In order to predict material failure accurately, it is critical to have knowledge of deformation physics. Uniquely challenging is determination of the conversion coefficient of plastic work into thermal energy. Here, we examine the heat transfer problem associated with the experimental determination of β in copper and stainless steel. A numerical model of the tensile test sample is used to estimate temperature rises across the mechanical test sample at a variety of convection coefficients, as well as to estimate heat losses to the chamber by conduction and convection. This analysis is performed for stainless steel and copper at multiple environmental conditions. These results are used to examine the relative importance of convection and conduction as heat transfer pathways. The model is additionally used to perform sensitivity analysis on the parameters that will ultimately determine b. These results underscore the importance of accurate determination of convection coefficients and will be used to inform future design of samples and experiments. Finally, an estimation of convection coefficient for an example mechanical test chamber is detailed as a point of reference for the modeling results.
Physical property measurements including viscosity, density, thermal conductivity, and heat capacity of low-molecular weight polydimethylsiloxane (PDMS) fluids were measured over a wide temperature range (-50°C to 150°C when possible). Properties of blends of 1 cSt and 20 cSt PDMS fluids were also investigated. Uncertainties in the measurements are cited. These measurements will provide greater fidelity predictions of environmental sensing device behavior in hot and cold environments.
This report summarizes a project in which the authors sought to develop and deploy: (i) experimental techniques to elucidate the complex, multiscale nature of thermal transport in particle-based materials; and (ii) modeling approaches to address current challenges in predicting performance variability of materials (e.g., identifying and characterizing physical- chemical processes and their couplings across multiple length and time scales, modeling information transfer between scales, and statically and dynamically resolving material structure and its evolution during manufacturing and device performance). Experimentally, several capabilities were successfully advanced. As discussed in Chapter 2 a flash diffusivity capability for measuring homogeneous thermal conductivity of pyrotechnic powders (and beyond) was advanced; leading to enhanced characterization of pyrotechnic materials and properties impacting component development. Chapter 4 describes success for the first time, although preliminary, in resolving thermal fields at speeds and spatial scales relevant to energetic components. Chapter 7 summarizes the first ever (as far as the authors know) application of TDTR to actual pyrotechnic materials. This is the first attempt to actually characterize these materials at the interfacial scale. On the modeling side, new capabilities in image processing of experimental microstructures and direct numerical simulation on complicated structures were advanced (see Chapters 3 and 5). In addition, modeling work described in Chapter 8 led to improved prediction of interface thermal conductance from first principles calculations. Toward the second point, for a model system of packed particles, significant headway was made in implementing numerical algorithms and collecting data to justify the approach in terms of highlighting the phenomena at play and pointing the way forward in developing and informing the kind of modeling approach originally envisioned (see Chapter 6). In both cases much more remains to be accomplished.
Thermal analysts address a wide variety of applications requiring the simulation of radiation heat transfer phenomena. The re are gaps in the currently available modeling capabilities. Addressing these gaps w ould allow for the consideration of additional physics and increase confidence in simulation predictions. This document outlines a five year plan to address the current and future needs of the analyst community with regards to modeling radiation heat tran sfer processes. This plan represents a significant multi - year effort that must be supported on an ongoing basis.
ASME 2012 Heat Transfer Summer Conf. Collocated with the ASME 2012 Fluids Engineering Div. Summer Meeting and the ASME 2012 10th Int. Conf. on Nanochannels, Microchannels and Minichannels, HT 2012