Carrier transport and recombination are modeled for a heterojunction diode containing irradiation defects. Detailed attention is given to the role of band-to-trap tunneling and how it is affected by band offsets at the junction. Tunneled states are characterized by numerical solution of the one-band effective-mass envelope equation. The interaction with traps is treated assuming capture by the multi-phonon-emission mechanism. It is shown that tunneling can increase carrier recombination at defects by orders of magnitude in the presence of large band offsets. This explains why Npn InGaP/GaAs/GaAs heterojunction bipolar transistors with displacement damage from energetic-particle irradiation are observed to have high carrier recombination in the emitter-base depletion region.
A model is presented for recombination of charge carriers at evolving displacement damage in gallium arsenide, which includes clustering of the defects in atomic displacement cascades produced by neutron or ion irradiation. The carrier recombination model is based on an atomistic description of capture and emission of carriers by the defects with time evolution resulting from the migration and reaction of the defects. The physics and equations on which the model is based are presented, along with the details of the numerical methods used for their solution. The model uses a continuum description of diffusion, field-drift and reaction of carriers, and defects within a representative spherically symmetric cluster of defects. The initial radial defect profiles within the cluster were determined through pair-correlation-function analysis of the spatial distribution of defects obtained from the binary-collision code MARLOWE, using recoil energies for fission neutrons. Properties of the defects are discussed and values for their parameters are given, many of which were obtained from density functional theory. The model provides a basis for predicting the transient response of III-V heterojunction bipolar transistors to displacement damage from energetic particle irradiation.
As part of Sandia's program to simulate the effect of displacement damage on operation of heterojunction bipolar transistors (HBTs), we are examining the formulation in 1-D of band-to-band (bb) and band-to-trap (b-t) carrier tunneling.
This SAND report is the final report on Sandia's Grand Challenge LDRD Project 27328, 'A Revolution in Lighting -- Building the Science and Technology Base for Ultra-Efficient Solid-state Lighting.' This project, which for brevity we refer to as the SSL GCLDRD, is considered one of Sandia's most successful GCLDRDs. As a result, this report reviews not only technical highlights, but also the genesis of the idea for Solid-state Lighting (SSL), the initiation of the SSL GCLDRD, and the goals, scope, success metrics, and evolution of the SSL GCLDRD over the course of its life. One way in which the SSL GCLDRD was different from other GCLDRDs was that it coincided with a larger effort by the SSL community - primarily industrial companies investing in SSL, but also universities, trade organizations, and other Department of Energy (DOE) national laboratories - to support a national initiative in SSL R&D. Sandia was a major player in publicizing the tremendous energy savings potential of SSL, and in helping to develop, unify and support community consensus for such an initiative. Hence, our activities in this area, discussed in Chapter 6, were substantial: white papers; SSL technology workshops and roadmaps; support for the Optoelectronics Industry Development Association (OIDA), DOE and Senator Bingaman's office; extensive public relations and media activities; and a worldwide SSL community website. Many science and technology advances and breakthroughs were also enabled under this GCLDRD, resulting in: 55 publications; 124 presentations; 10 book chapters and reports; 5 U.S. patent applications including 1 already issued; and 14 patent disclosures not yet applied for. Twenty-six invited talks were given, at prestigious venues such as the American Physical Society Meeting, the Materials Research Society Meeting, the AVS International Symposium, and the Electrochemical Society Meeting. This report contains a summary of these science and technology advances and breakthroughs, with Chapters 1-5 devoted to the five technical task areas: 1 Fundamental Materials Physics; 2 111-Nitride Growth Chemistry and Substrate Physics; 3 111-Nitride MOCVD Reactor Design and In-Situ Monitoring; 4 Advanced Light-Emitting Devices; and 5 Phosphors and Encapsulants. Chapter 7 (Appendix A) contains a listing of publications, presentations, and patents. Finally, the SSL GCLDRD resulted in numerous actual and pending follow-on programs for Sandia, including multiple grants from DOE and the Defense Advanced Research Projects Agency (DARPA), and Cooperative Research and Development Agreements (CRADAs) with SSL companies. Many of these follow-on programs arose out of contacts developed through our External Advisory Committee (EAC). In h s and other ways, the EAC played a very important role. Chapter 8 (Appendix B) contains the full (unedited) text of the EAC reviews that were held periodically during the course of the project.
A study was performed on the atomic configurations corresponding to local-energy minima for the neutral MgH complex in wurtzite GaN. The density-functional theory and the generalized-gradient approximation for exchange and correlation were used for the identification. The results showed that the dominant configuration consisted of H at an antibonding site of a N neighbor of the substitutional Mg, and the Mg-N and N-H bonds were nearly aligned.
Quantitative comparisons of dissolved hydrogen density and the electrical and optical properties of ZnO were studied. Optical measurements were employed to provide site specific information about the lattice location of hydrogen. The donors were responsible for the large increased in electron concentration seen in ZnO samples annealed at elevated temperatures in H2 gas.
