Publications

Nordquist, Christopher N.; Pluym, Tammy P.; Schiess, Adrian R.; Koch, Lawrence K.; Branch, Darren W.; Bauer, Todd B.; Grine, Alejandro J.; Ballance, Mark H.; Dyck, Christopher D.; Olsson, Roy H.; Nguyen, Janet N.; Yarberry, Victor Y.; stevens, james e.; Scott, Sean M.; Choi, Sukwon C.; Sing, Molly N.

Abstract not provided.

Nordquist, Christopher N.; Olsson, Roy H.; Branch, Darren W.; Pluym, Tammy P.; Choi, Sukwon C.; Grine, Alejandro J.

Abstract not provided.

Grine, Alejandro J.; Clevenger, Jascinda C.; Patrizi, G.A.; Martinez, Marino M.; Timon, Robert P.; Sullivan, Charles T.

Results of several experiments aimed at remedying photoresist adhesion failure during spray wet chemical etching of InGaP/GaAs NPN HBTs are reported. Several factors were identified that could influence adhesion and a Design of Experiment (DOE) approach was used to study the effects and interactions of selected factors. The most significant adhesion improvement identified is the incorporation of a native oxide etch immediately prior to the photoresist coat. In addition to improving adhesion, this pre-coat treatment also alters the wet etch profile of (100) GaAs so that the reaction limited etch is more isotropic compared to wafers without surface treatment; the profiles have a positive taper in both the [011] and [011] directions, but the taper angles are not identical. The altered profiles have allowed us to predictably yield fully probe-able HBTs with 5 x 5 {micro}m emitters using 5200 {angstrom} evaporated metal without planarization.

Sullivan, Charles T.; Patrizi, G.A.; Wolfley, Steven L.; Grine, Alejandro J.; Clevenger, Jascinda C.

This paper describes the development and implementation of an integrated resistor process based on reactively sputtered tantalum nitride. Image reversal lithography was shown to be a superior method for liftoff patterning of these films. The results of a response surface DOE for the sputter deposition of the films are discussed. Several approaches to stabilization baking were examined and the advantages of the hot plate method are shown. In support of a new capability to produce special-purpose HBT-based Small-Scale Integrated Circuits (SSICs), we developed our existing TaN resistor process, designed for research prototyping, into one with greater maturity and robustness. Included in this work was the migration of our TaN deposition process from a research-oriented tool to a tool more suitable for production. Also included was implementation and optimization of a liftoff process for the sputtered TaN to avoid the complicating effects of subtractive etching over potentially sensitive surfaces. Finally, the method and conditions for stabilization baking of the resistors was experimentally determined to complete the full implementation of the resistor module. Much of the work to be described involves the migration between sputter deposition tools - from a Kurt J. Lesker CMS-18 to a Denton Discovery 550. Though they use nominally the same deposition technique (reactive sputtering of Ta with N{sup +} in a RF-excited Ar plasma), they differ substantially in their design and produce clearly different results in terms of resistivity, conformity of the film and the difference between as-deposited and stabilized films. We will describe the design of and results from the design of experiments (DOE)-based method of process optimization on the new tool and compare this to what had been used on the old tool.

Wolfley, Steven L.; Clevenger, Jascinda C.; Grine, Alejandro J.; Patrizi, G.A.; Sullivan, Charles T.

Abstract not provided.

Patrizi, G.A.; Martinez, Marino M.; Clevenger, Jascinda C.; Timon, Robert P.; Sullivan, Charles T.; Grine, Alejandro J.

Abstract not provided.

Lee, Mark L.; Lerttamrab, Maytee L.; Grine, Alejandro J.; Reno, J.L.

Abstract not provided.

Spahn, Olga B.; Dagel, Daryl D.; Mani, Seethambal S.; Sweatt, W.C.; Turner, Fawn R.; Grine, Alejandro J.; Adams, David P.; Resnick, Paul J.; Cowan, William D.

Recent world events have underscored the need for a satellite based persistent global surveillance capability. To be useful, the satellite must be able to continuously monitor objects the size of a person anywhere on the globe and do so at a low cost. One way to satisfy these requirements involves a constellation of satellites in low earth orbit capable of resolving a spot on the order of 20 cm. To reduce cost of deployment, such a system must be dramatically lighter than a traditional satellite surveillance system with a high spatial resolution. The key to meeting this requirement is a lightweight optics system with a deformable primary and secondary mirrors and an adaptive optic subsystem correction of wavefront distortion. This proposal is concerned with development of MEMS micromirrors for correction of aberrations in the primary mirror and improvement of image quality, thus reducing the optical requirements on the deployable mirrors. To meet this challenge, MEMS micromirrors must meet stringent criteria on their performance in terms of flatness, roughness and resolution of position. Using Sandia's SUMMIT foundry which provides the world's most sophisticated surface MEMS technology as well as novel designs optimized by finite element analysis will meet severe requirements on mirror travel range and accuracy.