Publications

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The run-out phenomenon was observed in Ag-Cu-Zr active braze joints made between the alumina ceramic and Kovar™ base material. Run-out introduces a significant yield loss by generating functional and/or cosmetic defects in brazements. A prior study identified a correlation between run-out and the aluminum (Al) released by the reduction/oxidation reaction with alumina and aluminum's reaction with the Kovar™ base material. A study was undertaken to understand the fundamental principles of run-out by examining the interface reaction between Ag-xAl filler metals (x = 2,5, and 10 wt-%) and Kovar™ base material. Sessile drop samples were fabricated using brazing temperatures of 965° (T769°F) or 995°C 0823°F) and times of 5 or 20 min. The correlation was made between the degree of wetting and spreading by the sessile drops and the run-out phenomenon. Wetting and spreading increased with Al content (x) of the. Ag-xAl filler metal, but was largely insensitive to the brazing process parameters. The increased Al concentration resulted in higher Al contents of the (Fe, Ni, Co)xAly reaction layer. Run-out was predicted when the filler metal has a locally elevated Al content exceeding 2-5 wt-%. Several mitigation strategies were proposed, based upon these findings.

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The transient transport of electrolytes in thermally-activated batteries is studied using electron probe micro-analysis (EPMA), demonstrating the robust capability of EPMA as a useful tool for studying and quantifying mass transport within porous materials, particularly in difficult environments where classical flow measurements are challenging. By tracking the mobility of bromine and potassium ions from the electrolyte stored within the separator into the lithium silicon anode and iron disulfide cathode, we are able to quantify the transport mechanisms and physical properties of the electrodes including permeability and tortuosity. Due to the micron to submicron scale porous structure of the initially dry anode, a fast capillary pressure driven flow is observed into the anode from which we are able to set a lower bound on the permeability of 10-1 mDarcy. The transport into the cathode is diffusion-limited because the cathode originally contained some electrolyte before activation. Using a transient one-dimensional diffusion model, we estimate the tortuosity of the cathode electrode to be 2.8 ± 0.8.

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A study was performed to validate a first-principles model for whisker and hillock formation based on the cyclic dynamic recrystallization (DRX) mechanism in conjunction with long-range diffusion. The test specimens were evaporated Sn films on Si having thicknesses of 0.25 μm, 0.50 μm, 1.0 μm, 2.0 μm, and 4.9 μm. Air annealing was performed at 35°C, 60°C, 100°C, 120°C, or 150°C over a time duration of 9 days. The stresses, anelastic strains, and strain rates in the Sn films were predicted by a computational model based upon the constitutive properties of 95.5Sn-3.9Ag-0.6Cu (wt.%) as a surrogate for pure Sn. The cyclic DRX mechanism and, in particular, whether long whiskers or hillocks were formed, was validated by comparing the empirical data against the three hierarchal requirements: (1) DRX to occur at all: εc = A Do mZn, (2) DRX to be cyclic: Do < 2Dr, and (3) Grain boundary pinning (thin films): h versus d. Continuous DRX took place in the 2.0-μm and 4.9-μm films that resulted in short stubby whiskers. Depleted zones, which resulted solely from a tensile stress-driven diffusion mechanism, confirmed the pervasiveness of long-range diffusion so that it did not control whisker or hillock formation other than a small loss of activity by reduced thermal activation at lower temperatures. A first-principles DRX model paves the way to develop like mitigation strategies against long whisker growth.

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Tin (Sn) whiskers are conductive Sn filaments that grow from Sn-plated surfaces, such as surface finishes on electronic packages. The phenomenon of Sn whiskering has become a concern in recent years due to requirements for lead (Pb)-free soldering and surface finishes in commercial electronics. Pure Sn finishes are more prone to whisker growth than their Sn-Pb counterparts and high profile failures due to whisker formation (causing short circuits) in space applications have been documented. At Sandia, Sn whiskers are of interest due to increased use of Pb-free commercial off-the-shelf (COTS) parts and possible future requirements for Pb-free solders and surface finishes in high-reliability microelectronics. Lead-free solders and surface finishes are currently being used or considered for several Sandia applications. Despite the long history of Sn whisker research and the recently renewed interest in this topic, a comprehensive understanding of whisker growth remains elusive. This report describes recent research on characterization of Sn whiskers with the aim of understanding the underlying whisker growth mechanism(s). The report is divided into four sections and an Appendix. In Section 1, the Sn plating process is summarized. Specifically, the Sn plating parameters that were successful in producing samples with whiskers will be reviewed. In Section 2, the scanning electron microscopy (SEM) of Sn whiskers and time-lapse SEM studies of whisker growth will be discussed. This discussion includes the characterization of straight as well as kinked whiskers. In Section 3, a detailed discussion is given of SEM/EBSD (electron backscatter diffraction) techniques developed to determine the crystallography of Sn whiskers. In Section 4, these SEM/EBSD methods are employed to determine the crystallography of Sn whiskers, with a statistically significant number of whiskers analyzed. This is the largest study of Sn whisker crystallography ever reported. This section includes a review of previous literature on Sn whisker crystallography. The overall texture of the Sn films was also analyzed by EBSD. Finally, a short Appendix is included at the end of this report, in which the X-Ray diffraction (XRD) results are discussed and compared to the EBSD analyses of the overall textures of the Sn films. Sections 2, 3, and 4 have been or will be submitted as stand-alone papers in peer-reviewed technical journals. A bibliography of recent Sandia Sn whisker publications and presentations is included at the end of the report.

