1520 Poster 3 of 5: Experimental structural dynamics and modal analysis unlock the principal components of dynamics
Abstract not provided.
Publications
Multi-Layered Solid State Neutron Sensor
Abstract not provided.
Failure Analysis and Process Verification of High Density Copper ICs
Abstract not provided.
Failure analysis and process verification of high density copper ICs used in multi-chip modules (MCM)
Conference Proceedings from the International Symposium for Testing and Failure Analysis
Manufacturing of integrated circuits (ICs) using a split foundry process expands design space in IC fabrication by employing unique capabilities of multiple foundries and provides added security for IC designers [1] Defect localization and root cause analysis is critical to failure identification and implementation of corrective actions. In addition to split-foundry fabrication, the device addressed in this publication is .comprised of 8 metal layers, aluminum test pads, and tungsten thru-silicon vias (TSVs) making the circuit area > 68% metal. This manuscript addresses the failure analysis efforts involved in root cause analysis, failure analysis findings, and the corrective actions implemented to eliminate these failure mechanisms from occurring in future product.
Advancing 3D Printing of Metals and Electronics using Computational Fluid Dynamics
Abstract not provided.
Application and Improvement with Aerosol Based Printing Technology for Electronic Applications
Abstract not provided.
3D Reversible Interconnect
Abstract not provided.
LAMB WAVE MICROMECHANICAL RESONATORS FORMED IN THIN PLATES OF LITHIUM NIOBATE
Abstract not provided.
Reversible Electrical Bonding For Large Area Device Verification
Abstract not provided.
9 Results