A Brief History of Accelerators in Physics
Abstract not provided.
Publications
Sandia and Ion Accelerators
Abstract not provided.
Physics Nuclear Weapons and History
Abstract not provided.
Seminar at AFIT 03/09/2017
Abstract not provided.
Single-Ions for Materials Science
Abstract not provided.
Single Ion Materials Science
Abstract not provided.
Probing Materials Response to Extreme Environments
Abstract not provided.
Sandia's Ion Beam Laboratory
Abstract not provided.
Safety: A (different) perspective on accident causes
Abstract not provided.
The New Ion Beam Lab at Sandia National Laboratories
Abstract not provided.
Displacement damage in Transistor: Using Ions to Simulate Neutrons
Abstract not provided.
Engineered Safety: Sandia's EN Tandem Accelerator
Abstract not provided.
Sandia IBL Overview
Abstract not provided.
Ion Beam Modification of Nanomaterials vis in situ Ion Irradiation TEM
Abstract not provided.
In situ Ion Irradiation TEM at Sandia's IBL
Abstract not provided.
Tunable Dielectric Integration onrf Substrates
Abstract not provided.
Microsystem materials
Abstract not provided.
Thin film fracture toughness estimations of amorphous diamond using acoustic monitoring
Abstract not provided.
Ceramic packaging for MEMS-based microsystems
Ceramic packaging is crucial to the development of MEMS-based microsystems. It is an enabling technology, giving the ability to build complex packages that combine MEMS, electronics, optics, and sensors in a compact volume. In addition, ceramic hermetic packaging has a long history of providing protection to the enclosed devices, even under harsh conditions. These capabilities are being used at Sandia to package complex, MEMS-based microsystems. Looking ahead, ceramic packaging is developing new capabilities important to microsystems, such as the addition of fluidic channels. These developments will make ceramic packaging a viable option for a wide variety of compact, highly integrated microsystems. However, MEMS, particularly surface micromachines, have new reliability concerns that ceramic packaging needs to address. One example is stiction, where small amounts of water can generate surface forces large enough to cause parts to stick together. This demonstrates the need to measure and control the internal environment with greater precision than has been required in the past. Despite these challenges, it is clear that ceramic packaging will be a key technology for complex microsystems in the future.
MEMS packaging efforts at Sandia National Laboratories
Sandia National Laboratories has programs covering a broad range of MEMS technologies from LIGA to bulk to surface micromachining. These MEMS technologies are being considered for an equally broad range of applications, including sensors, actuators, optics, and microfluidics. As these technologies have moved from the research to the prototype product stage, packaging has been required to develop new capabilities to integrated MEMS and other technologies into functional microsystems. This paper discusses several of Sandia's MEMS packaging efforts, focusing mainly on inserting Sandia's SUMMIT V (5-level polysilicon) surface micromachining technology into fieldable microsystems.
20 Results