Publications

Martin, Tina T.

Abstract not provided.

Youchison, Dennis L.; Martin, Tina T.; Pasik, Michael F.; Coats, Rebecca S.; Kotulski, J.D.; Natoni, Gregory N.; Garde, J.

Abstract not provided.

Garde, J.; Youchison, Dennis L.; Natoni, Gregory N.; Martin, Tina T.

Abstract not provided.

McDonald, Jimmie M.; Lutz, Thomas J.; Ulrickson, M.A.; Martin, Tina T.; Youchison, Dennis L.; Nygren, Richard E.

Abstract not provided.

Renk, Timothy J.; Martin, Tina T.

Abstract not provided.

Garde, J.; Youchison, Dennis L.; Natoni, Gregory N.; Martin, Tina T.

Abstract not provided.

McDonald, Jimmie M.; Lutz, Thomas J.; Ulrickson, M.A.; Martin, Tina T.; Youchison, Dennis L.; Nygren, Richard E.

Abstract not provided.

Martin, Tina T.; Ulrickson, M.A.

Abstract not provided.

Renk, Timothy J.; Provencio, P.N.; Martin, Tina T.; Olson, Craig L.

Abstract not provided.

Martin, Tina T.; Ulrickson, M.A.

Abstract not provided.

Martin, Tina T.; Troncosa, K.P.

In preparation for developing a Z-pinch IFE power plant, the interaction of ferritic steel with the coolant, FLiBe, must be explored. Sandia National Laboratories Fusion Technology Department was asked to drop molten ferritic steel and FLiBe in a vacuum system and determine the gas byproducts and ability to recycle the steel. We tried various methods of resistive heating of ferritic steel using available power supplies and easily obtained heaters. Although we could melt the steel, we could not cause a drop to fall. This report describes the various experiments that were performed and includes some suggestions and materials needed to be successful. Although the steel was easily melted, it was not possible to drip the molten steel into a FLiBe pool Levitation melting of the drop is likely to be more successful.

Martin, Tina T.; Smith, Brandon M.; Troncosa, K.P.; Nygren, Richard E.; McDonald, Jimmie M.; Ulrickson, M.A.

Abstract not provided.

Martin, Tina T.; Nowlen, Steven P.

Smoke can cause interruptions and upsets in active electronics. Because nuclear power plants are replacing analog with digital instrumentation and control systems, qualification guidelines for new systems are being reviewed for severe environments such as smoke and electromagnetic interference. Active digital systems, individual components, and active circuits have been exposed to smoke in a program sponsored by the U.S. Nuclear Regulatory Commission. The circuits and systems were all monitored during the smoke exposure, indicating any immediate effects of the smoke. The major effect of smoke has been to increase leakage currents (through circuit bridging across contacts and leads) and to cause momentary upsets and failures in digital systems. This report summarizes two previous reports and presents new results from conformal coating, memory chip, and hard drive tests. The report describes practices for mitigation of smoke damage through digital system design, fire barriers, ventilation, fire suppressants, and post fire procedures.

Martin, Tina T.; Baynes, Edward E.; Nowlen, Steven P.; Brockmann, John E.; Gritzo, Louis A.; Shaddix, Christopher R.

Smoke is known to cause electrical equipment failure, but the likelihood of immediate failure during a fire is unknown. Traditional failure assessment techniques measure the density of ionic contaminants deposited on surfaces to determine the need for cleaning or replacement of electronic equipment exposed to smoke. Such techniques focus on long-term effects, such as corrosion, but do not address the immediate effects of the fire. This document reports the results of tests on the immediate effects of smoke on electronic equipment. Various circuits and components were exposed to smoke from different fields in a static smoke exposure chamber and were monitored throughout the exposure. Electrically, the loss of insulation resistance was the most important change caused by smoke. For direct current circuits, soot collected on high-voltage surfaces sometimes formed semi-conductive soot bridges that shorted the circuit. For high voltage alternating current circuits, the smoke also tended to increase the likelihood of arcing, but did not accumulate on the surfaces. Static random access memory chips failed for high levels of smoke, but hard disk drives did not. High humidity increased the conductive properties of the smoke. The conductivity does not increase linearly with smoke density as first proposed; however, it does increase with quantity. The data can be used to give a rough estimate of the amount of smoke that will cause failures in CMOS memory chips, dc and ac circuits. Comparisons of this data to other fire tests can be made through the optical and mass density measurements of the smoke.