Mechanisms of H release from Mg-doped, p-type GaN were investigated in vacuum, in N{sub 2} and O{sub 2} gases, and in electron-cyclotron-resonance N{sub 2} plasmas. Replacing grown-in protium with deuterium (D) and employing sensitive nuclear-reaction analysis allowed the retained concentration to be followed quantitatively over two decades during isothermal heating, illuminating the kinetics of controlling processes. Oxidation attending the O{sub 2} exposures was monitored through nuclear-reaction analysis of {sup 18}O. N{sub 2} gas at atmospheric pressure increases the rate of D release appreciably relative to vacuum. The acceleration produced by O{sub 2} gas is much greater, but is diminished in later stages of the release by oxidation. The N{sub 2} plasma employed in these studies had no resolvable effect. We argue that surface desorption is rate controlling in the D release, and that it occurs by D-D recombination and the formation of N-D and O-D species. Our results are quantitatively consistent with a theoretical model wherein the bulk solution is in equilibrium with surface states from which desorption occurs by processes that are both first and second order in surface coverage.
Ion implantation of O and Al were used to form nanometer-size precipitates of NiO or Al{sub 2}O{sub 3} in the near-surface of Ni. The yield strengths of the treated layers were determined by nanoindentation testing in conjunction with finite-element modeling. The strengths range up to {approximately}5 GPa, substantially above values for hard bearing steels. These results agree quantitatively with predictions of dispersion-hardening theory based on the precipitate microstructures observed by transmission electron microscopy. Such surface hardening by ion implantation may be beneficial for Ni components in micro-electromechanical systems.
Very fine-grained Ni and Cu films were formed using pulsed laser deposition onto fused silica substrates. The grain sizes in the films were characterized by electron microscopy, and the mechanical properties were determined by ultra-low load indentation, with finite-element modeling used to evaluate the properties of the layers separately from those of the substrate. Some Ni films were also examined after annealing to 350 and 450 °C to enlarge the grain sizes. These preliminary results show that the observed hardnesses are consistent with a simple extension of the Hall-Petch relationship to grain sizes as small as 11 nm for Ni and 32 nm for Cu.
We demonstrate that the insertion of low-temperature (LT) AlGaN interlayers is effective in reducing mismatch-induced tensile stress and suppressing the formation of cracks during growth of AlGaN directly upon GaN epilayers., Stress evolution and relaxation is monitored using an in-situ optical stress sensor. The combination of in-situ and ex-situ. characterization techniques enables us to determine the degree of pseudomorphism in the interlayers. It is observed that the elastic tensile mismatch between AlGaN and GaN is mediated by the relaxation of interlayers; the use of interlayers offers tunability in the in-plane lattice parameters.
The diffusion, uptake, and release of H in p-type GaN are modeled employing state energies from density-function theory and compared with measurements of deuterium uptake and release using nuclear-reaction analysis. Good semiquantitative agreement is found when account is taken of a surface permeation barrier.
Formation energies and vibrational frequencies for H in wurtzite GaN were calculated from density functional theory and used to predict equilibrium state occupancies and solid solubilities for p-type, intrinsic, and n-type material. The solubility of deuterium (D) was measured at 600--800 C as a function of D{sub 2} pressure and doping and compared with theory. Agreement was obtained by reducing the H formation energies 0.2 eV from ab-initio theoretical values. The predicted stretch-mode frequency for H bound to the Mg acceptor lies 5% above an observed infrared absorption attributed to this complex. It is concluded that currently recognized H states and physical processes account for the equilibrium behavior of H examined in this work.
Copper in Si is shown to be strongly gettered by Al-rich precipitates formed by implanting Al to supersaturation and followed by annealing. At temperatures ranging from 600 to 800 C a layer containing Al precipitates is found to getter Cu from Cu silicide located on the opposite side of a 0.25-mm Si wafer, indicating a substantially lower chemical potential for the Cu in the molten-A1 phase. Cu gettering proceeds rapidly until an atomic ratio of approximately 2 Cu atoms to 1 Al atom is reached in the precipitated Al region, after which the gettering process slows. Redistribution of Cu from one Al-rich layer to another at low Cu concentrations demonstrates that a segregation-type gettering mechanism is operating. Cu gettering occurs primarily in the region containing the precipitated Al rather than the region where the Al is entirely substitutional.
We report the growth and characterization of quaternary AlGaInN. A combination of photoluminescence (PL), high-resolution x-ray diffraction (XRD), and Rutherford backscattering spectrometry (RBS) characterizations enables us to explore the contours of constant PL peak energy and lattice parameter as functions of the quaternary compositions. The observation of room temperature PL emission at 351nm (with 20% Al and 5% In) renders initial evidence that the quaternary could be used to provide confinement for GaInN (and possibly GaN). AlGaInN/GrdnN MQW heterostructures have been grown; both XRD and PL measurements suggest the possibility of incorporating this quaternary into optoelectronic devices.
The LDRD entitled ``Role of Defects in III-Nitride Based Devices'' is aimed to place Sandia National Laboratory at the forefront of the field of GaN materials and devices by establishing a scientific foundation in areas such as material growth, defect characterization/modeling, and processing (metalization and etching) chemistry. In this SAND report the authors summarize their studies such as (1) the MOCVD growth and doping of GaN and AlGaN, (2) the characterization and modeling of hydrogen in GaN, including its bonding, diffusion, and activation behaviors, (3) the calculation of energetic of various defects including planar stacking faults, threading dislocations, and point defects in GaN, and (4) dry etching (plasma etching) of GaN (n- and p-types) and AlGaN. The result of the first AlGaN/GaN heterojunction bipolar transistor is also presented.