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The study of local overheating and plasma formation on stainless steel z-pinch targets

Hatch, Maren W.; Awe, Thomas J.; Hutsel, Brian T.; Yu, Edmund Y.; Jauregui, Luis J.; Barrick, Erin J.; Gilmore, Mark A.

Plasma formation from intensely ohmically heated conductors is known to be highly non-uniform, as local overheating can be driven by micron-scale imperfections. Detailed understanding of plasma formation is required to predict the performance of magnetically driven physics targets and magnetically-insulated transmission lines (MITLs). Previous LDRD-supported work (projects 178661 and 200269) developed the electrothermal instability (ETI) platform, on the Mykonos facility, to gather high-resolution images of the self-emission from the non-uniform ohmic heating of z-pinch rods. Experiments studying highly inhomogeneous alloyed aluminum captured complex heating topography. To enable detailed comparison with magnetohydrodynamic (MHD) simulation, 99.999% pure aluminum rods in a z-pinch configuration were diamond-turned to ~10nm surface roughness and then further machined to include well-characterized micron-scale "engineered" defects (ED) on the rod's surface (T.J. Awe, et al., Phys. Plasmas 28, 072104 (2021)). In this project, the engineered defect hardware and diagnostic platform were used to study ETI evolution and non-uniform plasma formation from stainless steel targets. The experimental objective was to clearly determine what, if any, role manufacturing, preparation, or alloy differences have in encouraging nonuniform heating and plasma formation from high-current density stainless steel. Data may identify improvements that may be implemented in the fabrication/preparation of electrodes used on the Z machine. Preliminary data shows that difference in manufacturer has no observed effect on ETI evolution, stainless alloy 304L heated more uniformly than alloy 310 at similar current densities, and that stainless steel undergoes the same evolutionary ETI stages as ultra-pure aluminum, with increased emission tied to areas of elevated surface roughness.

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Investigating Volumetric Inclusions of Semiconductor Materials to Improve Flashover Resistance in Dielectrics

Steiner, Adam M.; Siefert, Christopher S.; Shipley, Gabriel A.; Redline, Erica M.; Dickens, Sara D.; Jaramillo, Rex J.; Chavez, Tom C.; Hutsel, Brian T.; Frye-Mason, Gregory C.; Peterson, Kyle J.; Bell, Kate S.; Balogun, Shuaib A.; Losego, Mark D.; Sammeth, Torin M.; Kern, Ian J.; Harjes, Cameron D.; Gilmore, Mark A.; Lehr, Jane M.

Abstract not provided.

7 Results
7 Results