Publications

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We present the experimental procedure to create lattice mismatched multijunction photovoltaic (PV) cells using 3D integration concepts. Lattice mismatched multijunction photovoltaic (PV) cells with decoupled electrical outputs could achieve higher efficiencies than current-matched monolithic devices. Growing lattice mismatched materials as a monolithic structure generates defects and decreases performance. We propose using methods from the integrated circuits and microsystems arena to produce the PV cell. The fabricated device consists of an ultrathin (6 μm) series connected InGaP/GaAs PV cell mechanically stacked on top of an electrically independent silicon cell. The InGaP/GaAs PV cell was processed to produce a small cell (750 μm) with back-contacts where all of the contacts sit at the same level. The dual junction and the silicon (c-Si) cell are electrically decoupled and the power from both cells is accessible through pads on the c-Si PV cell. Through this approach, we were able to fabricate a functional double junction PV cell mechanically attached to a c-Si PV cell with independent connections. © 2012 IEEE.

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As a source of clean, remote energy, photovoltaic (PV) systems are an important area of research. The majority of solar cells are rigid materials with negligible flexibility. Flexible PV systems possess many advantages, such as being transportable and incorporable on diverse structures. Amorphous silicon and organic PV systems are flexible; however, they lack the efficiency and lifetime of rigid cells. There is also a need for PV systems that are light weight, especially in space and flight applications. We propose a solution to this problem by arranging rigid cells onto a flexible substrate creating efficient, light weight, and flexible devices. To date, we have created a working prototype of our design using the 1.1cm x 1cm Emcore cells. We have achieved a better power to weight ratio than commercially available PowerFilm{reg_sign}, which uses thin film silicon yielding .034W/gram. We have also tested our concept with other types of cells and verified that our methods are able to be adapted to any rigid solar cell technology. This allows us to use the highest efficiency devices despite their physical characteristics. Depending on the cell size we use, we can rival the curvature of most available flexible PV devices. We have shown how the benefits of rigid solar cells can be integrated into flexible applications, allowing performance that surpasses alternative technologies.

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This report describes our efforts to quantify the behavior of micro-fabricated THz rectangular waveguides on a configurable, robust semiconductor-based platform. These waveguides are an enabling technology for coupling THz radiation directly from or to lasers, mixers, detectors, antennas, and other devices. Traditional waveguides fabricated on semiconductor platforms such as dielectric guides in the infrared or co-planar waveguides in the microwave regions, suffer high absorption and radiative losses in the THz. The former leads to very short propagation lengths, while the latter will lead to unwanted radiation modes and/or crosstalk in integrated devices. This project exploited the initial developments of THz micro-machined rectangular waveguides developed under the THz Grand Challenge Program, but instead of focusing on THz transceiver integration, this project focused on exploring the propagation loss and far-field radiation patterns of the waveguides. During the 9 month duration of this project we were able to reproduce the waveguide loss per unit of length in the waveguides and started to explore how the loss depended on wavelength. We also explored the far-field beam patterns emitted by H-plane horn antennas attached to the waveguides. In the process we learned that the method of measuring the beam patterns has a significant impact on what is actually measured, and this may have an effect on most of the beam patterns of THz that have been reported to date. The beam pattern measurements improved significantly throughout the project, but more refinements of the measurement are required before a definitive determination of the beam-pattern can be made.

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Higher performance is the main driver in the integrated circuit (IC) market, but along with added function comes the cost of increased input/output connections and larger die sizes. Space saving approaches aimed at solving these challenges includes two technologies; 3D stacking (3D-ICs) and flip chip assemblies. Emerging ICs require sub-micron scale interconnects which include vias for 3D-ICs and bump bonds for flip chips. Photolithographic techniques are commonly used to prepare templates followed by metal vapor deposition to create flip chip bump bonds. Both the lithography step and the metal properties required for bump bonding contribute to limiting this approach to a minimum bump size of ∼10 μm. Here, we present a wet chemistry approach to fabricating uniform bump bonds of tunable size and height down to the nanoscale. Nanosphere lithography (NSL), a "soft" lithographic technique, is used to create a bump bond template or mask for nanoscale bumps. Electrochemical deposition is also used through photoresist templates to create uniform bump bonds across large area wafers or dies. This template approach affords bumps with tunable diameters from 100s of nanometers to microns (allowing for tunable interconnect pitch and via diameters) while the use of constant current electoplating gives uniform bump height over large areas (>1 cm2).

Single-mode 75 μm × 37 μm rectangular waveguide components, including horn antennas, couplers, and bends, for operation at 3 THz have been designed and fabricated using thick gold micromachining. THz transmission through these waveguides has been quasi-optically measured at 2.92 THz. This technology offers the potential for realizing miniature integrated systems operating in the 3 THz frequency range. © 2008 IEEE.

Microfabrication methods have been applied to the fabrication of wire arrays suitable for use in Z. Self-curling GaAs/AlGaAs supports were fabricated as an initial route to make small wire arrays (4mm diameter). A strain relief structure that could be integrated with the wire was designed to allow displacements of the anode/cathode connections in Z. Electroplated gold wire arrays with integrated anode/cathode bus connections were found to be sufficiently robust to allow direct handling. Platinum and copper plating processes were also investigated. A process to fabricate wire arrays on any substrate with wire thickness up to 35 microns was developed. Methods to handle and mount these arrays were developed. Fabrication of wire arrays of 20mm diameter was demonstrated, and the path to 40mm array fabrication is clear. With some final investment to show array mounting into Z hardware, the entire process to produce a microfabricated wire array will have been demonstrated.

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