Carbon MEMS accelerometer
Abstract not provided.
Publications
Carbon MEMS Accelerometer
Abstract not provided.
Multilayer Coextrusion Processing for Micro/Nano-Layered Devices
Abstract not provided.
Joint DoD/DOE Munitions Program (JMP) Five Year Plan FY08-12 Military Use of COTS
Abstract not provided.
Joint Munitions Program Five Year Plan for FY08-12 Military Use of Commercial Electronics
Abstract not provided.
Processes for assuring reliability in the procurement of COTS electronic components
Abstract not provided.
SETEC/Semiconductor Manufacturing Technologies Program: 1999 Annual and Final Report
This report summarizes the results of work conducted by the Semiconductor Manufacturing Technologies Program at Sandia National Laboratories (Sandia) during 1999. This work was performed by one working group: the Semiconductor Equipment Technology Center (SETEC). The group's projects included Numerical/Experimental Characterization of the Growth of Single-Crystal Calcium Fluoride (CaF{sub 2}); The Use of High-Resolution Transmission Electron Microscopy (HRTEM) Imaging for Certifying Critical-Dimension Reference Materials Fabricated with Silicon Micromachining; Assembly Test Chip for Flip Chip on Board; Plasma Mechanism Validation: Modeling and Experimentation; and Model-Based Reduction of Contamination in Gate-Quality Nitride Reactor. During 1999, all projects focused on meeting customer needs in a timely manner and ensuring that projects were aligned with the goals of the National Technology Roadmap for Semiconductors sponsored by the Semiconductor Industry Association and with Sandia's defense mission. This report also provides a short history of the Sandia/SEMATECH relationship and a brief on all projects completed during the seven years of the program.
The transfer of disruptive technologies: Lessions learned from Sandia National Laboratories
Sandia National Laboratories has learned through their process of technology transfer that not all high tech transfers are alike. They are not alike by the nature of the customers involved, the process of becoming involved with these customers and finally and most importantly the very nature of the technology itself. Here they focus on technology transfer in the microsystems arena and specifically the sacrificial surface version of microsystems. They have learned and helped others learn that many MEMS applications are best realized through the use of surface micromachining (SMM). This is because SMM builds on the substantial integrated circuit industry. In this paper they review Sandia's process for transferring a disruptive MEMS technology in numerous cases.
8 Results