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Modeling pore corrosion in normally open gold- plated copper connectors

Moffat, Harry K.; Sun, Amy C.; Enos, David E.; Serna, Lysle M.; Sorensen, Neil R.; Battaile, Corbett C.

The goal of this study is to model the electrical response of gold plated copper electrical contacts exposed to a mixed flowing gas stream consisting of air containing 10 ppb H{sub 2}S at 30 C and a relative humidity of 70%. This environment accelerates the attack normally observed in a light industrial environment (essentially a simplified version of the Battelle Class 2 environment). Corrosion rates were quantified by measuring the corrosion site density, size distribution, and the macroscopic electrical resistance of the aged surface as a function of exposure time. A pore corrosion numerical model was used to predict both the growth of copper sulfide corrosion product which blooms through defects in the gold layer and the resulting electrical contact resistance of the aged surface. Assumptions about the distribution of defects in the noble metal plating and the mechanism for how corrosion blooms affect electrical contact resistance were needed to complete the numerical model. Comparisons are made to the experimentally observed number density of corrosion sites, the size distribution of corrosion product blooms, and the cumulative probability distribution of the electrical contact resistance. Experimentally, the bloom site density increases as a function of time, whereas the bloom size distribution remains relatively independent of time. These two effects are included in the numerical model by adding a corrosion initiation probability proportional to the surface area along with a probability for bloom-growth extinction proportional to the corrosion product bloom volume. The cumulative probability distribution of electrical resistance becomes skewed as exposure time increases. While the electrical contact resistance increases as a function of time for a fraction of the bloom population, the median value remains relatively unchanged. In order to model this behavior, the resistance calculated for large blooms has been weighted more heavily.

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TYPE SAND Report YEAR 2008
OSTIDOI

The pitting behavior of structural electrodeposits used in MEMS applications

Serna, Lysle M.

LIGA is an acronym for the German terms Lithographie, Galvanoformung, Abformung, which describe a microfabrication process for high aspect ratio, structural parts based on electrodeposition of a metal into a poly-methyl-methacrylate (PMMA) mold. LIGA produced parts have very high dimensional tolerances (on the order of a micron) and can vary in size from microns to centimeters. These properties make LIGA parts ideal for incorporation into MEMS devices or for other applications where strict tolerances must be met; however, functionality of the parts can only be maintained if they remain dimensionally stable throughout their lifetime. It follows that any form of corrosion attack (e.g., uniform dissolution, localized pitting, environmental cracking, etc.) cannot be tolerated. This presentation focuses on the pitting behavior of Ni electrodeposits, specifically addressing the influence of the following: grain structure, alloy composition, impurities, plating conditions, post plating processing (including chemical and thermal treatment), galvanic interactions and environment (aqueous vs. atmospheric). A small subset of these results is summarized. A typical LIGA part is shown in Figure 1. Due to the small size scale, electrochemical testing was performed using a capillary based test system. Although very small test areas can be probed with this system (e.g., Figure 2), typically capillaries on the order of 80 to 90 ?m's were used in the testing. All LIGA parts tested in the as-received condition had better pitting resistance than the high purity wrought Ni material used as a control. In the case of LIGA-Ni and LIGA-Ni-Mn, no detrimental effects were observed due to aging at 700C. Ni-S (approximately 500 ppm S), showed good as-received pitting behavior but decreased pitting resistance with thermal aging. Aged Ni-S showed dramatic increases in grain size (from single {micro}m's to 100's of {micro}m's), and significant segregation of S to the boundaries. The capillary test cell was used to measure pitting potentials at the boundaries and within grains (Figure 3) with the results clearly showing the lowered pit resistance being due to the S-rich boundaries. It is believed that the process used to release the LIGA parts from the Cu substrate acts as a pickling agent for the LIGA parts, resulting in removal of surface impurities and detrimental alloying additions. EIS data from freshly polished samples exposed to the release bath support this hypothesis; RP values for all LIGA materials and for wrought Ni, continuously increase during exposure. Mechanical polishing of LIGA parts prior to electrochemical testing consistently resulted in lowering the pitting potentials to a range bounded by Ni 201 and high purity Ni. The as-received vs. polished behavior also effects the galvanic interactions with noble metals. When as-produced material is coupled to Au, initially the LIGA material acts as the cathode, though eventually the behavior switches such that the LIGA becomes the anode. Overall, the LIGA produced Ni and Ni alloys examined in this work demonstrated pitting behavior similar to wrought Ni, only showing reduced resistance when specific metallurgical and environmental conditions were met.

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TYPE Conference YEAR 2004
OSTI
15 Results
15 Results