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ViArray standard platforms: Rad-hard structured ASICs for digital and mixed-signal applications

IEEE Aerospace Conference Proceedings

Teifel, John T.; Flores, Richard S.; Pearson, Sean P.; Begay, Cynthia B.; Ma, Kwok-Kee M.; Palmer, Jeremy A.

Sandia's radiation-hardened ViArray standard platforms use via-configurable circuits to create quick-turn, low-cost structured ASICs (Application Specific Integrated Circuits). Via-configurable technology enables performance similar to standard-cell ASICs, but with low-volume costs approaching that of programmable logic devices. Due to their significantly lower development cost and shorter production times, ViArray ASICs are rapidly replacing custom ASICs in Sandia's high-reliability digital and analog applications. This paper describes the Eiger ViArray platform, which is optimized for general-purpose digital applications, and the Whistler ViArray platform, which is optimized for mixed-signal instrumentation and state-of-health applications. 1 2 3 © 2012 IEEE.

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TYPE Conference YEAR 2012
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High speed (GHZ), ultra-high pressure (GPA) sensor array fabricated in integrated CMOS+MEMS process

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Okandan, Murat O.; Olsson, Roy H.; Baker, Michael; Resnick, Paul J.; Hill, Thomas A.; Lackey, Chad; Pearson, Sean P.; Castaneda, Jaime N.; Trott, Wayne T.; Jones, David A.

In order to observe and quantify pressure levels generated during testing of energetic materials, a sensor array with high temporal resolution (∼1 ns) and extremely high pressure range (> 1 GPa) is needed. We have developed such a sensor array which utilizes a novel integrated high performance CMOS+MEMS process. ©2009 IEEE.

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TYPE Conference YEAR 2009
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8 Results
8 Results