Publications

5 Results

THERMO-MECHANICAL RELIABILITY AND ELECTRICAL PERFORMANCE OF INDIUM INTERCONNECTS AND UNDER BUMP METALLIZATION

Leger, Jon-Claude L.

Abstract not provided.

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TYPE Thesis or Dissertation YEAR 2016

OSTI

3D Reversible Interconnect

Okoro, Jazmine L.; Lavin, Judith M.; Cook, Adam W.; Keicher, David M.; Leger, Jon-Claude L.

Abstract not provided.

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TYPE Conference Poster YEAR 2015

OSTI

3D Reversible Interconnect

Lavin, Judith M.; Cook, Adam W.; Keicher, David M.; Sanchez, Carlos A.; Jensen, Sara E.; Okoro, Jazmine L.; Leger, Jon-Claude L.; Mani, Seethambal S.

Abstract not provided.

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TYPE Conference Poster YEAR 2015

OSTI

Reversible Electrical Bonding For Large Area Device Verification

Young, Nathan P.; Sanchez, Carlos A.; Leger, Jon-Claude L.; Bauer, Todd B.; Jensen, Sara E.

Abstract not provided.

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TYPE Conference YEAR 2013

OSTI

Optical Deformation Chamber using Digital Image Correlation

Leger, Jon-Claude L.; Young, Nathan P.; Shaner, Eric A.

Abstract not provided.

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TYPE Conference YEAR 2011

OSTI

5 Results

5 Results