Publications

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Low temperature cofired ceramic (LTCC) technology has proven itself in military/space electronics, wireless communication, microsystems, medical and automotive electronics, and sensors. The use of LTCC for high frequency applications is appealing due to its low losses, design flexibility and packaging and integration capability. The LTCC thick film process is summarized including some unconventional process steps such as feature machining in the unfired state and thin film definition of outer layer conductors. The LTCC thick film process was characterized to optimize process yields by focusing on these factors: 1) Print location, 2) Print thickness, 3) Drying of tapes and panels, 4) Shrinkage upon firing, and 5) Via topography. Statistical methods were used to analyze critical process and product characteristics in the determination towards that optimization goal.

This paper addresses work to minimize voiding and die tilt in solder attachment of a large power die, measuring 9.0 mm X 6.5 mm X 0.1 mm (0.354” x 0.256” x 0.004”), to a heat spreader. As demands for larger high power die continue, minimizing voiding and die tilt is of interest for improved die functionality, yield, manufacturability, and reliability. High-power die generate considerable heat, which is important to dissipate effectively through control of voiding under high thermal load areas of the die while maintaining a consistent bondline (minimizing die tilt). Voiding was measured using acoustic imaging and die tilt was measured using two different optical measurement systems. 80Au-20Sn solder reflow was achieved using a batch vacuum solder system with optimized fixturing. Minimizing die tilt proved to be the more difficult of the two product requirements to meet. Process development variables included tooling, weight and solder preform thickness.

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Low temperature cofired ceramic (LTCC) is established as an excellent packaging technology for high reliability, high density microelectronics. LTCC multichip modules (MCMs) comprising both 'surface mount' and 'chip and wire' technologies provide additional customization for performance. Long term robustness of the packages is impacted by the selection of seal frame and lid materials used to enclose the components inside distinct rooms in LTCC MCMs. An LTCC seal frame and lid combination has been developed that is capable of meeting the sealing and electromagnetic shielding requirements of MCMs. This work analyzes the stress and strain performance of various seal frame and lid materials, sealing materials, and configurations. The application for the MCM will impact selection of the seal frame, lid, and sealing materials based on this analysis.

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Direct Digital Manufacturing techniques such as laser ablation are proposed for the fabrication of lower cost, miniaturized, and lightweight integrated assemblies with high performance requirements. This paper investigates the laser ablation of a Ti/Cu/Pt/Au thin film metal stack on fired low temperature cofired ceramic (LTCC) surfaces using a 355 nm Nd.YAG diode pumped laser ablation system. It further investigates laser ablation applications using unfil ed, or 'green', LTCC materials: (1) through one layer of a laminated stack of unfiled LTCC tape to a buried thick film conductor ground plane, and (2) in unfiled Au thick films. The UV laser power profile and part fixturing were optimized to address defects such as LTCC microcracking, thin film adhesion failures, and redeposition of Cu and Pt. An alternate design approach to minimize ablation time was tested for efficiency in manufacture. Multichip Modules (MCM) were tested for solder ability', solder leach resistance, and wire bondabilify. Scanning election microscopy (SEM) as well as cross sections and microanalytical techniques were used in this study.

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This work utilized advanced engineering in several fields to find solutions to the challenges presented by the integration of MEMS/NEMS with optoelectronics to realize a compact sensor system, comprised of a microfabricated sensor, VCSEL, and photodiode. By utilizing microfabrication techniques in the realization of the MEMS/NEMS component, the VCSEL and the photodiode, the system would be small in size and require less power than a macro-sized component. The work focused on two technologies, accelerometers and microphones, leveraged from other LDRD programs. The first technology was the nano-g accelerometer using a nanophotonic motion detection system (67023). This accelerometer had measured sensitivity of approximately 10 nano-g. The Integrated NEMS and optoelectronics LDRD supported the nano-g accelerometer LDRD by providing advanced designs for the accelerometers, packaging, and a detection scheme to encapsulate the accelerometer, furthering the testing capabilities beyond bench-top tests. A fully packaged and tested die was never realized, but significant packaging issues were addressed and many resolved. The second technology supported by this work was the ultrasensitive directional microphone arrays for military operations in urban terrain and future combat systems (93518). This application utilized a diffraction-based sensing technique with different optical component placement and a different detection scheme from the nano-g accelerometer. The Integrated NEMS LDRD supported the microphone array LDRD by providing custom designs, VCSELs, and measurement techniques to accelerometers that were fabricated from the same operational principles as the microphones, but contain proof masses for acceleration transduction. These devices were packaged at the end of the work.

