Publications

Mondy, L.A.; Mondy, L.A.; Rao, Rekha R.; Lindgren, Eric R.; Sun, Amy C.; Lagasse, Robert R.; Thompson, Kyle R.

Abstract not provided.

Anderson, Robert A.; Lagasse, Robert R.; Schroeder, John L.; Zeuch, David H.; Montgomery, Stephen M.

Aluminum oxide (ALOX) filled epoxy is the dielectric encapsulant in shock driven high-voltage power supplies. ALOX encapsulants display a high dielectric strength under purely electrical stress, but minimal information is available on the combined effects of high voltage and mechanical shock. We report breakdown results from applying electrical stress in the form of a unipolar high-voltage pulse of the order of 10-{micro}s duration, and our findings may establish a basis for understanding the results from proposed combined-stress experiments. A test specimen geometry giving approximately uniform fields is used to compare three ALOX encapsulant formulations, which include the new-baseline 459 epoxy resin encapsulant and a variant in which the Alcoa T-64 alumina filler is replaced with Sumitomo AA-10 alumina. None of these encapsulants show a sensitivity to ionizing radiation. We also report results from specimens with sharp-edged electrodes that cause strong, localized field enhancement as might be present near electrically-discharged mechanical fractures in an encapsulant. Under these conditions the 459-epoxy ALOX encapsulant displays approximately 40% lower dielectric strength than the older Z-cured Epon 828 formulation. An investigation of several processing variables did not reveal an explanation for this reduced performance. The 459-epoxy encapsulant appears to suffer electrical breakdown if the peak field anywhere reaches a critical level. The stress-strain characteristics of Z-cured ALOX encapsulant are measured under high triaxial pressure and we find that this stress causes permanent deformation and a network of microscopic fractures. Recommendations are made for future experimental work.

Journal of Materials Research

Lagasse, Robert R.; Thompson, Kyle R.

The goal of this work is to develop techniques for measuring gradients in particle concentration within filled polymers, such as encapsulant. A high concentration of filler particles is added to such materials to tailor physical properties such as thermal expansion coefficient. Sedimentation and flow-induced migration of particles can produce concentration gradients that are most severe near material boundaries. Therefore, techniques for measuring local particle concentration should be accurate near boundaries. Particle gradients in an alumina-filled epoxy resin are measured with a spatial resolution of 0.2 mm using an x-ray beam attenuation technique, but an artifact related to the finite diameter of the beam reduces accuracy near the specimen's edge. Local particle concentration near an edge can be measured more reliably using microscopy coupled with image analysis. This is illustrated by measuring concentration profiles of glass particles having 40 {micro}m median diameter using images acquired by a confocal laser fluorescence microscope. The mean of the measured profiles of volume fraction agrees to better than 3% with the expected value, and the shape of the profiles agrees qualitatively with simple theory for sedimentation of monodisperse particles. Extending this microscopy technique to smaller, micron-scale filler particles used in encapsulant for microelectronic devices is illustrated by measuring the local concentration of an epoxy resin containing 0.41 volume fraction of silica.