Publications

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A complementary metal oxide semiconductor (CMOS) compatible fabrication method for creating three-dimensional (3D) meta-films is presented. In contrast to metasurfaces, meta-films possess structural variation throughout the thickness of the film and can possess a sub-wavelength scale structure in all three dimensions. Here we use this approach to create 2D arrays of cubic silicon nitride unit cells with plasmonic inclusions of elliptical metallic disks in horizontal and vertical orientations with lateral array-dimensions on the order of millimeters. Fourier transform infrared (FTIR) spectroscopy is used to measure the infrared transmission of meta-films with either horizontally or vertically oriented ellipses with varying eccentricity. Shape effects due to the ellipse eccentricity, as well as localized surface plasmon resonance (LSPR) effects due to the effective plasmonic wavelength are observed in the scattering response. The structures were modeled using rigorous coupled wave analysis (RCWA), finite difference time domain (Lumerical), and frequency domain finite element (COMSOL). The silicon nitride support structure possesses a complex in-plane photonic crystal slab band structure due to the periodicity of the unit cells. We show that adjustments to the physical dimensions of the ellipses can be used to control the coupling to this band structure. The horizontally oriented ellipses show narrow, distinct plasmonic resonances while the vertically oriented ellipses possess broader resonances, with lower overall transmission amplitude for a given ellipse geometry. We attribute this difference in resonance behavior to retardation effects. The ability to couple photonic slab modes with plasmonic inclusions enables a richer space of optical functionality for design of metamaterial-inspired optical components.

State of the art grating fabrication currently limits the maximum source energy that can be used in lab based x-ray phase contrast imaging (XPCI) systems. In order to move to higher source energies, and image high density materials or image through encapsulating barriers, new grating fabrication methods are needed. In this work we have analyzed a new modality for grating fabrication that involves precision alignment of etched gratings on both sides of a substrate, effectively doubling the thickness of the grating. We have achieved a front-to-backside feature alignment accuracy of 0.5 µm demonstrating a methodology that can be applied to any grating fabrication approach extending the attainable aspect ratios allowing higher energy lab based XPCI systems.

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The manufacturing tolerances of a stencil-lithography variant, membrane projection lithography, were investigated. In the first part of this work, electron beam lithography was used to create stencils with a range of linewidths. These patterns were transferred into the stencil membrane and used to pattern metallic lines on vertical silicon faces. Only the largest lines, with a nominal width of 84 nm, were resolved, resulting in 45 ± 10 nm (average ± standard deviation) as deposited with 135-nm spacing. Although written in the e-beam write software file as 84-nm in width, the lines exhibited linewidth bias. This can largely be attributed to nonvertical sidewalls inherent to dry etching techniques that cause proportionally larger impact with decreasing feature size. The line edge roughness can be significantly attributed to the grain structure of the aluminum nitride stencil membrane. In the second part of this work, the spatial uniformity of optically defined (as opposed to e-beam written) metamaterial structures over large areas was assessed. A Fourier transform infrared spectrometer microscope was used to collect the reflection spectra of samples with optically defined vertical split ring from 25 spatially resolved 300 × 300 μm regions in a 1-cm2 area. The technique is shown to provide a qualitative measure of the uniformity of the inclusions.

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A unique, micro-scale architecture is proposed to create a novel hybrid concentrated photovoltaic system. Micro-scale (sub-millimeter wide), multi-junction cells are attached to a large-area silicon cell backplane (several inches wide) that can optimally collect both direct and diffuse light. By using multi- junction III-V cells, we can get the highest possible efficiency of the direct light input. In addition, by collecting the diffuse light in the large-area silicon cell, we can produce power on cloudy days when the concentrating cells would have minimal output. Through the use of micro-scale cells and lenses, the overall assembly will provide higher efficiency than conventional concentrators and flat plates, while keeping the form factor of a flat plate module. This report describes the hybrid concept, the design of a prototype, including the PV cells and optics, and the experimental results.

