Publications

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Packaging high power radio frequency integrated circuits (RFICs) in low temperature cofired ceramic (LTCC) presents many challenges. Within the constraints of LTCC fabrication, the design must provide the usual electrical isolation and interconnections required to package the IC, with additional consideration given to RF isolation and thermal management. While iterative design and prototyping is an option for developing RFIC packaging, it would be expensive and most likely unsuccessful due to the complexity of the problem. To facilitate and optimize package design, thermal and mechanical simulations were used to understand and control the critical parameters in LTCC package design. The models were validated through comparisons to experimental results. This paper summarizes an experimentally-validated modeling approach to RFIC package design, and presents some results and key findings. © (2011) Trans Tech Publications, Switzerland.

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Microsystems packaging involves physically placing and electrically interconnecting a microelectronic device in a package that protects it from and interfaces it with the outside world. When the device requires a hermetic or controlled microenvironment, it is typically sealed within a cavity in the package. Sealing involves placing and attaching a lid, typically by welding, brazing, or soldering. Materials selection (e.g., the epoxy die attach), and process control (e.g., the epoxy curing temperature and time) are critical for reproducible and reliable microsystems packaging. This paper will review some hermetic and controlled microenvironment packaging at Sandia Labs, and will discuss materials, processes, and equipment used to package environmentally sensitive microelectronics (e.g., MEMS and sensors).

Microsystems packaging involves physically placing and electrically interconnecting a microelectronic device in a package that protects it from and interfaces it with the outside world. When the device requires a hermetic or controlled microenvironment, it is typically sealed within a cavity in the package. Sealing involves placing and attaching a lid, typically by welding, brazing, or soldering. Materials selection (e.g., the epoxy die attach), and process control (e.g., the epoxy curing temperature and time) are critical for reproducible and reliable microsystems packaging. This paper will review some hermetic and controlled microenvironment packaging at Sandia Labs, and will discuss materials, processes, and equipment used to package environmentally sensitive microelectronics (e.g., MEMS and sensors).

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Understanding and predicting sintering, which have been goals since the first attempts to mathematically describe the sintering process in the 1950s, are necessary to eliminate machining after sintering and to reliably predict and control the sintered microstructure and the resultant mechanical and other desired properties. In this study, four different sintering models are evaluated relative to one another and the experimental data, revealing their attributes, deficiencies, and modifications/improvements in order to facilitate their application, including the following: (i) a microstructure-based model for solid state sintering, mainly developed by Riedel and Svoboda (RS); (ii) a viscous sintering (SOVS) model developed by Skorohod and advanced by Olevsky; (iii) a Kinetic Monte Carlo (KMC) model provided by Tikare; and (iv) the master sintering curve (MSC) approach introduced by Johnson et al. For different reasons, all four models have deficiencies that preclude achieving the most challenging goal of being able to comprehensively understand and predict sintering behavior: (i) the RS and the KMC models are complicated and difficult to use; (ii) the SOVS model cannot predict microstructure evolution; and (iii) the KMC model and the MSC have no stresses in their mathematical description, so they cannot simulate the effects of external forces. Each model also has attributes: (i) the KMC model allows one to follow the evolution of mesostructure; (ii) the MSC concept and the RS model are suitable for predicting densification curves for a wide variety of temperature-time profiles; and (iii) the SOVS and the RS models, which are implemented into finite element codes, can be used to predict density gradients and the warping of complex shape parts. Individually and together, the MSC, KMC, SOVS, and RS models can be useful tools to advance the fundamental understanding and improve the control of sintering. © 2009 The American Ceramic Society.

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An interdisciplinary team of scientists and engineers having broad expertise in materials processing and properties, materials characterization, and computational mechanics was assembled to develop science-based modeling/simulation technology to design and reproducibly manufacture high performance and reliable, complex microelectronics and microsystems. The team's efforts focused on defining and developing a science-based infrastructure to enable predictive compaction, sintering, stress, and thermomechanical modeling in ''real systems'', including: (1) developing techniques to and determining materials properties and constitutive behavior required for modeling; (2) developing new, improved/updated models and modeling capabilities, (3) ensuring that models are representative of the physical phenomena being simulated; and (4) assessing existing modeling capabilities to identify advances necessary to facilitate the practical application of Sandia's predictive modeling technology.

This paper discusses the design and use of low-temperature (850 C to 950 C) co-fired ceramic (LTCC) planar magnetic flyback transformers for applications that require conversion of a low voltage to high voltage (> 100V) with significant volumetric constraints. Measured performance and modeling results for multiple designs showed that the LTCC flyback transformer design and construction imposes serious limitations on the achievable coupling and significantly impacts the transformer performance and output voltage. This paper discusses the impact of various design factors that can provide improved performance by increasing transformer coupling and output voltage. The experiments performed on prototype units demonstrated LTCC transformer designs capable of greater than 2 kV output. Finally, the work investigated the effect of the LTCC microstructure on transformer insulation. Although this paper focuses on generating voltages in the kV range, the experimental characterization and discussion presented in this work applies to designs requiring lower voltage.

