Publications

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In microcircuit fabrication, the diameter and length of a bond wire have been shown to both affect the current versus fusing time ratio of a bond wire as well as the gap length of the fused wire. This study investigated the impact of current level on the time-to-open and gap length of 1 mil by 60 mil gold bond wires. During the experiments, constant current was provided for a control set of bond wires for 250ms, 410ms and until the wire fused; non-destructively pull-tested wires for 250ms; and notched wires. The key findings were that as the current increases, the gap length increases and 73% of the bond wires will fuse at 1.8A, and 100% of the wires fuse at 1.9A within 60ms. Due to the limited scope of experiments and limited data analyzed, further investigation is encouraged to confirm these observations.

In this paper, fusing of a metallic conductor is studied by judiciously using the solution of the one-dimensional heat equation, resulting in an approximate method for determining the threshold fusing current. The action is defined as an integration of the square of the wire current over time. The burst action (the action required to completely vaporize the material) for an exploding wire is then used to estimate the typical wire gapping action (involving wire fusing), from which gapping time can be estimated for a gapping current greater than a factor of two over the fusing current. The test data are used to determine the gapped length as a function of gapping current and to show, for a limited range, that the gapped length is inversely proportional to gapping time. The gapping length can be used as a signature of the fault current level in microelectronic circuits.