Bulk 14-nm FinFET technology was irradiated in a heavy-ion environment (42-MeV Si ions) to study the possibility of displacement damage (DD) in scaled technology devices, resulting in drive current degradation with increased cumulative fluence. These devices were also exposed to an electron beam, proton beam, and cobalt-60 source (gamma radiation) to further elucidate the physics of the device response. Annealing measurements show minimal to no 'rebound' in the ON-state current back to its initial high value; however, the OFF-state current 'rebound' was significant for gamma radiation environments. Low-temperature experiments of the heavy-ion-irradiated devices reveal increased defect concentration as the result for mobility degradation with increased fluence. Furthermore, the subthreshold slope (SS) temperature dependence uncovers a possible mechanism of increased defect bulk traps contributing to tunneling at low temperatures. Simulation work in Silvaco technology computer-aided design (TCAD) suggests that the increased OFF-state current is a total ionizing dose (TID) effect due to oxide traps in the shallow trench isolation (STI). The significant SS elongation and ON-state current degradation could only be produced when bulk traps in the channel were added. Heavy-ion irradiation on bulk 14-nm FinFETs was found to be a combination of TID and DD effects.
King, Michael P.; Ryder, Kaitlyn L.; Ryder, Landen D.; Sternberg, Andrew S.; Kozub, John K.; Zhang, Enxia Z.; Khachatrian, Ani K.; Buchner, Steven P.; McMorrow, Dale M.; Hales, Joel M.; Zhao, Yuanfu Z.; Wang, Liang W.; Wang, Chuanmin W.; Weller, Robert W.; Schrimpf, Ronald D.; Weiss, Sharon M.; Reed, Robert R.; Black, Dolores A.
A sensitive volume is developed using pulsed laser-induced collected charge for two bias conditions in an epitaxial silicon diode. These sensitive volumes show good agreement with experimental two photon absorption laser-induced collected charge at a variety of focal positions and pulse energies. When compared to ion-induced collected charge, the laser-based sensitive volume over predicts the experimental collected charge at low bias and agrees at high bias. Here, a sensitive volume based on ion-induced collected charge adequately describes the ion experimental results at both biases. Differences in the amount of potential modulation explain the differences between the ion-and laser-based sensitive volumes at the lower bias. Truncation of potential modulation by the highly doped substrate at the higher bias results in similar sensitive volumes.
Ryder, Kaitlyn L.; Ryder, Landen D.; Sternberg, Andrew S.; Kozub, John K.; Zhang, Enxia Z.; Khachatrian, Ani K.; Buchner, Steven P.; McMorrow, Dale M.; Hales, Joel M.; Zhao, Yuanfu Z.; Wang, Liang W.; Wang, Chuanmin W.; Weller, Robert W.; Schrimpf, Ronald D.; Weiss, Sharon M.; Reed, Robert R.; Black, Dolores B.; King, Michael P.
This study examines the single-event response of Xilinx 16nm FinFET UltraScale+ FPGA and MPSoC device families. Heavy-ion single-event latch-up, single-event upsets in configuration SRAM, BlockRAM™ memories, and flip-flops, and neutron-induced single-event latch-up results are provided.
A system is presented that is capable of measuring subnanosecond reverse recovery times of diodes in wide-bandgap materials over a wide range of forward biases (0 - 1 A) and reverse voltages (0 - 10 kV). The system utilizes the step recovery technique and comprises a cable pulser based on a silicon (Si) Photoconductive Semiconductor Switch (PCSS) triggered with an Ultrashort Pulse Laser, a pulse charging circuit, a diode biasing circuit, and resistive and capacitive voltage monitors. The PCSS-based cable pulser transmits a 130 ps rise time pulse down a transmission line to a capacitively coupled diode, which acts as the terminating element of the transmission line. The temporal nature of the pulse reflected by the diode provides the reverse recovery characteristics of the diode, measured with a high bandwidth capacitive probe integrated into the cable pulser. This system was used to measure the reverse recovery times (including the creation and charging of the depletion region) for two Avogy gallium nitride diodes; the initial reverse recovery time was found to be 4 ns and varied minimally over reverse biases of 50-100 V and forward current of 1-100 mA.