Publications

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There is a rising interest in developing functional electronics using additively manufactured components. Considerations in materials selection and pathways to forming hybrid circuits and devices must demonstrate useful electronic function; must enable integration; and must complement the complex shape, low cost, high volume, and high functionality of structural but generally electronically passive additively manufactured components. This article reviews several emerging technologies being used in industry and research/development to provide integration advantages of fabricating multilayer hybrid circuits or devices. First, we review a maskless, noncontact, direct write (DW) technology that excels in the deposition of metallic colloid inks for electrical interconnects. Second, we review a complementary technology, aerosol deposition (AD), which excels in the deposition of metallic and ceramic powder as consolidated, thick conformal coatings and is additionally patternable through masking. Finally, we show examples of hybrid circuits/devices integrated beyond 2-D planes, using combinations of DW or AD processes and conventional, established processes.

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The work performed in this project has demonstrated the feasibility to use hydrodynamic focusing of two fluid steams to create a novel micro printing technology for electronics and other high performance applications. Initial efforts focused solely on selective evaporation of the sheath fluid from print stream provided insight in developing a unique print head geometry allowing excess sheath fluid to be separated from the print flow stream for recycling/reuse. Fluid flow models suggest that more than 81 percent of the sheath fluid can be removed without affecting the print stream. Further development and optimization is required to demonstrate this capability in operation. Print results using two-fluid hydrodynamic focusing yielded a 30 micrometers wide by 0.5 micrometers tall line that suggests that the cross-section of the printed feature from the print head was approximately 2 micrometers in diameter. Printing results also demonstrated that complete removal of the sheath fluid is not necessary for all material systems. The two-fluid printing technology could enable printing of insulated conductors and clad optical interconnects. Further development of this concept should be pursued.

An electrochemical probe station (EPS) for automated electrochemical testing of electronic-grade thin films is presented. Similar in design to a scanning droplet cell, this modular system features a flexible probe tip capable of contacting both metallic and oxide surfaces. Using the highly sensitive Pt-H 2SO 4 system, it is demonstrated that the EPS obtains results equivalent to those of a traditional electrochemical cell. Further, electrical testing of thin film PbZr 0.52Ti 0.48O 3 shows that this system may be used to ascertain fundamental electrical properties of dielectric films. © 2012 The Electrochemical Society.

We have demonstrated a novel microfluidic technique for aqueous media, which uses super-hydrophobic materials to create microfluidic channels that are open to the atmosphere. We have demonstrated the ability to perform traditional electrokinetic operations such as ionic separations and electrophoresis using these devices. The rate of evaporation was studied and found to increase with decreasing channel size, which places a limitation on the minimum size of channel that could be used for such a device.

Recent advances in nanoparticle inks have enabled inkjet printing of metal traces and interconnects with very low (100-200°C) process temperatures. This has enabled integration of printable electronics such as antennas and radio frequency identification (RFID) tags with polyimide, teflon, PCBs, and other low temperature substrates. We discuss here printing of nanoparticle inks for three dimensional interconnects, and the apparent mechanism of nanoparticle ink conductivity development at these low process temperatures.