Effectiveness of Versalink 143 on Improving Shock Survival of Encapsulated Electronics
In the past, test-vehicle-mounted instrumentation modules that record sensor data during shock and vibration events have been coated with a polymer isolation layer to enhance survivability. This study uses finite element modeling to evaluate the effectiveness of the isolation material Versalink 143 on reducing stress in an instrumentation module. The modeling shows that while the isolation layer does attenuate stress due to high frequency shock and vibration, it also amplifies stress due to lower frequency shock and vibration. Thicker layers tend to attenuate high frequency stress more and amplify low frequency stress less. In addition, at higher test temperatures thermal expansion of the isolation layer can cause static stress in the module far greater than the stress due to shock, depending on how the module is constrained within the test vehicle. When designing and implementing vehicle- mounted instrumentation modules, the expected input shock spectrum, mounting constraints, and static effects of temperature must be carefully considered.