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Torsional ratcheting actuating system

2000 International Conference on Modeling and Simulation of Microsystems - MSM 2000

Barnes, Stephen M.; Miller, Samuel L.; Rodgers, Murray S.; Bitsie, Fernando

A new type of surface micromachined ratcheting actuation system has been developed at the Microelectronics Development Laboratory at Sandia National Laboratories. The actuator uses a torsional electrostatic comb drive that is coupled to an external ring gear through a ratcheting scheme. The actuator can be operated with a single square wave, has minimal rubbing surfaces, maximizes comb finger density, and can be used for open-loop position control. The prototypes function as intended with a minimum demonstrated operating voltage of 18V. The equations of motion are developed for the torsional electrostatic comb drive. The resonant frequency, voltage vs. displacement and force delivery characteristics are predicted and compared with the fabricated device's performance.

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Materials Issues for Micromachines Development - ASCI Program Plan

Fang, H.E.; Miller, Samuel L.; Dugger, Michael T.; Prasad, Somuri V.; Reedy, Earl D.; Thompson, Aidan P.; Wong, Chungnin C.; Yang, Pin Y.; Battaile, Corbett C.; Battaile, Corbett C.; Benavides, Gilbert L.; Ensz, M.T.; Buchheit, Thomas E.; Chen, Er-Ping C.; Christenson, Todd R.; De Boer, Maarten P.

This report summarizes materials issues associated with advanced micromachines development at Sandia. The intent of this report is to provide a perspective on the scope of the issues and suggest future technical directions, with a focus on computational materials science. Materials issues in surface micromachining (SMM), Lithographic-Galvanoformung-Abformung (LIGA: lithography, electrodeposition, and molding), and meso-machining technologies were identified. Each individual issue was assessed in four categories: degree of basic understanding; amount of existing experimental data capability of existing models; and, based on the perspective of component developers, the importance of the issue to be resolved. Three broad requirements for micromachines emerged from this process. They are: (1) tribological behavior, including stiction, friction, wear, and the use of surface treatments to control these, (2) mechanical behavior at microscale, including elasticity, plasticity, and the effect of microstructural features on mechanical strength, and (3) degradation of tribological and mechanical properties in normal (including aging), abnormal and hostile environments. Resolving all the identified critical issues requires a significant cooperative and complementary effort between computational and experimental programs. The breadth of this work is greater than any single program is likely to support. This report should serve as a guide to plan micromachines development at Sandia.

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MEMS Reliability: Infrastructure, Test Structures, Experiments, and Failure Modes

Walraven, J.A.; Smith, Norman F.; Irwin, Lloyd W.; Helgesen, Karen S.; Clement, John J.; Miller, Samuel L.; Dugger, Michael T.

The burgeoning new technology of Micro-Electro-Mechanical Systems (MEMS) shows great promise in the weapons arena. We can now conceive of micro-gyros, micro-surety systems, and micro-navigators that are extremely small and inexpensive. Do we want to use this new technology in critical applications such as nuclear weapons? This question drove us to understand the reliability and failure mechanisms of silicon surface-micromachined MEMS. Development of a testing infrastructure was a crucial step to perform reliability experiments on MEMS devices and will be reported here. In addition, reliability test structures have been designed and characterized. Many experiments were performed to investigate failure modes and specifically those in different environments (humidity, temperature, shock, vibration, and storage). A predictive reliability model for wear of rubbing surfaces in microengines was developed. The root causes of failure for operating and non-operating MEMS are discussed. The major failure mechanism for operating MEMS was wear of the polysilicon rubbing surfaces. Reliability design rules for future MEMS devices are established.

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3 Results
3 Results