Exploration of a data-enhanced calibration certificate as part of a complete measurement information infrastructure
Abstract not provided.
Abstract not provided.
IEEE Transactions on Instrumentation and Measurement
Advanced thin-film processing and packaging technologies are employed in the fabrication of new planar thin-film multijunction thermal converters (MJTCs). The processing, packaging, and design features build on experience gained from prior NIST demonstrations of thin-film converters and are optimized for improved sensitivity, bandwidth, manufacturability, and reliability.
New standards for ac current and voltage measurements, thin-film multifunction thermal converters (MJTCS), have been fabricated using thin-film and micro-electro-mechanical systems (MEMS) technology. Improved sensitivity and accuracy over single-junction thermoelements and targeted performance will allow new measurement approaches in traditionally troublesome areas such as the low frequency and high current regimes. A review is presented of new microfabrication techniques and packaging methods that have resulted from a collaborative effort at Sandia National Laboratories and the National Institute of Standards and Technology (MHZ).