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The Proton-21 Laboratory in the Ukraine has been publishing results on shock-induced transmutation of several elements, including Cobalt 60 into non-radioactive elements. This report documents exploratory characterization of a shock-compressed Aluminum-6061 sample, which is the only available surrogate for the high-purity copper samples in the Proton-21 experiments. The goal was to determine Sandia's ability to detect possible shock-wave-induced transmutation products and to unambiguously validate or invalidate the claims in collaboration with the Proton-21 Laboratory. We have developed a suitable characterization process and tested it on the surrogate sample. Using trace elemental analysis capabilities, we found elevated and localized concentrations of impurity elements like the Ukrainians report. All our results, however, are consistent with the ejection of impurities that were not in solution in our alloy or were deposited from the cathode during irradiation or possibly storage. Based on the detection capabilities demonstrated and additional techniques available, we are positioned to test samples from Proton-21 if funded to do so.

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A method to measure interfacial mechanical properties at high temperatures and in a controlled atmosphere has been developed to study anodized aluminum surface coatings at temperatures where the interior aluminum alloy is molten. This is the first time that the coating strength has been studied under these conditions. We have investigated the effects of ambient atmosphere, temperature, and surface finish on coating strength for samples of aluminum alloy 7075. Surprisingly, the effective Young's modulus or strength of the coating when tested in air was twice as high as when samples were tested in an inert nitrogen or argon atmosphere. Additionally, the effective Young's modulus of the anodized coating increased with temperature in an air atmosphere but was independent of temperature in an inert atmosphere. The effect of surface finish was also examined. Sandblasting the surface prior to anodization was found to increase the strength of the anodized coating with the greatest enhancement noted for a nitrogen atmosphere. Machining marks were not found to significantly affect the strength.

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The stainless steel alloy 17-4PH contains a martensitic microstructure and second phase delta ({delta}) ferrite. Strengthening of 17-4PH is attributed to Cu-rich precipitates produced during age hardening treatments at 900-1150 F (H900-H1150). For wrought 17-4PH, the effects of heat treatment and microstructure on mechanical properties are well-documented [for example, Ref. 1]. Fewer studies are available on cast 17-4PH, although it has been a popular casting alloy for high strength applications where moderate corrosion resistance is needed. Microstructural features and defects particular to castings may have adverse effects on properties, especially when the alloy is heat treated to high strength. The objective of this work was to outline the effects of microstructural features specific to castings, such as shrinkage/solidification porosity, on the mechanical behavior of investment cast 17-4PH. Besides heat treatment effects, the results of metallography and SEM studies showed that the largest effect on mechanical properties is from shrinkage/solidification porosity. Figure 1a shows stress-strain curves obtained from samples machined from castings in the H925 condition. The strength levels were fairly similar but the ductility varied significantly. Figure 1b shows an example of porosity on a fracture surface from a room-temperature, quasi-static tensile test. The rounded features represent the surfaces of dendrites which did not fuse or only partially fused together during solidification. Some evidence of local areas of fracture is found on some dendrite surfaces. The shrinkage pores are due to inadequate backfilling of liquid metal and simultaneous solidification shrinkage during casting. A summary of percent elongation results is displayed in Figure 2a. It was found that higher amounts of porosity generally result in lower ductility. Note that the porosity content was measured on the fracture surfaces. The results are qualitatively similar to those found by Gokhale et al. and Surappa et al. in cast A356 Al and by Gokhale et al. for a cast Mg alloys. The quantitative fractography and metallography work by Gokhale et al. illustrated the strong preference for fracture in regions of porosity in cast material. That is, the fracture process is not correlated to the average microstructure in the material but is related to the extremes in microstructure (local regions of high void content). In the present study, image analysis on random cross-sections of several heats indicated an overall porosity content of 0.03%. In contrast, the area % porosity was as high as 16% when measured on fracture surfaces of tensile specimens using stereology techniques. The results confirm that the fracture properties of cast 17-4PH cannot be predicted based on the overall 'average' porosity content in the castings.

Low temperature, Sn-based Pb-free solders were developed by making alloy additions to the starting material, 96.5Sn-3.5Ag (mass%). The melting behavior was determined using Differential Scanning Calorimetry (DSC). The solder microstructure was evaluated by optical microscopy and electron probe microanalysis (EPMA). Shear strength measurements, hardness tests, intermetallic compound (IMC) layer growth measurements, and solderability tests were performed on selected alloys. Three promising ternary alloy compositions and respective solidus temperatures were: 91.84Sn-3.33Ag-4.83Bi, 212 C; 87.5Sn-7.5Au-5.0Bi, 200 C; and 86.4Sn-5.1 Ag-8.5Au, 205 C. A quaternary alloy had the composition 86.8Sn-3.2Ag-5.0Bi-5.0Au and solidus temperature of 194 C The shear strength of this quaternary alloy was nearly twice that of the eutectic Sn-Pb solder. The 66Sn-5.0Ag-10Bi-5.0Au-101n-4.0Cu alloy had a solidus temperature of 178 C and good solderability on Cu. The lowest solidus temperature of 159 C was realized with the alloy 62Sn-5.0Ag-10Bi-4.0Au-101n-4.0Cu-5.0Ga. The contributing factor towards the melting point depression was the composition of the solid solution, Sn-based matrix phase of each solder.