologies capable of producing wafers with thicknesses < 50 {micro}m with high throughput (< 10 sec./wafer). Wafer thickness scaling is the 'Moore's Law' of silicon solar. Our concept will allow solar manufacturers to skip entire generations of scaling and achieve grid parity with commercial electricity rates. Yet, this idea is largely untested and a simple demonstration is needed to provide credibility for a larger scale research and development program. The purpose of this project is to lay the groundwork to demonstrate the feasibility of laser wafering. First, to design and procure on optic train suitable for producing subsurface damage in silicon with the required damage and stress profile to promote lateral cleavage of silicon. Second, to use an existing laser to produce subsurface damage in silicon, and third, to characterize the damage using scanning electron microscopy and confocal Raman spectroscopy mapping.

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The relatively recent development of short (nsec) and ultra-short (fsec) pulsed laser systems has introduced process capabilities which are particularly suited for micro-manufacturing applications. Micrometer feature resolutions and minimal heat affected zones are commonly cited benefits, although unique material interactions also prove attractive for many applications. A background of short and ultra-short pulsed laser system capabilities and material interactions will be presented for micro-scale processing. Processing strengths and limitations will be discussed and demonstrated within the framework of applications related to micro-machining, material surface modifications, and fundamental material science research.

This project demonstrates the feasibility of a novel imager with a thickness measured in microns rather than inches. Traditional imaging systems, i.e. cameras, cannot provide both the necessary resolution and innocuous form factor required in many data acquisition applications. Designing an imaging system with an extremely thin form factor (less than 1 mm) immediately presents several technical challenges. For instance, the thickness of the optical lens must be reduced drastically from currently available lenses. Additionally, the image circle is reduced by a factor equal to the reduction in focal length. This translates to fewer detector pixels across the image. To reduce the optical total track requires the use of specialized micro-optics and the required resolution necessitates the use of a new imaging modality. While a single thin imager will not produce the desired output, several thin imagers can be multiplexed and their low resolution (LR) outputs used together in post-processing to produce a high resolution (HR) image. The utility of an Iterative Back Projection (IBP) algorithm has been successfully demonstrated for performing the required post-processing. Advanced fabrication of a thin lens was also demonstrated and experimental results using this lens as well as commercially available lenses are presented.

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