Publications
Variables Impacting Feature Definition of Polyimide Using a Syringe Based Printing
Reworkable Power Module for Low Thermal Resistance
Application of InfraRed Thermography Techniques to Quantify Grain-Scale Damage Initiation and Growth in Applied and Residual Stress Fields
Reversible Electrical Bonding For Large Area Device Verification
Design of Robust On-Chip Drain Modulators for Monolithic Pulsed Power Amplifiers
Proposed for publication in IEEE Wireless Components Letters.
Robust On-Chip Drain Modulation for High-Voltage High-Speed Pulsed Power Amplifiers
IEEE Wireless Components Letters
Optical Deformation Chamber using Digital Image Correlation
High Performance and Reliability Microelectronics Packaging
9 Results