Acoustic sensing systems are critical elements in detection of sniper events. The microphones developed in this project enable unique sensing systems that benefit significantly from the enhanced sensitivity and extremely compact foot-print. Surface and bulk micromachining technologies developed at Sandia have allowed the design, fabrication and characterization of these unique sensors. We have demonstrated sensitivity that is only available in 1/2 inch to 1 inch studio reference microphones--with our devices that have only 1 to 2mm diameter membranes in a volume less than 1cm{sup 3}.

While existing work in neural interfaces is largely geared toward the restoration of lost function in amputees or victims of neurological injuries, similar technology may also facilitate augmentation of healthy subjects. One example is the potential to learn a new, unnatural sense through a neural interface. The use of neural interfaces in healthy subjects would require an even greater level of safety and convenience than in disabled subjects, including reliable, robust bidirectional implants with highly-portable components outside the skin. We present our progress to date in the development of a bidirectional neural interface system intended for completely untethered use. The system consists of a wireless stimulating and recording peripheral nerve implant powered by a rechargeable battery, and a wearable package that communicates wirelessly both with the implant and with a computer or a network of independent sensor nodes. Once validated, such a system could permit the exploration of increasingly realistic use of neural interfaces both for restoration and for augmentation. © 2007 IEEE.

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Ceramic interconnect technology has been adapted to new structures. In particular, the ability to customize processing order and material choices in Low Temperature Cofired Ceramic (LTCC) has enabled new features to be constructed, which address needs in MEMS packaging as well as other novel structures. Unique shapes in LTCC permit the simplification of complete systems, as in the case of a miniature ion mobility spectrometer (IMS). In this case, a rolled tube has been employed to provide hermetic external contacts to electrodes and structures internal to the tube. Integral windows in LTCC have been fabricated for use in both lids and circuits where either a short term need for observation or a long-term need for functionality exists. These windows are fabricated without adhesive, are fully compatible with LTCC processing, and remain optically clear. Both vented and encapsulated functional volumes have been fabricated using a sacrificial material technique. These hold promise for self-assembly of systems, as well as complex internal structures in cavities, micro fluidic and optical channels, and multilevel integration techniques. Separation of the burnout and firing cycles has permitted custom internal environments to be established. Existing commercial High Temperature Cofired Ceramic (HTCC) and LTCC systems can also be rendered to have improved properties. A rapid prototyping technique for patterned HTCC packages has permitted prototypes to be realized in a few days, and has further applications to micro fluidics, heat pipes, and MEMS, among others. Sandia is a multiprogram laboratory operated by Sandia Corporation, a Lockheed Martin Company, for the United States Department of Energy under contract DE-AC04-94AL85000.

The burgeoning new technology of Micro-Electro-Mechanical Systems (MEMS) shows great promise in the weapons arena. We can now conceive of micro-gyros, micro-surety systems, and micro-navigators that are extremely small and inexpensive. Do we want to use this new technology in critical applications such as nuclear weapons? This question drove us to understand the reliability and failure mechanisms of silicon surface-micromachined MEMS. Development of a testing infrastructure was a crucial step to perform reliability experiments on MEMS devices and will be reported here. In addition, reliability test structures have been designed and characterized. Many experiments were performed to investigate failure modes and specifically those in different environments (humidity, temperature, shock, vibration, and storage). A predictive reliability model for wear of rubbing surfaces in microengines was developed. The root causes of failure for operating and non-operating MEMS are discussed. The major failure mechanism for operating MEMS was wear of the polysilicon rubbing surfaces. Reliability design rules for future MEMS devices are established.

Micro-Electrical Mechanical Systems (MEMS) is an emerging technology with demonstrated potential for a wide range of applications including sensors and actuators for medical, industrial, consumer, military, automotive and instrumentation products. Failure analysis (FA) of MEMS is critically needed for the successful design, fabrication, performance analysis and reliability assurance of this new technology. Many devices have been examined using techniques developed for integrated circuit analysis, including optical inspection, scanning laser microscopy (SLM), scanning electron microscopy (SEM), focused ion beam (FIB) techniques, atomic force microscopy (AFM), infrared (lR) microscopy, light emission (LE) microscopy, acoustic microscopy and acoustic emission analysis. For example, the FIB was used to microsection microengines that developed poor performance characteristics. Subsequent SEM analysis clearly demonstrated the absence of wear on gear, hub, and pin joint bearing surfaces, contrary to expectations. Another example involved the use of infrared microscopy for thermal analysis of operating microengines. Hot spots were located, which did not involve the gear or hub, but indicated contact between comb structures which drive microengines. Voltage contrast imaging proved useful on static and operating MEMS in both the SEM and the FIB and identified electrostatic clamping as a potentially significant contributor to failure mechanisms in microengines. This work describes MEMS devices, FA techniques, failure modes, and examples of FA of MEMS.