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The ease and ability to predict sintering shrinkage and densification with the Skorohod-Olevsky viscous sintering (SOVS) model within a finite-element (FE) code have been improved with the use of an Arrhenius-type viscosity function. The need for a better viscosity function was identified by evaluating SOVS model predictions made using a previously published polynomial viscosity function. Predictions made using the original, polynomial viscosity function do not accurately reflect experimentally observed sintering behavior. To more easily and better predict sintering behavior using FE simulations, a thermally activated viscosity function based on creep theory was used with the SOVS model. In comparison with the polynomial viscosity function, SOVS model predictions made using the Arrhenius-type viscosity function are more representative of experimentally observed viscosity and sintering behavior. Additionally, the effects of changes in heating rate on densification can easily be predicted with the Arrhenius-type viscosity function. Another attribute of the Arrhenius-type viscosity function is that it provides the potential to link different sintering models. For example, the apparent activation energy, Q, for densification used in the construction of the master sintering curve for a low-temperature cofire ceramic dielectric has been used as the apparent activation energy for material flow in the Arrhenius-type viscosity function to predict heating rate-dependent sintering behavior using the SOVS model.

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The ability to predict and control organic decomposition of a material under arbitrary thermal treatments is one of the main objectives of thermogravimetric studies. The development of this ability provides significant potential to ensure reliability and reproducibility for a given processing method and can be used in planning optimized thermal treatment strategies. Based on this report, the master sintering curve theory has been successfully extended to similar kinetically controlled phenomena. The theory has been applied to organic decomposition reaction kinetics to develop a master organic decomposition curve. The fundamental kinetics are assumed to be governed by an Arrhenius-type reaction rate, making master sintering and decomposition curves analogous to one another. The formulation and construction of a master decomposition curve are given in this paper. Simultaneous thermogravimetric and differential thermal analysis of a low-temperature co-fire glass/ceramic dielectric tape (Dupont 951 Green Tape™) is analyzed and used to demonstrate this new concept. The results reveal two independent organic decomposition reactions, the first occurring at ≈ 245° C and the second at ≈ 365°C. The analysis is used to produce a master decomposition curve and to calculate the activation energy for these reactions, at 86±6 and 142 ± 4 kJ/mol, respectively. In addition, the weight loss of product and the rate of decomposition can be predicted under varying thermal paths (time-temperature trajectories) following a minimal set of preliminary experiments. © 2005 The American Ceramic Society.

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Low temperature co-fire ceramic (LTCC) materials technology offers a cost-effective and versatile approach to design and manufacture high performance and reliable advanced microelectronic packages (e.g., for wireless communications). A critical issue in manufacturing LTCC microelectronics is the need to precisely and reproducibly control shrinkage on sintering. Master Sintering Curve (MSC) theory has been evaluated and successfully applied as a tool to predict and control LTCC sintering. Dilatometer sintering experiments were designed and completed to characterize the anisotropic sintering behavior of green LTCC materials formed by tape casting. The resultant master sintering curve generated from these data provides a means to predict density as a function of sintering time and temperature. The application of MSC theory to DuPont 951 Green Tape™ will be demonstrated.

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Software has been developed and extended to allow finite element (FE) modeling of ceramic powder compaction using a cap-plasticity constitutive model. The underlying, general-purpose FE software can be used to model even the most complex three-dimensional (3D) geometries envisioned. Additionally, specialized software has been developed within this framework to address a general subclass of axisymmetric compacts that are common in industry. The expertise required to build the input deck, run the FE code, and post-process the results for this subclass of compacts is embedded within the specialized software. The user simply responds to a series of prompts, evaluates the quality of the FE mesh that is generated, and analyzes the graphical results that are produced. The specialized software allows users with little or no FE expertise to benefit from the tremendous power and insight that FE analysis can bring to the design cycle. The more general underlying software provides complete flexibility to model more complicated geometries and processes of interest to ceramic component manufacturers but requires significantly more user interaction and expertise.

In the manufacture of ceramic components, near-net-shape parts are commonly formed by uniaxially pressing granulated powders in rigid dies. Density gradients that are introduced into a powder compact during press-forming often increase the cost of manufacturing, and can degrade the performance and reliability of the finished part. Finite element method (FEM) modeling can be used to predict powder compaction response, and can provide insight into the causes of density gradients in green powder compacts; however, accurate numerical simulations require accurate material properties and realistic constitutive laws. To support an effort to implement an advanced cap plasticity model within the finite element framework to realistically simulate powder compaction, the authors have undertaken a project to directly measure as many of the requisite powder properties for modeling as possible. A soil mechanics approach has been refined and used to measure the pressure dependent properties of ceramic powders up to 68.9 MPa (10,000 psi). Due to the large strains associated with compacting low bulk density ceramic powders, a two-stage process was developed to accurately determine the pressure-density relationship of a ceramic powder in hydrostatic compression, and the properties of that same powder compact under deviatoric loading at the same specific pressures. Using this approach, the seven parameters that are required for application of a modified Drucker-Prager cap plasticity model were determined directly. The details of the experimental techniques used to obtain the modeling parameters and the results for two different granulated alumina powders are presented.