The electrodeposition of rhenium on to a metal seed layer on flexible substrates is presented as a means to creating superconducting flexible cable connectors in an enabling plug-and-play approach for quantum computing. Cryogenic quantum electronics are currently connected using masses of stainless-steel coaxial cables that are bulky, rigid - both in form and design - and lead to significant joule heating, thermal noise, and cross talk. Here, we present an unprecedented approach to integrate an aerosol jet printed (AJP) metal seed layer with rhenium electrodeposition on a flexible substrate in the advancement of superconducting interconnect technologies. Silver and gold were printed using the ‘Nanojet’ aerosol jet printer on Kapton films. Adhesion of gold was found to be far superior to that of silver and adhesion on roughened Kapton surpassed that of its smooth counterpart. Electrodeposition of rhenium was successful on both silver and gold and an amorphous Re film was confirmed by XRD. Results for both materials are presented however due to the poor adhesion of silver to Kapton it was ruled out as a viable candidate. Composite materials were characterized by profilometry, EDS, XRD and FIBSEM. Electrical measurements of the composite at ambient temperature showed a critical temperature (Tc), where the resistance drops to 0, of 5.8 K, well above 4.2 K, the temperature of liquid helium. Stress-strain tests of the Ag-Re and Au-Re composites on roughened and smooth Kapton were completed. Cyclic flexure testing (200 cycles) to 1.25% strain showed smooth Kapton samples reach a stress of ~16 MPa, while Kapton roughened with sandpaper, reaches ~20MPa of stress for the same 1.25% strain.
Aerosol Jet Printing (AJP) is one technique of additive manufacturing used in the printing of electronics components. AJP enables the patterning of features at the ∼10 μm-100 μm scale based on hardware and print parameters. Optimization of print conditions enables the printing of high-resolution features with linewidths approaching 10 μm. The aerosol jet printing of electronic parts can be limited by the conductivities which are achievable by Ag nanoparticle inks (typically 15%-25% of bulk Ag). For certain electronics applications, the increased conductivity produces unacceptable loses during operation and methods are needed to increase the conductance of the devices without sacrificing resolution. Here, we report on the AJP of inductor spirals conductor traces of linewidth 50 μm separated by 55 μm gaps. The conductivity of these features is enhanced by electrodeposition of Cu onto the Ag, resulting in a decrease in resistance of 35-45x. Impedance measurements demonstrate that the addition of Cu by electrodeposition to a 27-turn spiral inductor resulted in an inductance of 3.6 μH. Finally, we demonstrate the use of a lift-off process to produce free-standing, flexible, conductive films using AJP.
Stereolithography (SL) is a process that uses photosensitive polymer solutions to create 3D parts in a layer by layer approach. Sandia National Labs is interested in using SL for the printing of ceramic loaded resins, namely alumina, that we are formulating here at the labs. One of the most important aspects for SL printing of ceramics is the properties of the slurry itself. The work presented here will focus on the use of a novel commercially available low viscosity resin provided by Colorado Photopolymer Solutions, CPS 2030, and a Hypermer KD1 dispersant from Croda. Two types of a commercially available alumina powder, Almatis A16 SG and Almatis A15 SG, are compared to determine the effects that the size and the distribution of the powder have on the loading of the solution using rheology. The choice of a low viscosity resin allows for a high particle loading, which is necessary for the printing of high density parts using a commercial SL printer. The Krieger-Dougherty equation was used to evaluate the maximum particle loading for the system. This study found that a bimodal distribution of micron sized powder (A15 SG) reduced the shear thickening effects caused by hydroclusters, and allows for the highest alumina powder loading. A final sintered density of 90% of the theoretical density of alumina was achieved based on the optimized formulation and printing conditions.
Additive manufacturing of ceramic materials is an attractive technique for rapid prototyping of components at small scales and low cost. We have investigated the printing of alumina pastes loaded at 70-81.5 wt% solids in a UV curable resin. These can be deposited by extrusion from a syringe head on a Hyrel System 30M printer. The print head is equipped with an array of UV LEDs, which solidify the paste without the need for any applied heating. Parameters optimized include print speed, layer height, applied force, and deposition rate. Using A15 alumina and submicron A16 powder precursors, we can achieve bulk densities of 91% and 96% of theoretical density respectively. The influence of dispersants and surfactants added to the powder on the rheology of the pastes, the print process parameters, and the quality of the final components are also investigated.
Additive manufacturing of mixed potential electrochemical sensors opens the possibility to perform rapid prototyping of electrode and electrolyte materials. We report for the first time the use of this technique for the fabrication of solid-state electrochemical gas sensors of the mixed potential type and assessment of variability in the manufacturing process. La0.87Sr0.13CrO3 (LSCO) and Pt electrodes bridged with a porous yttria-stabilized zirconia (YSZ) have been deposited on YSZ substrates by direct-write extrusion of pastes and inks. The sensors are evaluated for their sensitivity to 200 ppm of NOx, C3H8, and NH3. There is a need to understand how variations in intrinsic materials parameters during manufacturing such as differences in porosity affect the gas sensing of additively manufactured sensors to guide optimization of their performance and serve as quality control techniques. Further characterizations of these devices include electrochemical impedance spectroscopy and an aqueous electrochemical assessment of the electrode surface area and diffusion through the porous layer. We find a correlation of increased sensitivity with larger gas reaction impedance, higher Pt electrode surface area, and slower diffusion.