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Sprague, Michael S.; Ananthan, Shreyas A.; Binyahib, Roba B.; Brazell, Michael B.; de Frahan, Marc H.; King, Ryan N.; Mullowney, Paul M.; Rood, Jon R.; Sharma, Ashesh S.; Thomas, Stephen T.; Vijayakumar, Ganesh V.; Crozier, Paul C. ; Berger-Vergiat, Luc B. ; Cheung, Lawrence C. ; Dement, David C. ; deVelder, Nathaniel d. ; Glaze, D.J. ; Hu, Jonathan J. ; Knaus, Robert C. ; Lee, Dong H. ; Matula, Neil M. ; Okusanya, Tolulope O. ; Overfelt, James R. ; Rajamanickam, Sivasankaran R. ; Sakievich, Philip S. ; Smith, Timothy A. ; Vo, Johnathan V. ; Williams, Alan B. ; Yamazaki, Ichitaro Y. ; Turner, William J. ; Prokopenko, Andrey P.; Wilson, Robert V.; Moser,
&.; Melvin, Jeremy M.; Sitaraman,
&.
Sprague, M.S.; Ananthan, S.A.; Brazell, M.x.; Glaws, A.G.; De Frahan, M.D.; King, R.K.; Natarajan, M.N.; Rood, J.R.; Sharma, A.L.; Sirydowicz, K.S.; S., Thomas S.; Vijaykumar, G.V.; Yellapantula, S.Y.; Crozier, Paul C. ; Berger-Vergiat, Luc B. ; Cheung, Lawrence C. ; Glaze, D.J. ; Hu, Jonathan J. ; Knaus, Robert C. ; Lee, Dong H. ; Okusanya, Tolulope O. ; Overfelt, James R. ; Rajamanickam, Sivasankaran R. ; Sakievich, Philip S. ; Smith, Timothy A. ; Vo, Johnathan V. ; Williams, Alan B. ; Yamazaki, Ichitaro Y. ; Turner, J.H.; Prokopenko, A.P.; Wilson, R.W.; Moser, R.M.; Melvin, J.M.; Sitaraman, J S.
Tencer, John T. ; Okusanya, Tolulope O. ; Hetzler, Adam C.
Tencer, John T. ; Hetzler, Adam C. ; Okusanya, Tolulope O.
Tencer, John T. ; Akau, Ronald L. ; Dobranich, Dean D. ; Brown, Alexander B. ; Dodd, Amanda B. ; Hogan, Roy E. ; Okusanya, Tolulope O. ; Phinney, Leslie M. ; Pierce, Flint P.
Thermal analysts address a wide variety of applications requiring the simulation of radiation heat transfer phenomena. The re are gaps in the currently available modeling capabilities. Addressing these gaps w ould allow for the consideration of additional physics and increase confidence in simulation predictions. This document outlines a five year plan to address the current and future needs of the analyst community with regards to modeling radiation heat tran sfer processes. This plan represents a significant multi - year effort that must be supported on an ongoing basis.
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