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Self Assembly–Assisted Additive Manufacturing: Direct Ink Write 3D Printing of Epoxy–Amine Thermosets

Macromolecular Materials and Engineering

Manning, Kylie M.; Wyatt, Nicholas B.; Hughes, Lindsey G.; Cook, Adam W.; Giron, Nicholas H.; Martinez, Estevan J.; Campbell, Christopher C.; Celina, Mathias C.

The use of self-assembling, pre-polymer materials in 3D printing is rare, due to difficulties of facilitating printing with low molecular weight species and preserving their reactivity and/or functions on the macroscale. Akin to 3D printing of small molecules, examples of extrusion-based printing of pre-polymer thermosets are uncommon, arising from their limited rheological tuneability and slow reactions kinetics. The direct ink write (DIW) 3D printing of a two-part resin, Epon 828 and Jeffamine D230, using a self-assembly approach is reported. Through the addition of self-assembling, ureidopyrimidinone-modified Jeffamine D230 and nanoclay filler, suitable viscoelastic properties are obtained, enabling 3D printing of the epoxy–amine pre-polymer resin. A significant increase in viscosity is observed, with an infinite shear rate viscosity of approximately two orders of magnitude higher than control resins, in addition to, an increase in yield strength and thixotropic behavior. Printing of simple geometries is demonstrated with parts showing excellent interlayer adhesion, unachievable using control resins.

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TYPE Journal Article YEAR 2019
ScopusOSTIDOI

Stress Relaxation in Epoxy Thermosets via a Ferrocene-Based Amine Curing Agent

Macromolecules

Jones, Brad H.; Wheeler, David R.; Black, Hayden T.; Stavig, Mark E.; Sawyer, P.S.; Giron, Nicholas H.; Celina, Mathias C.; Lambert, Timothy N.; Alam, Todd M.

Physical stress relaxation in rubbery, thermoset polymers is limited by cross-links, which impede segmental motion and restrict relaxation to network defects, such as chain ends. In parallel, the cure shrinkage associated with thermoset polymerizations leads to the development of internal residual stress that cannot be effectively relaxed. Recent strategies have reduced or eliminated such cure stress in thermoset polymers largely by exploiting chemical relaxation processes, wherein temporary cross-links or otherwise transient bonds are incorporated into the polymer network. Here, we explore an alternative approach, wherein physical relaxation is enhanced by the incorporation of organometallic sandwich moieties into the backbone of the polymer network. A standard epoxy resin is cured with a diamine derivative of ferrocene and compared to conventional diamine curing agents. The ferrocene-based thermoset is clearly distinguished from the conventional materials by reduced cure stress with increasing cure temperature as well as unique stress relaxation behavior above its glass transition in the fully cured state. The relaxation experiments exhibit features characteristic of a physical relaxation process. Furthermore, the cure stress is observed to vanish precipitously upon deliberate introduction of network defects through an increasing imbalance of epoxy and amine functional groups. We postulate that these beneficial properties arise from fluxional motion of the cyclopentadienyl ligands on the polymer backbone.

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TYPE Journal Article YEAR 2017
ScopusOSTIDOI

Cure mechanisms of diglycidyl ether of bisphenol A (DGEBA) epoxy with diethanolamine

Polymer

McCoy, John D.; Ancipink, Windy B.; Clarkson, Caitlyn M.; Kropka, Jamie M.; Celina, Mathias C.; Giron, Nicholas H.; Hailesilassie, Lebelo; Fredj, Narjes

When diethanolamine (DEA) is used as a curative for a DGEBA epoxy, a rapid “adduct-forming” reaction of epoxide with the secondary amine of DEA is followed by a slow “gelation” reaction of epoxide with hydroxyl and with other epoxide. Through an extensive review of previous investigations of simpler, but chemically similar, reactions, it is deduced that at low temperature the DGEBA/DEA gelation reaction is “activated” (shows a pronounced induction time, similar to autocatalytic behavior) by the tertiary amine in the adduct. At high temperature, the activated nature of the reaction disappears. The impact of this mechanism change on the kinetics of the gelation reaction, as resolved with differential scanning calorimetry, infrared spectroscopy, and isothermal microcalorimetry, is presented. It is shown that the kinetic characteristics of the gelation-reaction of the DGEBA/DEA system are similar to other tertiary-amine activated epoxy reactions and consistent with the anionic polymerization model previously proposed for this class of materials. Principle results are the time-temperature-transformation diagram, the effective activation energy, and the upper stability temperature of the zwitterion initiator of the activated gelation reaction. It is established that the rate of epoxide consumption cannot be generically represented as a function only of temperature and degree of epoxy conversion. The complex chemistry active in the material requires specific consideration of the dilute intermediates in the reaction sequence in order to define a model of the reaction kinetics applicable to all time-temperature cure histories.

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TYPE Conference Poster YEAR 2016
ScopusOSTI
Results 1–25 of 45
Results 1–25 of 45