Progress and Challenges in Developing a Reliable Embedded ReRAM Memory for Hostile Environments
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This report discusses aspects of neuromorphic computing and how it is used to model microsystems.
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Proceedings - Electrochemical Society
Charge transport and dielectric breakdown is studied in silicon oxynitride films with optical index of refraction varying from 1.77 to 2.01, and thickness ranging from 20 to 50 nm. Assuming Poole-Frenkel emission as the dominant charge transport mechanism, a compositionally dependent ionization potential ranging from 1.22 to 1.51 eV is observed. Over the same composition range, the barrier lowering energy at the point of dielectric breakdown is independently determined to vary between 1.24 and 1.56 eV. The correlation between these energies suggests a causal relationship between field saturation-induced trap ionization and dielectric breakdown. It is concluded that in the vicinity of the field saturation point a diminished capacity for regulating hot electron injection via the action of charge trapping results in an increased probability for impact ionization and subsequent dielectric breakdown.
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Proposed for publication in Applied Physics Letters.
Poole-Frenkel emission in Si-rich nitride and silicon oxynitride thin films is studied in conjunction with compositional aspects of their elastic properties. For Si-rich nitrides varying in composition from SiN{sub 1.33} to SiN{sub 0.54}, the Poole-Frenkel trap depth ({Phi}{sub B}) decreases from 1.08 to 0.52 eV as the intrinsic film strain ({Epsilon}{sub i}) decreases from 0.0036 to -0.0016. For oxynitrides varying in composition from SiN{sub 1.33} to SiO{sub 1.49}N{sub 0.35}, {Phi}{sub B} increases from 1.08 to 1.53 eV as {Epsilon}{sub i} decreases from 0.0036 to 0.0006. In both material systems, a direct correlation is observed between {Phi}{sub B} and {Epsilon}{sub i}. Compositionally induced strain relief as a mechanism for regulating {Phi}{sub B} is discussed.