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A method for patterning on vertical silicon surfaces in high aspect ratio silicon topography is presented. A Faraday cage is used to direct energetic reactive ions obliquely through a patterned suspended membrane positioned over the topography. The technique is capable of forming high-fidelity pattern (100 nm) features, adding an additional fabrication capability to standard top-down fabrication approaches.

Emerging nano-photonic and nano-opto-mechanical applications benefit from fabrication of complex three-dimensional structures. Creation of micrometer scale and sub-micrometer scale structures can be performed either additively, or subtractively. Additive techniques, where material is deposited, such as direct laser write, interferometric lithography, nano-origami and colloidal self-assembly have been used to create a wide array of complex sub-micrometer structures. Example of subtractive fabrication of three-dimensional structures, where material is removed, are less common.

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Microsystems Enabled Photovoltaics (MEPV) is a relatively new field that uses microsystems tools and manufacturing techniques familiar to the semiconductor industry to produce microscale photovoltaic cells. The miniaturization of these PV cells creates new possibilities in system designs that can be used to reduce costs, enhance functionality, improve reliability, or some combination of all three. In this article, we introduce analytical tools and techniques to estimate the costs associated with a hybrid concentrating photovoltaic system that uses multi-junction microscale photovoltaic cells and miniaturized concentrating optics for harnessing direct sunlight, and an active c-Si substrate for collecting diffuse sunlight. The overall model comprises components representing costs and profit margin associated with the PV cells, concentrating optics, balance of systems, installation, and operation. This article concludes with an analysis of the component costs with particular emphasis on the microscale PV cell costs and the associated tradeoffs between cost and performance for the hybrid CPV design.

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Microsystems-enabled photovoltaics (MEPV) has great potential to meet the increasing demands for light-weight, photovoltaic solutions with high power density and efficiency. This paper describes effective failure analysis techniques to localize and characterize nonfunctional or underperforming MEPV cells. The defect localization methods such as electroluminescence under forward and reverse bias, as well as optical beam induced current using wavelengths above and below the device band gap, are presented. The current results also show that the MEPV has good resilience against degradation caused by reverse bias stresses. © 2013 IEEE.

After years in the field, many materials suffer degradation, off-gassing, and chemical changes causing build-up of measurable chemical atmospheres. Stand-alone embedded chemical sensors are typically limited in specificity, require electrical lines, and/or calibration drift makes data reliability questionable. Along with size, these "Achilles' heels" have prevented incorporation of gas sensing into sealed, hazardous locations which would highly benefit from in-situ analysis. We report on development of an all-optical, mid-IR, fiber-optic based MEMS Photoacoustic Spectroscopy solution to address these limitations. Concurrent modeling and computational simulation are used to guide hardware design and implementation.

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Microsystems-enabled photovoltaic (MEPV) technology is a promising approach to lower the cost of solar energy to competitive levels. This paper describes current development efforts to leverage existing silicon integrated circuit (IC) failure analysis (FA) techniques to study MEPV devices. Various FA techniques such as light emission microscopy and laser-based fault localization were used to identify and characterize primary failure modes after fabrication and packaging. The FA results provide crucial information used in provide corrective actions and improve existing MEPV fabrication techniques. © 2013 IEEE.

Microsystems-enabled photovoltaic (MEPV) technology is a promising approach to lower the cost of solar energy to competitive levels. This paper describes current development efforts to leverage existing silicon integrated circuit (IC) failure analysis (FA) techniques to study MEPV devices. Various FA techniques such as light emission microscopy and laser-based fault localization were used to identify and characterize primary failure modes after fabrication and packaging. The FA results provide crucial information used in provide corrective actions and improve existing MEPV fabrication techniques. © 2013 IEEE.

