High Tempeature Capacitor Development
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In this project, ceramic encapsulation materials were studied for high temperature (>~°500 C) applications where typical polymer encapsulants are unstable. A new low temperature (<~°200 C) method of processing ceramics, the cold sintering process was examined. Additionally, commercially available high temperature ceramic cements were investigated. In both cases, the mechanical strengths of available materials are less than desired (i.e., desired strengths similar to Si3N4), limiting applicability. Composite designs to increase mechanical strength are suggested. Additionally, non-uniformities in stresses and densification while embedding alumina sheets in encapsulants via cold sintering using uni-axial pressing led to fracture of sheets, and an alternative iso-static based approach is recommended for future studies.
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