Publications

Sprague, Michael S.; Ananthan, Shreyas A.; Binyahib, Roba B.; Brazell, Michael B.; de Frahan, Marc H.; King, Ryan N.; Mullowney, Paul M.; Rood, Jon R.; Sharma, Ashesh S.; Thomas, Stephen T.; Vijayakumar, Ganesh V.; Crozier, Paul C.; Berger-Vergiat, Luc B.; Cheung, Lawrence C.; Dement, David C.; deVelder, Nathaniel d.; Glaze, D.J.; Hu, Jonathan J.; Knaus, Robert C.; Lee, Dong H.; Matula, Neil M.; Okusanya, Tolulope O.; Overfelt, James R.; Rajamanickam, Sivasankaran R.; Sakievich, Philip S.; Smith, Timothy A.; Vo, Johnathan V.; Williams, Alan B.; Yamazaki, Ichitaro Y.; Turner, William J.; Prokopenko, Andrey P.; Wilson, Robert V.; Moser, &.; Melvin, Jeremy M.; Sitaraman, &.

Abstract not provided.

Sprague, M.S.; Ananthan, S.A.; Brazell, M.x.; Glaws, A.G.; De Frahan, M.D.; King, R.K.; Natarajan, M.N.; Rood, J.R.; Sharma, A.L.; Sirydowicz, K.S.; S., Thomas S.; Vijaykumar, G.V.; Yellapantula, S.Y.; Crozier, Paul C.; Berger-Vergiat, Luc B.; Cheung, Lawrence C.; Glaze, D.J.; Hu, Jonathan J.; Knaus, Robert C.; Lee, Dong H.; Okusanya, Tolulope O.; Overfelt, James R.; Rajamanickam, Sivasankaran R.; Sakievich, Philip S.; Smith, Timothy A.; Vo, Johnathan V.; Williams, Alan B.; Yamazaki, Ichitaro Y.; Turner, J.H.; Prokopenko, A.P.; Wilson, R.W.; Moser, R.M.; Melvin, J.M.; Sitaraman, J S.

Abstract not provided.

Tencer, John T.; Okusanya, Tolulope O.; Hetzler, Adam C.

Abstract not provided.

Tencer, John T.; Hetzler, Adam C.; Okusanya, Tolulope O.

Abstract not provided.

Tencer, John T.; Akau, Ronald L.; Dobranich, Dean D.; Brown, Alexander B.; Dodd, Amanda B.; Hogan, Roy E.; Okusanya, Tolulope O.; Phinney, Leslie M.; Pierce, Flint P.

Thermal analysts address a wide variety of applications requiring the simulation of radiation heat transfer phenomena. The re are gaps in the currently available modeling capabilities. Addressing these gaps w ould allow for the consideration of additional physics and increase confidence in simulation predictions. This document outlines a five year plan to address the current and future needs of the analyst community with regards to modeling radiation heat tran sfer processes. This plan represents a significant multi - year effort that must be supported on an ongoing basis.