Publications

International Journal of Impact Engineering

Reinhart, William D.; Breiland, William G.; Brown, Justin L.

Abstract not provided.

Journal of Crystal Growth

Creighton, J.R.; Breiland, William G.; Koleske, Daniel K.; Thaler, Gerald T.; Crawford, Mary H.

Abstract not provided.

Proposed for publication in the Journal of Applied Physics.

Breiland, William G.; Koleske, Daniel K.

Abstract not provided.

Proposed for publication in Journal of Crystal Growth.

Creighton, J.R.; Creighton, J.R.; Wang, George T.; Breiland, William G.; Coltrin, Michael E.

Using in situ laser light scattering, we have observed gas-phase nanoparticles formed during AlN, GaN and InN OMVPE. The response of the scattering intensity to a wide range of conditions indicates that the AlN parasitic chemistry is considerably different from the corresponding GaN and InN chemistry. A simple CVD particle-growth mechanism is introduced that can qualitatively explain the observed particle size and yields a strong residence time dependence. We also used FTIR to directly examine the reactivity of the metalorganic precursors with NH{sub 3} in the 25-300 C range. For trimethylaluminum/NH{sub 3} mixtures a facile CH{sub 4} elimination reaction is observed, which also produces gas-phase aminodimethylalane, i.e. Al(CH{sub 3}){sub 2}NH{sub 2}. For trimethylgallium and trimethylindium the dominant reaction is reversible adduct formation. All of the results indicate that the AlN particle-nucleation mechanism is predominately of a concerted nature, while the GaN and InN particle-nucleation mechanisms involve homogeneous pyrolysis and radical chemistry.

Breiland, William G.; Breiland, William G.

A detailed study of an emissivity-correcting pyrometer instrument for measuring wafer surface temperatures during thin film growth is presented. The basic physics is reviewed and preliminary data showing a temperature over-compensation artifact is shown. The rest of the report presents an exhaustive analysis of the potential sources for the temperature over-compensation effect. This analysis yields an in situ calibration method that can be used to remove temperature over-compensation artifacts that arise from any first-order systematic error in either the reflectance or thermal emission measurement. With corrections applied, artifact-free surface temperatures can be measured with a precision of a few {sup o}C over a wide range of wafer emissivities.

Barbour, J.C.; Breiland, William G.; Moffat, Harry K.; Sullivan, John P.; Campin, Michael J.; Wright, Alan F.; Missert, Nancy A.; Braithwaite, J.W.; Zavadil, Kevin R.; Sorensen, Neil R.; Lucero, Samuel J.

A physics-based understanding of material aging mechanisms helps to increase reliability when predicting the lifetime of mechanical and electrical components. This report examines in detail the mechanisms of atmospheric copper sulfidation and evaluates new methods of parallel experimentation for high-throughput corrosion analysis. Often our knowledge of aging mechanisms is limited because coupled chemical reactions and physical processes are involved that depend on complex interactions with the environment and component functionality. Atmospheric corrosion is one of the most complex aging phenomena and it has profound consequences for the nation's economy and safety. Therefore, copper sulfidation was used as a test-case to examine the utility of parallel experimentation. Through the use of parallel and conventional experimentation, we measured: (1) the sulfidation rate as a function of humidity, light, temperature and O{sub 2} concentration; (2) the primary moving species in solid state transport; (3) the diffusivity of Cu vacancies through Cu{sub 2}S; (4) the sulfidation activation energies as a function of relative humidity (RH); (5) the sulfidation induction times at low humidities; and (6) the effect of light on the sulfidation rate. Also, the importance of various sulfidation mechanisms was determined as a function of RH and sulfide thickness. Different models for sulfidation-reactor geometries and the sulfidation reaction process are presented.

Conference Digest - IEEE International Semiconductor Laser Conference

Fischer, Arthur J.; Klem, John F.; Choquette, K.D.; Blum, O.; Allerman, A.A.; Fritz, I.J.; Kurtz, S.R.; Breiland, William G.; Sieg, R.; Geib, K.M.; Scott, J.W.; Naone, R.L.

The continuous wave operation of 1.3 μm vertical cavity surface emitting laser (VCSEL) grown on GaAs substrates is achieved up to 55 °C, as motivated by demands of emerging VCSEL network applications. These VCSELs employ the mature AlGaAs/GaAs distributed Bragg reflector mirror technology, including selective oxidation for efficient cavity designs. By incorporating a tunnel junction near the optical cavity, both mirrors are doped n-type, which provides the benefits of low optical loss.

Electronic Letters

Choquette, K.D.; Geib, K.M.; Klem, John F.; Fischer, Arthur J.; Spahn, Olga B.; Allerman, A.A.; Fritz, I.J.; Kurtz, S.R.; Breiland, William G.

Selectively oxidized vertical cavity lasers emitting at 1294 nm using InGaAsN quantum wells are reported for the first time which operate continuous wave at and above room temperature. The lasers employ two n-type Al{sub 0.94}Ga{sub 0.06}As/GaAs distributed Bragg reflectors each with a selectively oxidized current aperture adjacent to the optical cavity, and the top output mirror contains a tunnel junction to inject holes into the active region. Continuous wave single mode lasing is observed up to 55 C. These lasers exhibit the longest wavelength reported to date for vertical cavity surface emitting lasers grown on GaAs substrates.

Ashby, Carol I.; Vawter, Gregory A.; Zubrzycki, Walter J.; Breiland, William G.; Bruskas, Larry A.; Woodworth, Joseph R.; Hebner, Gregory A.

In-situ optical diagnostics and ion beam diagnostics for plasma-etch and reactive-ion-beam etch (RIBE) tools have been developed and implemented on etch tools in the Compound Semiconductor Research Laboratory (CSRL). The optical diagnostics provide real-time end-point detection during plasma etching of complex thin-film layered structures that require precision etching to stop on a particular layer in the structure. The Monoetch real-time display and analysis program developed with this LDRD displays raw and filtered reflectance signals that enable an etch system operator to stop an etch at the desired depth within the desired layer. The ion beam diagnostics developed with this LDRD will permit routine analysis of critical ion-beam profile characteristics that determine etch uniformity and reproducibility on the RIBE tool.