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Back-contacted, ultrathin (<10 μm), and submillimeter-sized solar cells made with microsystem tools are a new type of cell that has not been optimized for performance. The literature reports efficiencies up to 15% using thicknesses of 14 μm and cell sizes of 250 μm. In this paper, we present the design, conditions, and fabrication parameters necessary to optimize these devices. The optimization was performed using commercial simulation tools from the microsystems arena. A systematic variation of the different parameters that influence the performance of the cell was accomplished. The researched parameters were resistance, Shockley-Read-Hall (SRH) lifetime, contact separation, implant characteristics (size, dosage, energy, and ratio between the species), contact size, substrate thickness, surface recombination, and light concentration. The performance of the cell was measured with efficiency, open-circuit voltage, and short-circuit current. Among all the parameters investigated, surface recombination and SRH lifetime proved to be the most important. Through completing the simulations, an optimized concept solar cell design was introduced for two scenarios: high and low quality materials/passivation. Simulated efficiencies up to 23.4% (1 sun) and 26.7% (100 suns) were attained for 20-μm-thick devices. Copyright © 2012 John Wiley & Sons, Ltd. Back-contacted, ultrathin (<10 μm), and submillimeter-sized solar cells made with microsystem tools are a new type of cell that has not been optimized for performance. In this paper, we present the design conditions and fabrication parameters necessary to optimize these devices via simulations. Through completing the simulations, an optimized concept solar cell design was introduced for two scenarios: high and low quality materials/passivation. Simulated efficiencies up to 23.4% (1 sun) and 26.7% (100 suns) were attained for 20-μm-thick devices. Copyright © 2012 John Wiley & Sons, Ltd.

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We present ultra-thin single crystal mini-modules built with specific power of 450 W/kg capable of voltages of >1000 V/cm2. These modules are also ultra-flexible with tight bending radii down to 1 mm. The module is composed of hundreds of back contact microcells with thicknesses of approximately 20 μm and diameters between 500-720 μm. The cells are interconnected to a flexible circuit through solder contacts. We studied the characteristics of several mini-modules through optical inspection, evaluation of quantum efficiency, measurement of current-voltage curves, and temperature dependence. Major efficiency losses are caused by missing cells or non-interconnected cells. Secondarily, damage incurred during separation of 500 μm cells from the substrate caused material detachment. The detachment induced higher recombination and low performance. Modules made with the larger cells (720 μm) performed better due to having no missing cells, no material detachment and optimized AR coatings. The conversion efficiency of the best mini module was 13.75% with a total Voc = 7.9 V. © 2013 IEEE.

We present ultra-thin single crystal mini-modules built with specific power of 450 W/kg capable of voltages of >1000 V/cm2. These modules are also ultra-flexible with tight bending radii down to 1 mm. The module is composed of hundreds of back contact microcells with thicknesses of approximately 20 μm and diameters between 500-720 μm. The cells are interconnected to a flexible circuit through solder contacts. We studied the characteristics of several mini-modules through optical inspection, evaluation of quantum efficiency, measurement of current-voltage curves, and temperature dependence. Major efficiency losses are caused by missing cells or non-interconnected cells. Secondarily, damage incurred during separation of 500 μm cells from the substrate caused material detachment. The detachment induced higher recombination and low performance. Modules made with the larger cells (720 μm) performed better due to having no missing cells, no material detachment and optimized AR coatings. The conversion efficiency of the best mini module was 13.75% with a total Voc = 7.9 V. © 2013 IEEE.

Microsystem technologies have the potential to significantly improve the performance, reduce the cost, and extend the capabilities of solar power systems. These benefits are possible due to a number of significant beneficial scaling effects within solar cells, modules, and systems that are manifested as the size of solar cells decrease to the sub-millimeter range. To exploit these benefits, we are using advanced fabrication techniques to create solar cells from a variety of compound semiconductors and silicon that have lateral dimensions of 250 - 1000 μm and are 1 - 20 μm thick. These fabrication techniques come out of relatively mature microsystem technologies such as integrated circuits (IC) and microelectromechanical systems (MEMS) which provide added supply chain and scale-up benefits compared to even incumbent PV technologies. © The Electrochemical Society.

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