THERMO-MECHANICAL RELIABILITY AND ELECTRICAL PERFORMANCE OF INDIUM INTERCONNECTS AND UNDER BUMP METALLIZATION Leger, Jon-Claude L. Abstract not provided. More Details TYPE Thesis or Dissertation YEAR 2016 OSTI
3D Reversible Interconnect Okoro, Jazmine L.; Lavin, Judith M.; Cook, Adam W.; Keicher, David M.; Leger, Jon-Claude L. Abstract not provided. More Details TYPE Conference Poster YEAR 2015 OSTI
3D Reversible Interconnect Lavin, Judith M.; Cook, Adam W.; Keicher, David M.; Sanchez, Carlos A.; Jensen, Sara E.; Okoro, Jazmine L.; Leger, Jon-Claude L.; Mani, Seethambal S. Abstract not provided. More Details TYPE Conference Poster YEAR 2015 OSTI
Reversible Electrical Bonding For Large Area Device Verification Young, Nathan P.; Sanchez, Carlos A.; Leger, Jon-Claude L.; Bauer, Todd B.; Jensen, Sara E. Abstract not provided. More Details TYPE Conference YEAR 2013 OSTI
Optical Deformation Chamber using Digital Image Correlation Leger, Jon-Claude L.; Young, Nathan P.; Shaner, Eric A. Abstract not provided. More Details TYPE Conference YEAR 2011 OSTI